基于低温In_xGa_(1-x)P组分渐变缓冲层的InP/GaAs异质外延

采用低温GaAs与低温组分渐变InxGa1-xP作为缓冲层,利用低压金属有机化学气相外延(LP-MOCVD)技术,在GaAs(001)衬底上进行了InP/GaAs异质外延实验。实验中,InxGa1-xP缓冲层选用组分线性渐变生长模式(xIn0.49→1)。通过对InP/GaAs异质外延样品进行双晶X射线衍射(DCXRD)测试,并比较1.2μm厚InP外延层(004)晶面ω扫描及ω-2θ扫描的半高全宽(FWHM),确定了InxGa1-xP组分渐变缓冲层的最佳生长温度为450℃、渐变时间为500s。由透射电子显微镜(TEM)测试可知,InxGa1-xP组分渐变缓冲层的生长厚度约为250nm。在最佳生长条件下的InP/GaAs外延层中插入生长厚度为48nm的In0.53Ga0.47As,并对所得样品进行了室温光致发光(PL)谱测试,测试结果表明,中心波长为1643nm,FWHM为60meV。     

采用Ga(In,As)P异变缓冲层的GaP/Si衬底上InAs量子阱

本工作在GaP/Si衬底上基于In0.83Al0.17As异变缓冲层实现了InAs/In0.83Al0.17As量子阱的生长.研究了GaxIn1-xP和GaAsyP1-y递变缓冲层对量子阱结构材料性能的影响.采用GaxIn1-xP组分渐变缓冲层的样品X射线衍射倒易空间衍射峰展宽更小,表明样品中的失配位错更少.两个样品均...     

MBE生长RTD材料的X射线双晶衍射研究

用分子束外延技术(MBE)生长了GaAs基共振隧穿二极管(RTD)的材料结构,利用X射线双晶衍射(XRD)方法对材料进行了测试分析.结果表明,材料的双晶衍射峰半峰宽达到16.17",GaAs层与In0.1Ga0.9As层的相对晶格失配率仅为0.015 6%.对实验样品进行了双晶衍射回摆曲线的模拟,模拟结果与测试结果符合较好,说明生长的RTD材料结构与设计相符合.通过制成器件对材料进行验证,室温下对器件进行直流测试,PVCR达到5.1,峰值电流密度达到73.6 kA/cm2.     

InP衬底上InAlAs异变缓冲层和高铟组分InGaAs的生长温度优化

利用气态源分子束外延技术在InP衬底上生长了包含InAlAs异变缓冲层的In0.83Ga0.17As外延层.使用不同生长温度方案生长的高铟InGaAs和InAlAs异变缓冲层的特性分别通过高分辨X射线衍射倒易空间图、原子力显微镜、光致发光和霍尔等测量手段进行了表征.结果表明, InAlAs异变缓冲层的生长温度越低, X射线衍射倒易空间图 (004) 反射面沿Qx方向的衍射峰半峰宽就越宽, 外延层和衬底之间的倾角就越大, 同时样品表面粗糙度越高.这意味着材料的缺陷增加, 弛豫不充分.对于生长在具有相同生长温度的InAlAs异变缓冲层上的In0.83Ga0.17As外延层, 采用较高的生长温度时, X射线衍射倒易空间图 (004) 反射面沿Qx方向的衍射峰半峰宽较小, 77K下有更强的光致发光, 但是表面粗糙度会有所增加.这说明生长温度提高后, 材料中的缺陷得到抑制.     

InP衬底上InAlAs异变缓冲层和高铟组分InGaAs的生长温度优化（英文）

利用气态源分子束外延技术在InP衬底上生长了包含InAlAs异变缓冲层的In0.83Ga0.17As外延层.使用不同生长温度方案生长的高铟InGaAs和InAlAs异变缓冲层的特性分别通过高分辨X射线衍射倒易空间图、原子力显微镜、光致发光和霍尔等测量手段进行了表征.结果表明,InAlAs异变缓冲层的生长温度越低,X射线衍射倒易空间图(004)反射面沿Qx方向的衍射峰半峰宽就越宽,外延层和衬底之间的倾角就越大,同时样品表面粗糙度越高.这意味着材料的缺陷增加,弛豫不充分.对于生长在具有相同生长温度的InAlAs异变缓冲层上的In0.83Ga0.17As外延层,采用较高的生长温度时,X射线衍射倒易空间图(004)反射面沿Qx方向的衍射峰半峰宽较小,77K下有更强的光致发光,但是表面粗糙度会有所增加.这说明生长温度提高后,材料中的缺陷得到抑制.     

