负阻异质结晶体管的模拟与实验

采用MBE方法生长了8nm基区的InGaP/GaAs双异质结材料,研制成具有负阻特性的异质结晶体管.在恒压恒流条件下均观察到了负阻特性并对其物理机制进行了讨论.推导出集电极电流Ic与VCE的关系表达式,讨论了负阻与器件结构和参数的关系.使用PSPICE模拟软件建立电路网表模型,代入推导出的IC-VCE公式进行模拟,模拟结果与器件的测量结果十分接近.     

电阻栅结构负阻异质结双极晶体管

设计并研制成功了具有电阻栅结构的n-InGaP/p-GaAs/n-GaAs负阻异质结双极晶体管.研制出的器件I-V特性优于相关文献的报导;得到了恒定电压和恒定电流两种模式的负阻特性曲线;对两种模式负阻特性产生的物理机制进行了解释;最后对此器件的应用前景进行了预测.     

AlGaAs/GaAs超薄基区负阻HBT的研制与模拟

利用化学湿法选择技术和监控电极技术设计并研制了一种新型台面结构超薄基区AlGaAs/GaAs负阻异质结双极晶体管,该器件具有独特且显著的电压控制型负阻特性,其峰谷比可高于120.通过器件模拟分析,解释了该器件产生负阻的原因,即不断增加的集电极电压致使超薄基区穿通,器件由双极管工作状态向体势垒管工作状态转化造成的.另外,模拟结果表明器件可能具有较高频率特性(fT约为60～80GHz).     

AlGaAs/GaAs超薄基区负阻HBT的研制与模拟

利用化学湿法选择技术和监控电极技术设计并研制了一种新型台面结构超薄基区AlGaAs/GaAs负阻异质结双极晶体管,该器件具有独特且显著的电压控制型负阻特性,其峰谷比可高于120.通过器件模拟分析,解释了该器件产生负阻的原因,即不断增加的集电极电压致使超薄基区穿通,器件由双极管工作状态向体势垒管工作状态转化造成的.另外,模拟结果表明器件可能具有较高频率特性(fT约为60～80GHz).     

电阻栅结构负阻异质结双极晶体管

设计并研制成功了具有电阻栅结构的n-InGaP/p-GaAs/n-GaAs负阻异质结双极晶体管．研制出的器件I-V特性优于相关文献的报导；得到了恒定电压和恒定电流两种模式的负阻特性曲线；对两种模式负阻特性产生的物理机制进行了解释；最后对此器件的应用前景进行了预测．     

微波功率SiGe HBT的温度特性

通过研究SiGe异质结双极型晶体管(HBT)的温度特性,发现SiGe HBT的发射结正向电压随温度的变化率小于同质结Si双极型晶体管(BJT).在提高器件或电路热稳定性时,SiGe HBT可以使用比Si BJT更小的镇流电阻.同时SiGe HBT共发射级输出特性曲线在高电压大电流下具有负阻特性,而负阻效应的存在可以有效地抑制器件的热不稳定性效应,从而在温度特性方面证明了SiGe HBT更适合于微波功率器件.     

微波功率SiGe HBT的温度特性

通过研究SiGe异质结双极型晶体管(HBT)的温度特性,发现SiGe HBT的发射结正向电压随温度的变化率小于同质结Si双极型晶体管(BJT).在提高器件或电路热稳定性时,SiGe HBT可以使用比Si BJT更小的镇流电阻.同时SiGe HBT共发射级输出特性曲线在高电压大电流下具有负阻特性,而负阻效应的存在可以有效地抑制器件的热不稳定性效应,从而在温度特性方面证明了SiGe HBT更适合于微波功率器件.     

基于MEMS技术新型硅磁敏三极管负阻-振荡特性

介绍了-种新型硅磁电负阻-振荡器件--S型负阻-振荡硅磁敏三极管.该器件是基于MEMS技术在p型高阻单晶硅片上制作的具有立体结构的新型磁电转换器件,采用KOH各向异性腐蚀技术实现发射区及引线的制作.实验结果表明,集电极电流随外加磁场的变化而变化;在基极注入电流一定时,出现集电极电流受外加偏压VCE调制的负阻-振荡特性,且集电极电流振荡随外加磁场而变化.对该器件负阻-振荡特性的形成机理进行了讨论,结果表明,在集电区n+π结和基区与π区形成的p+π结均处于反偏条件下,当π区满足雪崩倍增效应产生的条件时,该磁敏三极管伏-安特性曲线中的Vp+x偏压相对应的基极注入条件下的集电极电流出现S型负阻-振荡特性.在发射极和基极间的n+π结和p+π结附近存在的大量深能级杂质将对负阻-振荡特性进行调制.     

