p型GaN材料的表面物理特性

运用X射线光电子能谱(XPS)和俄歇电子能谱(AES)等表面分析手段对表面状态不同的p-GaN样品进行了分析.在样品表面制作了Ni/Au电极并进行了I-V特性测试.实验结果表明样品表面镓氮元素化学比(Ga/N)的减小以及C,O杂质含量的减少可以改善电极的欧姆接触性能.     

表面处理对p-GaN欧姆接触的影响

分别用稀盐酸、王水以及(NH4)2S溶液处理p-GaN表面,通过测试样品表面Ols的X射线光电子能谱(XPS),比较了这些溶液去除p-GaN表面氧化层的能力;在经不同溶液处理后的样品表面,以相同的条件制作Ni/Au电极,并测试其与p-GaN的比接触电阻,结果表明经稀盐酸处理后的样品表面,由于其氧含量较高,不能与Ni/Au形成良好的欧姆接触,而经王水和(NH4)2S溶液处理后的p-GaN表面,能与Ni/Au形成良好的欧姆接触;最后,通过比较样品表面的Ga/N原子浓度比,探讨了王水处理p-GaN表面能够形成良好欧姆接触的原因.     

表面处理对p-GaN欧姆接触的影响

分别用稀盐酸、王水以及(NH4)2S溶液处理p-GaN表面,通过测试样品表面Ols的X射线光电子能谱(XPS),比较了这些溶液去除p-GaN表面氧化层的能力;在经不同溶液处理后的样品表面,以相同的条件制作Ni/Au电极,并测试其与p-GaN的比接触电阻,结果表明经稀盐酸处理后的样品表面,由于其氧含量较高,不能与Ni/Au形成良好的欧姆接触,而经王水和(NH4)2S溶液处理后的p-GaN表面,能与Ni/Au形成良好的欧姆接触;最后,通过比较样品表面的Ga/N原子浓度比,探讨了王水处理p-GaN表面能够形成良好欧姆接触的原因.     

调制掺杂AlGaN/GaN异质结上的Pt肖特基接触

研究了调制掺杂 Alx Ga1 - x N/Ga N表面 Pt肖特基接触的制备工艺 ,并对其进行了 I-V测量。通过改变对样品表面的处理工艺 ,研究了表面处理对调制掺杂 Alx Ga1 - x N/Ga N表面 Pt肖特基结接触特性的影响 ,在 n型掺杂浓度为 7.5× 1 0 1 7cm- 3的 Al0 .2 2 Ga0 .78N样品表面 ,制备得到了势垒高度为 0 .94e V、理想因子为 1 .4的 Pt肖特基接触。这与国外报道的结果接近 (=1 .2 e V,n=1 .1 1 [1 ] )     

调制掺杂AlxGa1-xN/GaN异质结中AlxGa1-xN势垒层表面态及其他局域态性质研究

通过测量调制掺杂Al0.22Ga0.78N/GaN异质结样品的变频电容-电压(C-V)特性,对Al0.22Ga0.78N势垒层表面态的性质进行了研究.结果发现在小偏压下,样品的电容随着测量信号频率的增加而下降,说明势垒层中存在表面态.实验数据分析表明:表面态密度约为1013cm-2量级,表面态的时间常数比势垒层中其他局域态大.随着空间隔离层厚度的增加,势垒层中其他局域态密度随之增加.在金属电极和Al0.22Ga0.78N势垒层之间加入Si3N4绝缘层可以对表面态起到显著的钝化作用,使表面态密度降为～1012cm-2量级.     

掺C高阻GaN的MOCVD外延生长

利用金属有机物化学气相沉积(MOCVD)技术在蓝宝石衬底上制备了Ga N∶C薄膜。为得到高阻(或半绝缘)的Ga N薄膜,研究了源(CCl4)流量和载气对MOCVD外延Ga N薄膜电学性能的影响,发现CCl4流量和载气对实现高阻的Ga N影响很大。当Ga N缓冲层采用N2作为载气,CCl4的流量为0.016μmol/min时成功实现了Ga N的高阻生长,样品A2的方块电阻高达2.8×107Ω/sq。经原子力显微镜(AFM)测试显示,样品的表面形貌较好,粗糙度均在0.3 nm附近,说明C掺杂对外延Ga N薄膜的表面形貌没有大的影响。低温荧光光谱测试显示黄光峰与刃型位错有关。     

Ti/Al/Ni/Au在GaN N面上的欧姆接触

以Ti/Al/Ni/Au作为欧姆接触金属体系,通过电感耦合等离子体(ICP)刻蚀的预处理,在氢化物气相外延法生长的单晶氮化镓(GaN)材料的N面实现了良好的欧姆接触,其比接触电阻率为3.7×10-4 Ω·cm2.通过扫描电子显微镜、原子力显微镜、阴极荧光和光致发光谱对GaN N面的表面、光学特性进行了对比表征.结果表明:未刻蚀GaN衬底的N面表面存在一定的损伤层,导致近表面处含有大量缺陷,不利于欧姆接触的形成;而ICP刻蚀处理有效地去除了损伤层.X射线光电子能谱(XPS)分析显示刻蚀后样品的Ga 3d结合能比未刻蚀样品向高能方向移动了约0.3 eV,其肖特基势垒则相应降低,有利于欧姆接触的形成.同时对Fe掺杂半绝缘GaN的N面也进行了刻蚀处理,同样实现了良好的Ti/Al/Ni/Au欧姆接触,其比接触电阻率为0.12 Ω·cm2.     