采用InGaAs或InAlAs缓冲层的高In组分InGaAs探测器结构材料特性

利用气态源分子束外延在InP衬底上生长了具有InxGa1-xAs或InxAl1-xAs连续递变缓冲层的高In组分In0.78Ga0.22As探测器结构.通过原子力显微镜、X射线衍射、透射电子显微镜和光致发光对它们的特性进行了表征和比较.结果表明,具有InxGa1-xAs或InxAl1-xAs缓冲层的结构都能获得较平整的...     

基于共振隧穿理论的GaAs基RTD的设计与研制

以共振能级的透射系数半峰宽(FWHM)做为共振隧穿二极管(RTD)材料结构设计的依据,对GaAs/AlAs/In0.1Ga0.9As材料体系的RTD进行了设计.用分子束外延(MBE)进行了RTD结构材料制备,X射线双晶衍射(XRD)分析表明,制备的异质结界面光滑、层厚准确.RTD采用台面结构,器件特性测试结果表明,峰值...     

（英）组分过冲对InP基InAlAs递变缓冲层的影响

通过在InP基InxAl1-xAs 递变缓冲层上生长In0.78Ga0.22As/In0.78Al0.22As量子阱和In0.84Ga0.16As探测器结构,研究了缓冲层中组分过冲对材料特性的影响。原子力显微镜结果表明,在InAlAs缓冲层中采用组分过冲可以使量子阱及探测器样品表面粗糙度都得到降低。对于相对较薄的量子阱结构,X射线衍射倒易空间扫描图和光致发光谱的测量表明,使用组分过冲可以增加弛豫度、减小剩余应力并改善光学性质。而对于较厚的探测器结构,X射线衍射和光致发光谱测试发现使用组分过冲后的材料性质没有明显的变化。量子阱和探测器结构的这些不同特性需要在器件设计应用中加以考虑。     

InP/GaAs异质外延及异变InGaAs光探测器制备

借助超薄低温InP缓冲层,在GaAs衬底上生长出了高质量的InP外延层,在InP外延层中插入了15周期In0.93Ga0.07P/InP应变层超晶格(SLS),进一步阻断了失配位错穿透到晶体表面,提高了外延层的晶体质量,这样2.5 μm厚InP外延层的双晶X射线衍射(DCXRD)ω扫描半高全宽(FWHM)值降低至219 arcsec,该InP外延层的室温光荧光(PL)谱线宽度仅为42 meV.在此基础上,只利用超薄低温InP缓冲层技术就在半绝缘GaAs衬底上成功地制备出了长波长异变In0.53Ga0.47As PIN光电探测器,器件的台面面积为50 μm×50 μm,In0.53Ga0.47As吸收层厚度为300 nm,在3 V反偏压下器件的3 dB带宽达到了6 GHz,在1 550 nm波长处器件的响应度达到了0.12 A/W,对应的外量子效率为9.6%.     

共振隧穿弱光探测器的分子束外延生长条件优化

对一种共振隧穿弱光探测器的分子束外延生长条件进行了研究。对探测器结构进行设计,研究了不同Al束流和不同生长温度下In0.52Al0.48As材料的生长质量,结合X射线衍射及原子力显微镜测试结果确定了In0.52Al0.48As材料的最佳生长条件。研究了不同Ga束流下In0.53Ga0.47As材料的生长质量,并采用一种衬底变温的生长方法解决了恒温生长较厚In0.53Ga0.47As外延层时表面容易出现点状突起的问题,获得了平整的In0.53Ga0.47As外延表面。分别采用恒温和变温的生长方法制备了探测器样品,并对其电流-电压特性及光响应进行了测试,测试结果表明,采用变温生长方法制备的探测器样品具有更高的峰值电流和光响应。     

