新产品与新技术（5）

采用LCP的多层电路板技术实用化瑞士的挠性印制板制造企业Diconecs公司成功使用液晶聚合物(LCP)材料制作多层印制板,并达到实用化。LCP作为印制板基材,适应电子信号高频高速传     

新产品与新技术(50)

改性聚酰亚胺膜直接制作挠性印制板日本荒川化学公司在2010 JPCA Show展出一种有机/无机混成的聚酰亚胺(PI)膜,商品名Pomiran,可以用于半加成法(SAP)和成卷式(R2R)制作细线路挠性印制板(FPC),例如高档的COF。     

LCP在挠性覆铜板中的应用进展

文章介绍了液晶聚合物（LCP）的特点及其在挠性覆铜板（FCCL）中的应用,尤其对日本近期的LCP基FCCL进行了综述,同时对比研究了LCP膜和PI膜制备的FCCL的性能,分析了两者的优缺点。     

新产品与新技术（83）

液晶聚合物膜上纯金印制电路 美国的PCB制造商龙电路（Dragon Circuits）公司宣布他们用液晶聚合物（LCP）膜基材制作100%的纯金线路的印制电路板，用于医疗设备。非常薄的LCP膜（厚25 mm -50 mm），加成法直接镀纯金形成电路，而无需使用铜基金属。此独特的产品是因客户需要所驱动，得到客户积极支持。新产品技术也可推广到用PI、PET或PEEK等其它挠性基材，及其它的金属镀层电路。     

韩国印制板产业现状（下）

上期我们介绍了韩国最大的三家刚性板企业(也是韩国最大的三家印制板企业)和这三家企业在该国刚性板市场上所扮演的角色,本期将介绍该国的挠性板企业。在韩国迅猛发展的手机市场的带动下,韩国的挠性板生产商和该国著名的零件商一起茁壮成长。通过参观KCC、ISU Petasys、Young Poon,我们来了解挠性板将来的市场和应用。韩国的挠性板企业正阔步迈进。10年前,韩国的印制板由大德、三星电机、KCC、LG电子、ISU Petasys五家刚性板企业所统治;后来挠性板生产商改变了局面,使得很多印制板巨头也开始生产挠性板。根据印制板分析家Hayao Naka…     

文献与摘要（91）

印制板向高密度高性能化发展的最新技术动向;低刚性无卤素覆盖膜;低反弹挠性印制板;高性能薄型多层挠性印制板     

挠性印制板设计及其在系统设计中的应用

挠性印制板以其轻、薄和可弯曲等特点得到广泛的应用.与传统的刚性印制板相比,挠性印制板的设计有很多特殊的要求.以多种形式对挠性印制板的设计进行了说明.挠性印制板因其自身的特点,根据其外形及应用的环境,对其进行针对性设计,在系统设计中还能起到独到的作用,发挥出挠性印制板的独特的优势.     

JPCA标准挠性单、双面印刷电路板JPCA-DG02-1997

1.适用范围 本标准规定了主要用于电子机器的挠性单、双面印刷电路板。(以下简称挠性印制板或FPC)。 在本标准所谓挠性印制板是指使用聚酯薄膜或聚酰亚胺薄膜单面或双面覆以铜箔的层压板(包括无粘接剂型)采用减成法     

挠性印制板技术最近发展（1）——材料发展

主要介绍2005年度挠性印制板一些新技术的发展,从挠性印制板的材料、生产技术和产品应用三方面作叙述.     

发展中的高密度挠性电路技术(八)

7.2 其它测试 7.2.1 可燃性 挠性印制板及材料测试的另一方面是UL认证。挠性印制板的UL要求与刚性印制板一起包含在UL746中。但挠性印制板在不断变化。传统的挠性印制板产品仅仅是挠性、刚性及有增强板的挠板,在UL传统的老规范中,对它们作了规定。现在,一些OEM正要求挠板制造商在货运板件之前,进行一定的安装,同时还要提供UL可燃性相关产品。这种混合式终端产品,目前在UL96中还没有广泛地规定其要求。UL796F的出版是为了尽可能地表明近年来处理挠性印制板及材料出现的各种问题。     

Signal integrity characterization of microwave XFP ASIC BGA package realized on low-K liquid crystal polymer (LCP) substrate

With the development of low-K nanometer devices, the need for compatible packaging material is ever increasing. Liquid crystal polymer (LCP) is emerging as a promising material for RF, microwave, and millimeter-wave packaging. Its coefficient of thermal expansion can be matched to that of low-K die to ensure mechanical reliability. This paper, for the first time, characterizes the electrical performance of a wire bonded application-specific integrated circuit (ASIC) ball grid array (BGA) package based on LCP substrate technology for application in 10 Gb/s small form factor pluggable module (XFP) optical communication systems. Specifically, it compares the electrical performance of LCP to that of traditionally used FR4/spl I.bar/epoxy (FR-4) and Polyimide (PI) substrate materials. Findings show that at 10 GHz, insertion loss was decreased as much as 31% and 15% compared to FR-4 and PI, respectively. In particular, mode conversion was decreased by 66% and 42% compared to FR-4 and PI, respectively. Time delay was decreased by 10 and 4 ps compared to FR-4 and PI. No significant differences in power, ground coupling, and simultaneously switching output (SSO) noise at 10 GHz were observed. Based on the package structure used in this study, it was concluded that LCP offers superior electrical performance compared to FR/spl I.bar/4, PI, and is qualified as next generation substrate material for high data rate XFP BGA packaging.     

