PC1D方法对铝背场钝化技术的分析

降低单晶硅原材料成本,采用更薄的硅片作为太阳电池的原料是晶体硅太阳电池产业发展的趋势之一。对薄片化的太阳电池,铝背场的背表面钝化工艺显得愈加重要。采用PC1D太阳电池软件模拟的方法,对以商业用p型硅为衬底的单晶硅125×125太阳电池的铝背场的背表面钝化技术进行了模拟,分析得出,对一定厚度的电池片来说,尤其是当少数载流...     

钝化层和铝电极浆料共烧结制备硅太阳能电池背电极

提出了一种新的硅太阳能电池背场结构及其形成方法,在硅片背面先制备一层氮化硅膜,然后再印刷背面铝电极,通过钝化层和铝电极浆料共烧结制备硅太阳能电池背场结构。在常规铝浆中添加易于同氮化硅反应的高活性玻璃粉,对比了钝化层厚度、玻璃粉种类和含量对氮化硅层的烧蚀效果以及对背电极硅片间接触电阻的影响。当铝浆中高活性玻璃粉添加量为质量分数4%,氮化硅厚度10 nm时,比常规铝浆在无钝化膜的硅片上制备的电池最高效率高出约0.26%。     

PERC结构多晶硅太阳电池的研究

高效、低成本是目前硅太阳电池追求的主要目标。多晶硅太阳电池成本低,但其电性能较差。背面钝化及局部背接触是提高多晶硅太阳电池电性能的主要技术。通过采用SiO2/SiNx叠层膜作为背钝化介质层,依次经过背面开槽、丝网印刷、烧结形成背面局部接触,制备钝化发射极和背表面电池(PERC)结构多晶硅太阳电池。采用恒光源I-V特性测试系统测试其电性能,结果表明:较之常规铝背场多晶硅太阳电池,PERC结构电池在开路电压Voc、短路电流密度Jsc、转换效率η方面分别提高了13 mV、1.8 mA/cm2和0.67%(绝对值),其转换效率达到17.27%。PERC结构多晶硅电池采用了常规丝网印刷工艺,有利于实现高效多晶硅电池的产业化生产,具有很高的实际意义。     

铝背场对单晶硅太阳电池输出特性的影响

利用PCID软件模拟了n~+/p-p~+结构的单晶硅太阳电池铝背场与硅片厚度对其输出特性的影响.结果表明,有铝背场时太阳电池获得明显的开路电压、短路电流以及光电转换效率的增益;硅片厚度越小,铝背场对其输出特性的影响越大;在有铝背场情况下,硅片厚度为120μm时,可获得最大的光电转换效率.

Abstract：

The PC1D was usecl to simulate the influence of Al-BSF and wafer thickness on electrical properties of n~+/p-p~+ structural monocrystalline silicon solar cells. It is found that solar cells with the Al-BSF structure can gain obvious open circuit voltage, short-circuit current, as well as photoelectric conversion efficiency; the smaller the wafer thickness is, the bigger of the effect of Al BSF works on the electrical properties; when the wafer thickness is 120 m, the solar cells can get the biggest photoelectric conversion efficiency.     

硅光单体电源铝背场吸杂对非平衡少子寿命的影响

采用φ100mm厚度400μm、电阻率为0.8～2Ω·cm的p(100)CZ硅片制作硅光单体电源,并对RTP和铝背场烧结工艺进行了研究.实验发现:快速热退火工艺对硅片少子寿命产生一定影响.铝背场烧结和适当的快速热处理促成了硅片界面晶格应力对重金属杂质的吸附作用,并减少了载流子的复合中心,从而提高了光生载流子的扩散长度,提高了非平衡少子寿命.     

硅光单体电源铝背场吸杂对非平衡少子寿命的影响

采用φ100mm厚度400μm、电阻率为0.8～2Ω·cm的p(100)CZ硅片制作硅光单体电源,并对RTP和铝背场烧结工艺进行了研究.实验发现:快速热退火工艺对硅片少子寿命产生一定影响.铝背场烧结和适当的快速热处理促成了硅片界面晶格应力对重金属杂质的吸附作用,并减少了载流子的复合中心,从而提高了光生载流子的扩散长度,提高了非平衡少子寿命.     

高效率n型硅离子注入双面太阳电池

为进一步提升n型硅双面太阳电池的转化效率,采用了磷离子注入技术制备n型硅双面太阳电池的背场.基于离子注入技术准直性和均匀性好的特点,掺杂后硅片的表面复合电流密度降低到了1.4×10-13 A/cm2,隐性开路电压可达670 mV,且分布区间更紧凑.在电阻率为1～3 Ω·cm的n型硅片基底上,采用磷离子注入技术工业化生产的n型硅双面太阳电池的正面平均转化效率达到了20.64％,背面平均转化效率达到了19.52％.内量子效率的分析结果显示,离子注入太阳电池效率的增益主要来自长波段光谱响应的提升.     