Photoemission characteristics of transmission-mode negative electron affinity GaAs and (ln,Ga)As vapor-grown structures

Several types of transmission-mode negative electron affinity (NEA) photocathodes were investigated. The first group consisted of GaAs cathodes of various thicknesses grown on a composite structure composed of a GaP substrate and a Ga(As,P) buffer layer. These cathodes were of two types, one having an abrupt Ga(As,P)/GaAs interface and the other having a compositionally graded interface. The latter type exhibited the highest transmission-mode quantum efficiency, 0.11 electron per incident photon at 0.85 μm. It is assumed that the electron diffusion length L in the GaAs layer is limited by misfit dislocations arising from the lattice mismatch between the GaAs and the Ga(As,P) buffer layer. L increased with cathode layer thickness more rapidly for the graded structure, suggesting that misfit dislocation propagation into the GaAs layer is less when the dislocations are generated gradually (graded structure) than when they are introduced abruptly (ungraded structure). The second group of samples consisted of (In, Ga)As alloy cathodes of various compositions grown on both GaAs and GaP substrates with lattice-mismatch-reducing buffer layers of (In, Ga)As, (In, Ga)P, and Ga(As,P). It was found that photosensitivity was improved significantly by reducing the amount of lattice mismatch between the (In, Ga)As cathode layer and the substrate or buffer layer. Using an (In, Ga)As cathode with an (In,Ga)P buffer layer grown on a GaP substrate, transmission quantum efficiencies in excess of 0.01 were obtained over the relatively broad wavelength range of 0.7 to 1.04 µm.     

Ultralow leakage In/sub 0.53/Ga/sub 0.47/As p-i-n photodetector grown on linearly graded metamorphic In/sub x/Ga/sub 1-x/P buffered GaAs substrate

A novel top-illuminated In/sub 0.53/Ga/sub 0.47/As p-i-n photodiodes (MM-PINPD) grown on GaAs substrate by using linearly graded metamorphic In/sub x/Ga/sub 1-x/P (x graded from 0.49 to 1) buffer layer is reported. The dark current, optical responsivities, noise equivalent power, and operational bandwidth of the MM-PINPD with aperture diameter of 60 /spl mu/m are 13 pA, 0.6 A/W, 3.4/spl times/10/sup -15/ W/Hz/sup 1/2/, and 7.5 GHz, respectively, at 1550 nm. The performances of the MM-PINPD on GaAs are demonstrated to be comparable to those of a similar device made on InGaAs-InP substrate.     

不同缓冲层对GaAs基In_(0.3)Ga_(0.7)As材料特性的影响

采用组分跳变和低温大失配缓冲层技术在GaAs衬底上外延了In0.3Ga0.7As材料。测试结果表明,采用组分跳变缓冲层生长的In0.3Ga0.7As主要依靠逐层间产生失配位错来释放应力,并导致表面形成纵横交错的Cross-hatch形貌;而采用低温大失配缓冲层技术则主要通过在低温缓冲层中形成大量缺陷来充分释放应力,并在后续外延的In0.3Ga0.7As表面没有与失配位错相关的Cross-hatch形貌出现。此外,仅需50nm厚的低温大失配缓冲层即可促使In0.3Ga0.7As中的应力完全释放,这种超薄缓冲层技术在工业批产中显得更为经济。     

数值分析渐变DBR对垂直腔面发射激光器谐振腔模的影响

通过数值分析研究了含线性渐变层的Al0.9Ga0.1As/AlyGa1-yAs/GaAs/AlxGa1-xAS DBR的光学特性及其对VCSEL谐振腔光学特性的影响,建立了渐变型DBR渐变层厚度与折射率的关系,通过特征矩阵法计算了突变GaAs/Al0.9Ga0.1AS DBR和渐变型DBR的反射谱和反射相移,分析了渐变层对DBR反射率和反射相移的影响.对渐变型DBR,要使VCSEL谐振腔满足中心波长相位匹配条件,还需要在DBR靠近谐振腔一侧的最前面增加一定厚度的渐变层,称为相位匹配层.通过计算,我们得到了使VCSEL谐振腔满足相位匹配条件时均匀层和相位匹配层的厚度.     