微波功率SiGe HBT的温度特性

通过研究SiGe异质结双极型晶体管(HBT)的温度特性，发现SiGe HBT的发射结正向电压随温度的变化率小于同质结Si双极型晶体管(BJT). 在提高器件或电路热稳定性时，SiGe HBT可以使用比Si BJT更小的镇流电阻.同时SiGe HBT共发射级输出特性曲线在高电压大电流下具有负阻特性，而负阻效应的存在可以有效地抑制器件的热不稳定性效应，从而在温度特性方面证明了SiGe HBT更适合于微波功率器件.     

光触发GaAs/GaAlAs异质结负阻激光器

采用GaAs/GaAlAs多层液相外延技术研制成一种光触发异质结负阻激光器。文中简述了器件的工作原理和某些特性。     

A novel InP/InAlGaAs negative-differential-resistanceheterojunction bipolar transistor (NDR-HBT) with interestingtopee-shaped current-voltage characteristics

A new and interesting negative-differential-resistance heterojunction bipolar transistor (NDR-HBT) based on the InP/InAlGaAs material system is fabricated successfully and demonstrated. Due to the employment of narrow base and δ-doped sheet at the emitter-base (E-B) heterojunction, the significant and interesting topee-shaped current-voltage (I-V) characteristics are observed in the low current regime. A peak-to-valley current ratio (PVCR) up to 11 in the NDR loci is found. In the higher current regimes, on the other hand, NDR phenomena disappear and the device acts as a normal bipolar transistor. These interesting properties are believed to be attributed mainly to the modulation of potential spike resulting from the specified device structure     

Electrical and optical feedback in an InGaAs/InP light-amplifyingoptical switch (LAOS)

A circuit model for optical and electrical feedback has been developed to investigate the cause of negative differential resistance (NDR) switching in a series connected heterojunction phototransistor (HPT) light-emitting diode (LED) device. The model considers optical feedback from the light generated in the LED, electrical feedback from the holes thermally emitted over the LED cladding layer, nonlinear gain of the HPT, the Early effect, and leakage resistance. The analysis shows that either electrical or optical feedback can be the dominant cause for the NDR, depending upon their relative strengths. The NDR observed in the devices was caused primarily by electrical feedback since the optical feedback is weak. For low input power, avalanche breakdown appears to initiate the NDR in the devices although avalanching alone cannot cause NDR     

Multiple-input logic circuit design using BiCMOS-based negative differential resistance circuits

We first propose an inverter circuit design using the negative differential resistance (NDR) circuit composed of the standard Si-based n-channel metal-oxide-semiconductor field-effect-transistor (NMOS) and SiGe-based heterojunction bipolar transistor (HBT). By suitably designing the MOS width/length parameters, we can obtain the ??-type NDR current?Cvoltage (I?CV) characteristic. Expanding the inverter circuit operation, the two-input and four-input NOR logic gates are demonstrated. Especially, the design and fabrication of the logic circuit is based on the standard SiGe BiCMOS process. Compared to the traditional NDR device like resonant tunneling diode (RTD), our MOS?CHBT?CNDR-based applications are much easier to be combined with some Si-based or SiGe-based devices on the same chip.     

Multiple-route and multiple-state current-voltage characteristicsof an InP/AlInGaAs switch for multiple-valued logic applications

A novel multiple-state switching device based on an InP/AlInGaAs heterojunction bipolar transistor (HBT) structure has been successfully fabricated and demonstrated. The common-emitter current gain up to 25 is obtained under the forward operation mode. However, the anomalous multiple-negative-differential-resistance (MNDR) phenomena controlled either by electrical or optical input signals are observed under the inverted operation mode. The studied device exhibits a single-route S-shaped NDR behavior in the dark and a distinct significant S-shaped MNDR phenomena by introducing an incident light source at room temperature. Moreover, the anomalous multiple-route and multiple-step current-voltage (I-V) characteristics are also observed at 77 K. The switching behaviors are attributed to the avalanche multiplication, barrier lowering effect and potential redistribution process. Experimental results show that the studied device provides a good potentiality for multiple-valued logic and optoelectronic switching system applications     

Novel real-space hot-electron transfer devices

A new class of devices based on hot-electron transfer between two conducting layers is proposed. The essential feature of these devices is a pronounced negative differential resistance (NDR) in the drain circuit, controlled by gate and substrate voltages. This allows a novel type of bistable logic element, which, although being unipolar, is comparable to the CMOS inverter in that a significant current is drawn only during switching. Another possible application is a gate-controlled microwave generator and amplifier. In the present work, the above device concepts are analyzed in the instance of GaAs/ GaAlAs heterojunction realizations.     