硅系太阳电池表面钝化技术比较

通过对硅片的少数载流子有效寿命、硅太阳电池的反射损失和光谱响应这三个方面的研究,比较了目前主要的硅太阳电池表面钝化技术,对这些钝化技术的优缺点进行了分析和评价.从上述三个方面的比较可以看出,RTO/SiNx堆叠钝化技术在提高硅太阳电池性能上是最优的,具有良好的应用前景.     

丝网印刷制备黑硅太阳电池及其性能表征

采用纳米金颗粒催化腐蚀的方法在硅片表面制备得纳米多孔结构,实现了1.5%（300-1200 nm）的权重反射率。本文采用OPCl3扩散、丝网印刷制备前后电极及共烧等常规太阳电池工艺来制备黑硅太阳电池,对不同腐蚀深度及不同扩散方阻的黑硅太阳电池片的输出电性能进行了分析,并对制备工艺进行了优化,提高了电池的转换效率,实现了丝网印刷制备12.17%的黑硅太阳电池转换效率。     

导热金刚石同大尺寸芯片的低温烧结银连接工艺

通过高导热银浆实现了连接大面积(>100 mm²)半导体硅片和金刚石的低温低压烧结技术。通过对金刚石表面镀覆金属薄膜,增强同烧结银界面处固态原子扩散,开发了商用烧结银膏在200℃下低温烧结工艺,得到金刚石-硅的均匀连接界面,计算得到孔隙率约为9.88%,中间烧结银层等效热阻约为1.38×10^-5m²·K/W。     

多晶黑硅表面微结构对电池效率的影响

采用Ag离子辅助化学刻蚀法制备了多晶黑硅薄片,使用NaOH溶液处理多晶黑硅表面,增大其表面纳米孔直径,使SiNx薄膜能够均匀覆盖整个黑硅表面,提高黑硅的钝化效果,进而提高多晶黑硅电池光电转化效率.通过反射谱仪、扫描电子显微镜(SEM)、太阳电池测试系统等测试和表征不同扩孔时间对多晶黑硅各方面性能的影响.结果表明:未被NaOH扩孔处理的多晶黑硅的反射率最低,为5.03％,多晶黑硅太阳电池的光电转化效率为16.51％.当多晶黑硅被NaOH腐蚀40 s时,反射率为10.01％,电池的效率为18.00％,比普通多晶硅太阳电池的效率高2.19％,比未被扩孔处理的多晶黑硅太阳电池的效率高1.49％.     

Gettering by heat thermal processing: application in crystalline silicon solar cells

The aim of this work is to getter unwanted impurities from solar grade crystalline silicon (Si) wafers and then to enhance their electronic properties. This was done by forming a sacrificial porous silicon (PS) layer on both sides of the Si wafers and by performing infrared (IR) thermal annealing treatments (at around 950 °C) in a SiCl₄/N₂ controlled atmosphere. The process allows concentrating unwanted impurities in the PS layer and near the PS/silicon interface. These treatments reduce the resistivity by about two orders of magnitude at a depth of about 40 μm and improve the minority carrier diffusion length from 75 to 210 μm. This gettering method was also tested on silicon wafers where grooved fingers and back contacts were achieved using a chemical vapor etching (CVE) method. Front buried metallic contacts and small holes for local back surface field were then achieved after the gettering stage in order to realize silicon solar cells. It was shown that the photovoltaic parameters of gettered silicon solar cells were improved as regard to ungettered ones.     

掺镓单晶硅太阳电池和组件的光致衰减性能研究

分别使用掺镓和常规掺硼单晶硅片制备了太阳电池与组件,对电池进行了光照和空焊处理,再采用Halm电池电性能测试仪测试了两种单晶硅太阳电池和组件在光照和空焊实验前后的光电性能.实验结果表明,在相同光照条件下,采用掺镓单晶硅片所制太阳电池的光衰率比用掺硼单晶硅片的低0.91％.空焊后的掺镓单晶硅太阳电池各项光电性能参数的一致性没有出现明显变化,这有利于减少太阳电池之间的失配损失.还发现掺镓单晶硅太阳电池组件的CTM(cell to module)值高于掺硼单晶硅太阳电池组件的CTM值.总之,掺镓单晶硅太阳电池能更好地抑制光致衰减效应,并减小串焊工艺对太阳电池光电性能的影响,获得更高的太阳电池组件功率.     