室温下高峰谷电流比、高峰电流密度的双势垒共振隧穿二极管

在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管.在GaAs层中加入In0.1Ga0.9As层用以降低势垒两边的势阱深度,从而提高了器件的峰谷电流比和峰电流密度.为了减小器件的接触电阻和电流的非均匀性,使用了独特形状的集电极,总的电流密度也因此提高.薄栅也有助于提高器件的PVCR和峰电流密度.在室温下测得其峰谷电流比高达13.98,峰电流密度大于89kA/cm2.     

Electroabsorption modulation at 1.3 /spl mu/m on GaAs substrates using a step-graded low temperature grown InAlAs buffer

We have achieved quantum confined Stark effects (QCSE) on In/sub 0.38/Ga/sub 0.62/As-In/sub 0.38/Al/sub 0.62/As multiple-quantum-well (MQW) structures, operating at 1.3 /spl mu/m grown on GaAs substrates. A quantum confined Stark shift of the exciton absorption peak of 47 meV was obtained with an applied electric field of 190 KV/cm, measured on surface normal PIN diodes. The structure is grown by MBE on a novel three-stage, compositionally step graded, In/sub x/Al/sub 1-x/As buffer, doped with Si to 5/spl middot/10/sup 17//cm/sup 3/, on an n-type GaAs substrate. The total thickness of the buffer is 0.3-0.6 mm, which is considerably smaller than that of linearly graded buffer layers. This structure can be used in both waveguide modulators and surface normal F-P type modulators on GaAs substrates.     

High quality GaAs qrowth by MBE on Si using GeSi buffers and prospects for space photovoltaics

III–V solar cells on Si substrates are of interest for space photovoltaics since this would combine high performance space cells with a strong, lightweight and inexpensive substrate. However, the primary obstacles blocking III–V/Si cells from achieving high performance to date have been fundamental material incompatibilities, namely the 4% lattice mismatch between GaAs and Si, and the large mismatch in thermal expansion coefficient. In this paper, we report on the molecular beam epitaxial (MBE) growth and properties of GaAs layers and single junction GaAs cells on Si wafers which utilize compositionally graded GeSi intermediate buffers grown by ultra‐high vacuum chemical vapor deposition (UHVCVD) to mitigate the large lattice mismatch between GaAs and Si. GaAs cell structures were found to incorporate a threading dislocation density of 0.9–1.5×10 cm⁻², identical to the underlying relaxed Ge cap of the graded buffer, via a combination of transmission electron microscopy, electron beam induced current, and etch pit density measurements. AlGaAs/GaAs double heterostructures were grown on the GeSi/Si substrates for time‐resolved photoluminescence measurements, which revealed a bulk GaAs minority carrier lifetime in excess of 10 ns, the highest lifetime ever reported for GaAs on Si. A series of growths were performed to assess the impact of a GaAs buffer layer that is typically grown on the Ge surface prior to growth of active device layers. We found that both the high lifetimes and low interface recombination velocities are maintained even after reducing the GaAs buffer to a thickness of only 0.1 μm. Secondary ion mass spectroscopy studies revealed that there is negligible cross diffusion of Ga, As and Ge at the III–V/Ge interface, identical to our earlier findings for GaAs grown on Ge wafers using MBE. This indicates that there is no need for a buffer to ‘bury’ regions of high autodoping, and that either pn or np configuration cells are easily accommodated by these substrates. Preliminary diodes and single junction AlGaAs heteroface cells were grown and fabricated on the Ge/GeSi/Si substrates for the first time. Diodes fabricated on GaAs, Ge and Ge/GeSi/Si substrates show nearly identical I–V characteristics in both forward and reverse bias regions. External quantum efficiencies of AlGaAs/GaAs cell structures grown on Ge/GeSi/Si and Ge substrates demonstrated nearly identical photoresponse, which indicates that high lifetimes, diffusion lengths and efficient minority carrier collection is maintained after complete cell processing. Copyright © 2000 John Wiley & Sons, Ltd.