LCP柔性基板的薄膜电阻制作技术

针对液晶聚合物(LCP)柔性基板高频电子封装应用需求,采用一种薄膜溅射工艺直接在LCP柔性基板上制作TaN薄膜电阻,研究不同等离子体预处理方式对LCP表面形貌和LCP表面薄膜金属膜层附着强度的影响,进一步研究溅射气压和氮气体积分数等参数对电阻性能的影响,考察LCP柔性基板上的TaN薄膜电阻精度及电阻温度系数(TCR),并制备出50Ω的薄膜电阻。结果表明:当射频功率为300 W的氧等离子体预处理600 s时,LCP表面的面粗糙度低,LCP基板表面薄膜金属膜层附着强度高,其值>5.0 N/mm²;当溅射功率为400 W、氮气体积分数为3%、溅射气压为0.2 Pa时,制备的TaN薄膜电阻的阻值精度高,阻值精度≤±4%,TCR电阻稳定性能好。     

Development of chip-on-flex using SBB flip-chip technology

A bare LSI chip mounted onto a flexible substrate is called chip-on-flex (COF). Companies and universities are desperately developing COF. In this paper, the development of COF using stud bump bonding (SBB) flip-chip technology will be introduced.So far, SBB technology has been adopted when ceramic or glass-epoxy is used as a substrate material for chip size packages (CSPs) and multi-chip modules (MCMs). Recently there is a great demand for developing SBB technology toward a flexible substrate.SBB technology needs to keep a flexible substrate flat during the assembly process. A flexible substrate was adhered to a flat carrier using a thermal release sheet in order to keep it flat. Since this thermal release sheet loses its adhesive strength by applying heat beyond 160°C, it is easy to peel off accomplished specimens from the flat carrier after assembling.SBB specimens were prepared using liquid crystal polymer (LCP) and polyimide (PI) as a flexible substrate. Reliability tests, such as pressure cooker test (PCT), thermal shock test (TST) and reflow soldering after moisture storage test, were carried out for these specimens. In PCT, both LCP and PI specimens passed as a result of using proper underfill for each substrate. In TST, both specimens also passed using the underfill selected in PCT. In reflow soldering after moisture storage test, LCP specimens passed, on the other hand PI specimens needed to be baked after moisture storage in order to pass the reflow.     

挠性PCB用基板材料的新发展（5）——FPC用电解铜箔的新成果

主要阐述FPC用挠性覆铜板2003年￣2004年在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。     

挠性PCB用基板材料的新发展（3）——二层型挠性覆铜板的开发新成果

主要阐述2003年~2004年FPC用挠性覆铜板在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。     

挠性PCB用基板材料的新发展（2）——三层型挠性覆铜板的开发新成果

主要阐述2003年￣2004年FPC用挠性覆铜板在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。     

挠性PCB用基板材料的新发展（1）——FCCL发展的综述与特点

该文主要阐述2003年￣2004年间挠性覆铜板在生产厂家及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。     

Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates

Anisotropic conductive adhesive films (ACF) have been widely studied for numerous applications. However, their resistance to corrosion in highly corrosive environments has been studied only very little. This study investigated the reliability and behaviour of ACFs in corrosive salt spray environment. ACF was used to attach flip chip (FC) components on FR4, liquid crystal polymer (LCP) and polyimide (PI) substrates and the FC packages were subjected to a salt spray test lasting 3000 h. The FC packages had daisy chain structures which were measured continuously in real time during testing. After testing cross sections of the tested packages were examined using an optical microscope and a scanning electron microscope (SEM). Most components failed during the test and the results showed significant differences between the various substrate materials. The LCP substrate performed considerably better than the other substrates and the PI substrate proved to have the poorest reliability. Corrosion of the pads on the substrates as well as open joints was seen in all substrate materials. The corrosion behaviour as well as the differences between the substrates showed that the substrate structure and material are critical factors in corrosive environments and should be carefully considered. The reliability of the ACF FC package with the LCP substrate was found to be good, as the test was very severe and no failures occurred during the first 625 h of testing and only 20% failed during the first 1000 h.     

挠性PCB用基板材料的新发展（4）——FPC用压延铜箔的新成果

主要阐述FPC用挠性覆铜板2003年~2004年间在生产厂家方面及在所用材料(包括PI薄膜、铜箔)、新技术、新产品方面的新发展。