Multiple-valued decoder using MOS-HBT-NDR circuit

The design of a four-valued decoder based on the negative-differential- resistance (NDR) circuit is demonstrated. The presented NDR circuit is composed of a Si-based metal-oxide-semiconductor field-effect- transistor (MOS) and a SiGe-based heterojunction bipolar transistor (HBT). The fabrication of the four-valued decoder using this MOS- HBT-NDR circuit is based on the standard 0.35 mum SiGe-based BiCMOS process.     

Novel multiple-selected and multiple-valued memory design using negative differential resistance circuits suitable for standard SiGe-based BiCMOS process

A novel multiple-selected and multiple-valued memory (MSMVM) design using the negative differential resistance (NDR) circuits is demonstrated. The NDR circuits are made of Si-based metal-oxide-semiconductor field-effect-transistor (MOS) and SiGe-based heterojunction bipolar transistor (HBT). During suitably designing the parameters and connecting three MOS–HBT–NDR circuits, we can obtain the three-peak current–voltage (I–V) curves with different peak currents in the combined I–V characteristics. For the traditional resonant-tunneling-diode (RTD) memory circuit, one can only obtain four-valued memory states using a constant current source to bias the three-peak NDR circuit. However in this paper, we utilize two switch-controlled current sources to bias the three-peak NDR circuit at different current levels. By controlling the switches on and off alternatively, we can obtain the four-valued, three-valued, two-valued, and one-valued memory levels under the four different conditions. Our design is based on the standard 0.35 μm SiGe BiCMOS process.     

Design and fabrication of multiple-valued multiplexer using negative differential resistance circuits and standard SiGe process

The design of a four-valued multiplexer using the negative differential resistance (NDR) circuit is demonstrated. The NDR circuit used in this work is made of the Si-based metal–oxide–semiconductor field-effect-transistor (MOS) and the SiGe-based heterojunction bipolar transistor (HBT). However we can obtain the NDR characteristic in its combined I–V curve by suitably arranging the MOS parameters. This novel multiplexer is made of MOS–HBT–NDR-based decoders and inverters. The fabrication is based on the standard 0.35 μm SiGe BiCMOS process.     

An Investigation of Negative Differential Resistance and Novel Collector–Current Kink Effects in SiGe HBTs Operating at Cryogenic Temperatures

In this paper, a new negative-differential-resistance (NDR) effect and a novel collector-current kink effect are investigated in the cryogenically operated SiGe heterojunction bipolar transistors (HBTs). Theory based on an enhanced positive-feedback mechanism associated with heterojunction barrier effect at deep cryogenic temperatures is proposed to explain both the observed NDR and the collector-current kink. The accumulated charge induced by the barrier effect acts at low temperatures to enhance the total collector-current, indirectly producing both phenomena. This theory is confirmed using the calibrated 2-D DESSIS simulations over temperature. These unique cryogenic effects also have significant impact on the ac performance of SiGe HBTs operating at high injection. Technology evolution plays an important role in determining the magnitude of the observed phenomena, and the scaling implications are addressed. In addition, the present NDR effect is also compared with previously reported NDR and hysteresis effects observed in highly scaled SiGe HBTs operating under forced-I_B-base bias. The input drive condition of the transistor during its use in circuits, either under pure forced-current bias or under pure forced-voltage bias, or more practically, somewhere in between, determines the magnitude of the observed NDR and is of potential concern for circuit designers and must be carefully modeled     

Negative differential resistance of AlGaAs/GaAs heterojunctionbipolar transistors: influence of emitter edge current

We report an electrical characterisation of AlGaAs/GaAs heterojunction bipolar transistors over a temperature range of 250 to 400 K in which the emitter edge current contribution to the negative differential output resistance (NDR) effect is determined. A quantitative analysis of the DC gain versus temperature and perimeter to area ratio indicates that emitter edge current has a major influence on the NDR magnitude