共振隧穿弱光探测器的分子束外延生长条件优化

对一种共振隧穿弱光探测器的分子束外延生长条件进行了研究。对探测器结构进行设计,研究了不同Al束流和不同生长温度下In0.52Al0.48As材料的生长质量,结合X射线衍射及原子力显微镜测试结果确定了In0.52Al0.48As材料的最佳生长条件。研究了不同Ga束流下In0.53Ga0.47As材料的生长质量,并采用一种衬底变温的生长方法解决了恒温生长较厚In0.53Ga0.47As外延层时表面容易出现点状突起的问题,获得了平整的In0.53Ga0.47As外延表面。分别采用恒温和变温的生长方法制备了探测器样品,并对其电流-电压特性及光响应进行了测试,测试结果表明,采用变温生长方法制备的探测器样品具有更高的峰值电流和光响应。     

垂直堆垛InAs量子点的光学性质

垂直堆跺InAs量子点是用分子束外延(MBE),通过Stranski-Krastanov(S-K)方式生长.利用光致发光(PL)实验对InAs量子点进行了表征.在生长过程中使用对形状尺寸控制的方式来提高垂直堆垛InAs量子点形貌均匀性.样品的外延结构是Si掺杂GaAs衬底生长500nm的过渡层,500nm的GaAs外延层,15nm的Al0.5Ga0.5As势垒外延层,5个周期的InAs量子点生长后2单层GaAs的外延结构,50 nh的Al0.5Ga0.5As势垒外延层,最后是15 m的GaAs覆盖层.外延结构中Al0.5Ga0.5As势垒外延层对镶嵌在里面的InAs量子点有很强的量子限制作用产生量子效应.PL测量系统使用514.5 nn的缸离子激发源.发现了量子点基态光致发光峰等距离向红外方向劈裂等新的物理现象.利用光致发光通过改变势垒的宽度和掺杂情况,研究了外延结构的光致发光特性,得到二维电子气(2DEG)随势能变化局域化加强等的新结果.     

In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点的形貌和光学性质

提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点,并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点.实验结果表明,随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm,In0.5Ga0.5As量子点的密度增大、均匀性提高,Al原子扩散和浸润层对量子点PL谱的影响被消除,而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层.由此可见,选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究.     

In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点的形貌和光学性质

提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点，并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点。实验结果表明，随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm，In0.5Ga0.5As量子点的密度增大、均匀性提高, Al原子扩散和浸润层对量子点PL谱的影响被消除，而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层。由此可见，选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究。     

大应变InGaAs/GaAs/AlGaAs微带超晶格中波红外QWIP的MOCVD生长

基于中波红外(峰值响应波长4.5μm)量子阱红外探测器QWIP进行了大应变In0.34Ga0.66As/GaAs/Al0.35Ga0.65As微带超晶格结构的MOCVD外延生长研究。通过对生长温度、生长速率、Ⅴ/Ⅲ比以及界面生长中断时间等生长参数的系统优化,获得了高质量的外延材料。     

隧道结AlGaInP发光二极管

报道了通过隧道结将衬底的导电类型从n型转变到p型,从而可以利用n型GaP作为以n型GaAs为衬底的AlGaInP发光二极管的电流扩展层.n型电流扩展层的电阻率低于p型电流扩展层的电阻率,这种结构改善了电流扩展层的作用,从而提高了发光二极管的光提取效率.对3μm GaP电流扩展层的发光二极管,实验结果表明,隧道结发光二极管的发光功率与具有相同基本结构的传统发光二极管相比,20mA时发光功率提高了50%,100mA时提高了66.7%.     

隧道结AlGaInP发光二极管

报道了通过隧道结将衬底的导电类型从n型转变到p型,从而可以利用n型GaP作为以n型GaAs为衬底的AlGaInP发光二极管的电流扩展层.n型电流扩展层的电阻率低于p型电流扩展层的电阻率,这种结构改善了电流扩展层的作用,从而提高了发光二极管的光提取效率.对3μm GaP电流扩展层的发光二极管,实验结果表明,隧道结发光二极管的发光功率与具有相同基本结构的传统发光二极管相比,20mA时发光功率提高了50%,100mA时提高了66.7%.     

GaAs/Si/AlAs异质结的带阶和GaAs生长温度的影响

用分子束外延 (MBE)设备制备了 Ga As/ Al As和 Ga As/ Si/ Al As异质结 ,通过 XPS分别研究了异质结界面处 Si层厚度为 0 .5 ML 和 1ML 对异质结带阶的调节 ,得到最大调节量为 0 .2 e V;通过 C- V法研究了异质结的Ga As层在不同温度下生长对 0 .5 ML Si夹层的影响 ,得到 Si夹层的空间分布随 Ga As层生长温度的升高而扩散增强的温度效应 ,通过深能级瞬态谱 (DL TS)研究了在上述不同温度下生长的 Ga As层的晶体质量 .     

