采用0.18 μmCMOS工艺超宽带低噪声放大器的设计

提出了一个采用TSMC 0.18μmCMOS工艺设计的,工作频段为3.1～5.2 GHz的超宽带低噪声放大器.放大器采用了前置带通滤波器的并联负反馈共源共栅结构,并从宽带电路.高频电路器件选择等方面讨论了超宽带低噪声放大器的设计,结果表明,在整个工作频段,电路输入输出匹配S11S22均小于-14 dB,最高增益为15.92 dB,增益波动为1.13 dB,电路工作电压为1.8 V,功耗为27 mW,噪声系数NF为1.84～2.11 dB.     

超宽带CMOS低噪声放大器的设计

设计了一种应用于3.1~5.2 GHz频段超宽带系统接收机的差分低噪声放大器,采用前置切比雪夫(Chebyshev)2阶LC ladder带通滤波器的并联负反馈结构,详细分析了其输入宽带阻抗匹配特性和噪声特性。仿真基于TSMC 0.18μm RF CMOS工艺。结果表明,在全频段,电路功率增益S21为11 dB,增益平坦度小于1 dB,最小噪声系数为3.5 dB,输入输出均良好匹配,在1.8V电源电压下,功耗为14.4 mW。     

3 GHz~5 GHz CMOS超宽带低噪声放大器分析与设计

采用TSMC公司的0.18μm CMOS工艺,设计了一款具有带外抑制功能的超宽带低噪声放大器(UWB LNA),电路基于窄带PCSNIM LNA拓扑结构,并利用二阶切比雪夫滤波器和带外抑制电容代替传统输入匹配网络。电路由1.8 V直流电源供电,功耗约为11.5 mW。仿真结果表明,在3 GHz~5 GHz的超宽带频段内,平均正向增益约为13.9 dB,输入、输出回波损耗S11和S22分别小于-13 dB和-15 dB,最小噪声系数仅为0.997 dB,三阶交调点IIP3均值为5.40 dB。此外,反向隔离度S12和稳定性StabFact1等性能指标也取得了不错的仿真效果。     

一种应用于超宽带系统的宽带LNA的设计

结合切比雪夫滤波器,可以实现宽带输入匹配的特性和片上集成窄带低噪声放大器(LNA)的噪声优化方法。提出一套完整的基于CMOS工艺的宽带LNA的设计流程,并设计了一个应用于超宽带(UWB)系统的3~5 GHz宽带LNA电路。模拟结果验证了设计流程的正确性。该电路采用SMIC 0.18μm CMOS工艺进行模拟仿真。结果表明,该LNA带宽为3~5 GHz,功率增益为5.6 dB,带内增益波动1.2dB,带内噪声系数为3.3~4.3 dB,IIP3为-0.5 dBm;在1.8V电源电压下,主体电路电流消耗只有9 mA,跟随器电流消耗2 mA,可以驱动1.2 pF容性负载。     

一种S波段平衡式限幅低噪声放大器的设计

介绍了一种小型化平衡式限幅低噪声放大器。该放大器采用Lange桥平衡结构,在实现低噪声的同时,保证了小电压驻波比;在3.0～3.5GHz频带内,噪声系数小于1.3dB,输入输出驻波系数小于1.3,增益大于27dB,平坦度±0.6dB以内,输出1dB压缩点大于12dBm。该放大器能够承受最大5W的连续波功率输入,且大功率输入时的驻波系数小于1.3。     

0.18-um CMOS 3.1-10．6GHz超宽带低噪声放大器设计

介绍了一种基于0．18-um CMOS工艺、适用于超宽带无线通信系统接收前端的低噪声放大器。在3．1～10．6GHz的频带范围内对它仿真获得如下结果：最高增益12dB；增益波动小于2dB；输入端口反射系数S11小于-10dB；输出端口反射系数S22小于-15dB；噪声系数NF小于4．6dB。采用1．5V电源供电，功耗为10．5mW。与近期公开发表的超宽带低噪声放大器仿真结果相比较，本电路结构具有工作带宽大、功耗低、输入匹配电路简单的优点。     

双频段低噪声放大器的设计

适应多标准移动通信终端的迅速发展,设计了能够在800 MHz和1.8 GHz两个不同频段独立工作的低噪声放大器.放大器使用噪声性能优良的SiGeHBT管子,采用Cascode结构减小Miller电容的影响,发射极串联电感消除放大器输入端噪声系数和功率匹配的耦合,输入匹配电路采用单通道串并联LC电路,计算串并联电感和电容值,可以在两个工作频点发生谐振.输出端通过调整负载阻抗到50Ω,采用简单的电路实现功率输出.ADS的仿真结果表明,本文设计的低噪声放大器在800MHz和1.8 GHz两个工作频段的S21分别达到了24.3 dB和21.3 dB,S11均达到了-13 dB,S22均在-27dB以下,两个频段的噪声系数分别为3.3 dB和2.0 dB.     

毫米波GaAs单片限幅低噪声放大器

设计了一款毫米波GaAs单片限幅低噪声放大器。限幅器采用两级反向并联二极管结构,通过优化限幅器匹配电路,增大了限幅器的耐功率,降低了限幅电路的插损。低噪声放大器为四级级联设计,输入端采用最小噪声匹配,偏置电路增加RC串联谐振电路,减小了噪声,提高了电路稳定性。测试结果表明,该毫米波GaAs单片限幅低噪声放大器在33～37 GHz频带内,增益达到22 dB,增益平坦为±1 dB,输入驻波小于2,输出驻波小于1.5,噪声小于3.0 dB,输出1 dB增益压缩点(P_(1dB))大于5 dBm,可以承受15 W的脉冲输入功率。     

程控增益低噪声宽带直流放大器的设计

介绍了程控增益低噪声宽带直流放大器的设计原理及流程。采用低噪声增益可程控集成运算放大器AD603和高频三极管2N2219和2N2905等器件设计了程控增益低噪声宽带直流放大器,实现了输入电压有效值小于10mV,输出信号有效值最大可达10V,通频带为0～8MHz,增益可在0～50dB之间5dB的步进进行控制,最高增益达到53dB,且宽带内增益起伏远小于1dB的两级宽带直流低噪声放大器的设计。     

双频段接收机中的BiFET低噪声放大器

设计了一种采用BiFET结构的低噪声放大器（LNA），这种结构通过BiCMOS工艺使低噪声放大电路集合了双极型晶体管的低噪声特性和CMOS晶体管的高线性度。应用优化的BiFET Cascode共源共栅结构能够明显地提高低噪声放大器的性能，并且能应用于两个不同频率。本文设计的低噪声放大器在低偏置电流（1．7mA）和低功耗（5．7mW）的情况下能取得1．69dB的噪声系数、15．96dB的电压增益、一8．5dBm的IIP3和-67dB的反向隔离。设计的BiFET低噪声放大器是采用了AMS0．8μm的BiCMOS混合信号工艺,经过优化可以用于工业、室内的远程无线控制系统包括无线门禁系统。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.