Silicon solar cells based on all‐laser‐transferred contacts

Crystalline silicon solar cells based on all‐laser‐transferred contacts (ALTC) have been fabricated with both front and rear metallization achieved through laser induced forward transferring. Both the front and rear contacts were laser‐transferred from a glass slide coated with a metal layer to the silicon substrate already processed with emitter formation, surface passivation, and antireflection coating. Ohmic contacts were achieved after this laser transferring. The ALTC solar cells were fabricated on chemically textured p‐type Cz silicon wafers. An initial conversion efficiency of over 15% was achieved on a simple cell structure with full‐area emitter. Further improvements are expected with optimized laser transferring conditions, front grid pattern design, and surface passivation. The ALTC process demonstrates the advantage of laser processing in simplifying the solar cell fabrication by a one‐step metal transferring and firing process. Copyright © 2013 John Wiley & Sons, Ltd.     

用于先进 CMOS电路的 150 mm硅外延片外延生长

随着大规模和超大规模集成电路特征尺寸向亚微米、深亚微米发展,下一代集成电路对硅片的表面晶体完整性和电学性能提出了更高的要求.与含有高密度晶体原生缺陷的硅抛光片相比,硅外延片一般能满足这些要求.该文报道了应用于先进集成电路的150mmP/P+CMOS硅外延片研究进展.在PE2061硅外延炉上进行了P/P+硅外延生长.外延片特征参数,如外延层厚度、电阻率均匀性,过渡区宽度及少子产生寿命进行了详细表征.研究表明:150mmP/P+CMOS硅外延片能够满足先进集成电路对材料更高要求,     

Experimental and simulated analysis of front versus all‐back‐contact silicon heterojunction solar cells: effect of interface and doped a‐Si:H layer defects

Front silicon heterojunction and interdigitated all‐back‐contact silicon heterojunction (IBC‐SHJ) solar cells have the potential for high efficiency and low cost because of their good surface passivation, heterojunction contacts, and low temperature fabrication processes. The performance of both heterojunction device structures depends on the interface between the crystalline silicon (c‐Si) and intrinsic amorphous silicon [(i)a‐Si:H] layer, and the defects in doped a‐Si:H emitter or base contact layers. In this paper, effective minority carrier lifetimes of c‐Si using symmetric passivation structures were measured and analyzed using an extended Shockley–Read–Hall formalism to determine the input interface parameters needed for a successful 2D simulation of fabricated baseline solar cells. Subsequently, the performance of front silicon heterojunction and IBC‐SHJ devices was simulated to determine the influence of defects at the (i)a‐Si:H/c‐Si interface and in the doped a‐Si:H layers. For the baseline device parameters, the difference between the two device configurations is caused by the emitter/base contact gap recombination and the back surface geometry of IBC‐SHJ solar cell. This work provides a guide to the optimization of both types of SHJ device performance, predicting an IBC‐SHJ solar cell efficiency of 25% for realistic material parameters. Copyright © 2013 John Wiley & Sons, Ltd.     

20.1%‐efficient crystalline silicon solar cell with amorphous silicon rear‐surface passivation

We have developed a crystalline silicon solar cell with amorphous silicon (a‐Si:H) rear‐surface passivation based on a simple process. The a‐Si:H layer is deposited at 225°C by plasma‐enhanced chemical vapor deposition. An aluminum grid is evaporated onto the a‐Si:H‐passivated rear. The base contacts are formed by COSIMA (contact formation to a‐Si:H passivated wafers by means of annealing) when subsequently depositing the front silicon nitride layer at 325°C. The a‐Si:H underneath the aluminum fingers dissolves completely within the aluminum and an ohmic contact to the base is formed. This contacting scheme results in a very low contact resistance of 3.5 ±0.2 mΩ cm² on low‐resistivity (0.5 Ω cm) p‐type silicon, which is below that obtained for conventional Al/Si contacts. We achieve an independently confirmed energy conversion efficiency of 20.1% under one‐sun standard testing conditions for a 4 cm² large cell. Measurements of the internal quantum efficiency show an improved rear surface passivation compared with reference cells with a silicon nitride rear passivation. Copyright © 2005 John Wiley & Sons, Ltd.     

晶体硅太阳电池的双层结构钝化膜研究

针对目前基于p型硅片制备的单结太阳电池进一步提高表面钝化膜生产效率,利用氮化硅(SiNx)薄膜良好的钝化效果与价格低廉的二氧化钛(TiO2)膜,降低SiNx镀膜厚度减薄对少子寿命的影响。在单晶硅片表面先用PECVD法沉积SiNx薄膜,然后用热喷涂沉积TiO2薄膜。对比测试了热喷涂沉积TiO2薄膜前后电池的性能,结果表明在SiNx膜上增加TiO2膜层后少子寿命明显提高,这可能是TiO2膜结构内存在固定正电荷所致。这种双层结构封装后的太阳电池显示出了较好的光学与电学性能,对进一步改进太阳电池性能具有重要参考价值。