半导体/超晶格分布布拉格反射镜(DBR)的分子束外延生长

用分子束外延技术 (MBE)生长了以 Ga As/Al As超晶格替代 Alx Ga1 - x As所形成的 P型半导体 /超晶格分布布拉格反射镜 (DBR) .此分布布拉格反射镜的反射谱中心波长为 85 0 nm.由实验表明 ,19个周期的反射镜获得了高达 99%以上的高反射率 .与此同时 ,采取自行设计的二次钨丝掩膜质子注入法制成 15 μm× 15 μm的正方形电流注入区 ,以此测定 P型反射镜的串联电阻 ,克服了湿化学腐蚀法中腐蚀深度不易控制及侧面同时被腐蚀的缺点 ,实验得出此 P型反射镜的串联电阻仅为 5 0 Ω 左右 .在生长过程中 ,发现在只含一个铝源的分子束外延生长系统中 ,生长这种半     

GaAlAs/GaAs单量子阱列阵半导体激光器

分析了影响列阵半导体激光器输出功率的因素。利用分子束外延生长法生长出 Ga Al As/Ga As梯度折射率分别限制单量子阱材料 ( GRIN- SCH- SQW)。利用该材料制作出的列阵半导体激光器输出功率达到 10 W(室温 ,连续 ) ,峰值波长为 80 6～ 80 9nm     

Growth conditions to achieve mobility enhancement in AlxGa1?xAs-GaAs heterojunctions by m.b.e.

Modulation doped Al0.25Ga0.75As-GaAs heterojunctions have been prepared by molecular beam epitaxy (m.b.e.). Al0.25Ga0.75As layers were doped with Si to a level of ~ 3 × 1017 cm?3, whereas the GaAs layers were either unintentionally doped, doped lightly n-type with Sn, or doped lightly p-type with Be. Heterojunction structures having single and multiple periods have shown enhanced mobility only with the AlxGa1?xAs layer at the surface and the GaAs layer underlying. These results represent the first report that electrons spill over only into the underlying GaAs layer from the top AlxGa1?xAs layer.     

AlGaN/GaN/InGaN对称分别限制多量子阱激光器的优化设计

采用一维传递矩阵法模拟计算了AlGaN/GaN/InGaN对称分别限制多量子阱激光器(发射波长为396.6nm)的波导特性.以光限制因子、阈值电流密度和功率效率作为优化参量,获得激光器的优化结构参数为:3周期量子阱In0.02Ga0.98N/In0.15Ga0.85N(10.5nm/3.5nm)作为有源层,90nm In0.1Ga0.9N为波导层,120周期Al0.25Ga0.75N/GaN(2.5nm/2.5nm)为限制层.     

基于HfO2栅介质的Ga2O3 MOSFET器件研制

采用金属有机化学气相沉积(MOCVD)方法在(010) Fe掺杂半绝缘Ga2O3同质衬底上外延得到n型β-Ga2O3薄膜材料,材料结构包括400 nm的非故意掺杂Ga2O3缓冲层和40 nm的Si掺杂Ga2O3沟道层.基于掺杂浓度为2.0×1018 cm-3的n型β-Ga2O3薄膜材料,采用原子层沉积的25 nm的HfO2作为栅下绝缘介质层,研制出Ga2O3金属氧化物半导体场效应晶体管(MOSFET).器件展示出良好的电学特性,在栅偏压为8V时,漏源饱和电流密度达到42 mA/mm,器件的峰值跨导约为3.8 mS/mm,漏源电流开关比达到108.此外,器件的三端关态击穿电压为113 V.采用场板结构并结合n型Ga2O3沟道层结构优化设计能进一步提升器件饱和电流和击穿电压等电学特性.     

Light sensitivity of Al0.25Ga0.75As/GaAs modulation-doped structures grown by molecular beam epitaxy: effect of substrate temperature

The sensitivity of carrier concentration and mobility of Al0.25Ga0.75As/GaAs modulation-doped structures to light exposure has been studied. The light sensitivity of both parameters was found to be strongly dependent on the growth temperature of the Al0.25Ga0.75As which was varied between 580°C and 695°C. A growth temperature of about 610°C was observed to produce the least light sensitivity, while a growth temperature of 660°C resulted in the most sensitivity to light. The corresponding minimum and maximum changes in carrier concentration, measured at 10 K, were 5% and 52% of the dark values, respectively, while changes in mobility were 2% and 40%, respectively. A persistent photoconductivity effect was also observed in the samples. The minimum in this effect was found to be a 1% change in 10 K carrier concentration at a growth temperature of 610°C.     

Optimization of GaAs-based 940 nm infrared light emitting diode with dual-junction design

Epitaxial growths of the GaAs/AlGaAs-based 940 nm infrared light emitting diodes (LEDs) with dual junctions were carried out by using metalorganic chemical vapor deposition (MOCVD) with different doping concentrations and Al contents in AlxGa1-xAs compound. And their optoelectric properties show that the optimal design for tunneling region corresponds to P++ layer with hole concentration up to 1×1020 cm-3, N++ layer electron concentration up to 5×1019 cm-3 and constituent Al0.2Ga0.8As in the tunneling junction region. The optimized dual-junction LED has a forward bias of 2.93 V at an injection current of 50 mA, and its output power is 24.5 mW, which is 104% larger than that of the single junction (12 mW). Furthermore, the optimized device keeps the same spectral characteristics without introducing excessive voltage droop.     

22 nm In0.75Ga0.25As channel-based HEMTs on InP/GaAs substrates for future THz applications

In this work, the performance of L_g=22 nm In_0.75Ga_0.25As channel-based high electron mobility transistor (HEMT) on InP substrate is compared with metamorphic high electron mobility transistor (MHEMT) on GaAs substrate. The devices features heavily doped In_0.6Ga_0.4As source/drain (S/D) regions, Si double δ-doping planar sheets on either side of the In_0.75Ga_0.25As channel layer to enhance the transconductance, and buried Pt metal gate technology for reducing short channel effects. The TCAD simulation results show that the InP HEMT performance is superior to GaAs MHEMT in terms of f_T, f_max and transconductance (g_{m_max}). The 22 nm InP HEMT shows an f_T of 733 GHz and an f_max of 1340 GHz where as in GaAs MHEMT it is 644 GHz and 924 GHz, respectively. InGaAs channel-based HEMTs on InP/GaAs substrates are suitable for future sub-millimeter and millimeter wave applications.     

The influence of interface grading on threshold current density of (near) visible DH(Ga,Al)As lasers

The effect of interface grading around the active layer in DH (Ga, Al) As near-visible lasers (lambda_{L} approx 780nm) has been investigated for Ge and Sn as p- and n-type dopants. The combination of graded transition layers with a rather high Al and Ge concentration gives rise to a high effective interface recombination velocity (S lsim 4000cm/s) due to carrier loss in the highly Ge-doped p-Ga0.55Al0.45As cladding layer. The chemical widthWmin{90}max{10}of the transition layers is determined by SIMS and SAES and found to range between 50 and 2.5 nm. The latter extremely steep interfaces have been grown in a novel LPE growth system. The threshold current density and its temperature sensitivity, in terms of the exponential relationshipJ_{th}(T) = J_{0} exp (T/T_{0})improve significantly with abrupt junctions. From this material 5 μm proton-bombarded stripe lasers with a threshold current of ∼90 mA and aT_{0} = 120K at 780 nm have been fabricated.     

Improvement in the characteristics of GaN-based light-emitting diodes by inserting AlGaN-GaN short-period superlattices in GaN underlayers

We report the influence of short-period superlattice (SPSL)-inserted structures in the underlying undoped GaN on the characteristics of GaN-based light-emitting diodes (LEDs). The measurements of current-voltage (I-V) curves indicate that GaN-based LEDs having pseudomorphic Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL-inserted structures exhibit improvements in device characteristics with the best LED being inserted with two sets of five-pair Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL structure. Based upon the results of etch pit counts, double-crystal X-ray diffraction measurements and transmission electron microscopic observations of the GaN-based LEDs, it was found that the Al/sub 0.3/Ga/sub 0.7/N(2 nm)-GaN(2 nm) SPSL-inserted structures tended to serve as threading dislocation filters in the LEDs so that the improved I-V characteristics were achieved.     

InP基功率HEMT结构材料分子束外延生长研究

从 3个层面研究了分子束外延 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P功率 HEMT结构材料生长技术。首先 ,通过观察生长过程的高能电子衍射 (RHEED)图谱 ,确立了 Ga0 .47In0 .53As/ In P结构表面层的 MBE RHEED衍射工艺相图 ,据此生长的单层 Si-doped Ga0 .47In0 .53As(40 0 nm) / In P室温迁移率可达 6960 cm2 / V· s及电子浓度 1 .3 3 E1 7cm- 3。其次 ,经过优化结构参数 ,低噪声 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In P HEMT结构材料的 Hall参数达到μ30 0 K≥ 1 0 0 0 0 cm2 / V· s、2 DEG≥ 2 .5 E1 2 cm- 2 。最后 ,在此基础之上 ,降低 spacer的厚度、在 Ga0 .47In0 .53As沟道内插入 Si平面掺杂层并增加势垒层的掺杂浓度获得了功率 Al0 .48In0 .52 As/ Ga0 .47In0 .53As/ In PHEMT结构材料 ,其 Hall参数达到μ30 0 K≥ 80 0 0 cm2 / V· s、2 DEG≥ 4 .0 E1 2 cm- 2 。     

alpha factor improvements in high-speed p doped In/sub 0.35/Ga /sub 0.65/As/GaAs MQW lasers

The authors investigate experimentally for the first time the improvements in the linewidth enhancement factor, alpha , resulting from simultaneous addition of strain and p-doping in high-speed GaAs-based multiquantum well lasers. The alpha factor is determined from measured changes in both gain and refractive index as a function of CW bias current, yielding alpha 3.1 and 1.4 at the threshold lasing wavelength for unstrained GaAs/Al/sub 0.25/Ga/sub 0.75/As and p-doped strained In/sub 0.35/Ga/sub 0.65/As/GaAs devices, respectively.<>