表面处理对AlGaN欧姆接触的影响及机理

研究了溶液表面处理对AlGaN欧姆接触的影响及机理。用氟硝酸(HNO3+HF)、稀盐酸(HCl)和硫代乙酰胺(CS3CSNH2)溶液处理AlGaN表面后,Ti/Al/Ti/Au电极的比接触电阻率有显著的降低。样品表面Ga3d与O1s的X射线光电子能谱(XPS)测试结果显示:氧元素含量明显降低,表明这三种溶液可以有效地去除AlGaN表面氧化层,其中CS3CSNH2效果最佳;Ga3d峰位在表面处理后发生蓝移现象,相当于AlGaN表面处的费米能级向导带一侧移动,使电子在隧穿过程中的有效势垒高度降低。以上两个因素均对优化AlGaN/GaN欧姆接触有十分重要的意义。     

调制掺杂Al_xGa_(1-x)N/GaN异质结中Al_xGa_(1-x)N势垒层表面态及其他局域态性质研究

通过测量调制掺杂Al0 2 2 Ga0 78N/GaN异质结样品的变频电容电压(C V)特性,对Al0 2 2 Ga0 78N势垒层表面态的性质进行了研究.结果发现在小偏压下,样品的电容随着测量信号频率的增加而下降,说明势垒层中存在表面态.实验数据分析表明:表面态密度约为10 13 cm-2 量级,表面态的时间常数比势垒层中其他局域态大.随着空间隔离层厚度的增加,势垒层中其他局域态密度随之增加.在金属电极和Al0 2 2 Ga0 78N势垒层之间加入Si3 N4绝缘层可以对表面态起到显著的钝化作用,使表面态密度降为～10 12 cm-2 量级     

闪锌矿GaN(001)表面的电子结构

采用混合基表示的第一原理赝势方法 ,计算了闪锌矿结构的 Ga N(0 0 1) (1× 1)干净表面的电子结构 .分析了得到的各原子分态密度、面电荷密度分布以及表面能带结构等性质 ,比较了 Ga N(0 0 1)的 Ga端表面和 N端表面两种情况 .结果显示 ,闪锌矿 Ga N(0 0 1)的 Ga端表面比 N端表面更稳定 ,这两种 (1× 1)表面都是金属特性 .此外 ,还讨论了次表面层原子的性质     

Reversible Degradation of Ohmic Contacts on p-GaN for Application in High-Brightness LEDs

This paper analyzes the high-temperature long-term stability of ohmic contacts on p-type gallium nitride (p-GaN). The contributions of the ohmic contacts and semiconductor material degradation are separated by adopting the transmission line method (TLM). Before stress, the current-voltage (I-V) curves measured at the pads of the TLMs showed a linear shape, indicating a good ohmic behavior of the contacts. Thermal treatment at 250degC was found to induce the worsening of the electrical characteristics of the contacts: identified degradation modes consist of a shift of the I-V curves toward higher voltages and strong nonlinearity of the characteristics around zero. This paper shows that the high-temperature instabilities of ohmic contacts on p-GaN are related to the interaction between the device surface and the plasma-enhanced chemical vapor deposition SiN passivation layer. Hydrogen contained in the passivation layer is supposed to play an important role in the degradation process: the interaction with the acceptor dopant at the metal/semiconductor interface induces the decrease of the effective acceptor concentration. As a consequence, both the ohmic contact characteristics and the semiconductor sheet resistance are worsened.     

The improvement of electrical properties of Pd-based contact to p-GaN by surface treatment

The surface treatment effect on the interfacial reaction and electrical property of Au/Pd contacts to p-GaN has been investigated. The contact resistance of Au/Pd contacts on boiling aqua regia treated p-GaN was lower than aqua regia treated p-GaN by one order of magnitude. The specific contact resistivity of Au/Pd contacts on boiling aqua regia treated p-GaN increased with annealing temperature, but that on aqua regia treated p-GaN decreased with annealing temperature and it showed minimum value after annealing at 700°C. According to the results of the interfacial reaction, the Au/Pd contact metals reacted more easily with aqua regia treated p-GaN than boiling aqua regia treated p-GaN. X-ray photoelectron spectroscopy analysis revealed that the relative surface Ga-to-N ratio of boiling aqua regia treated p-GaN was lower than that of aqua regia treated p-GaN and the surface of p-GaN was modified from Ga-termination to N-termination by surface treatment using boiling aqua regia. According to the results of surface analysis and interfacial reaction of Au/Pd/p-GaN, it could be concluded that the different temperature dependence of contact resistance according to the surface treatment conditions was related strongly to the surface modification of p-GaN from Ga-termination to N-termination.     

Surface-layer damage and responsivity in sputtered-ITO/p-GaN Schottky-barrier photodiodes

It is postulated that donor-like nitrogen vacancies, caused by the sputtering of a Schottky-barrier metal onto p-type gallium nitride, diffuse into the GaN and form a surface layer in which both the minority-carrier lifetime and mobility are drastically reduced. Such a damaged surface layer is shown to reduce the responsivity of p-GaN Schottky-barrier photodiodes, thereby offering an explanation for the responsivity values in the range of 0.03–0.04 A/W that have been measured in experimental ITO/p-GaN devices. On making allowance for the damaged surface layer, an electron diffusion length of around 300 nm can be inferred for the undamaged p-GaN region.     

氮化镓光阴极薄膜材料表面光电压谱特性

在蓝宝石基底上外延生长了多层结构氮化镓光阴极薄膜材料并进行表面光电压测试;对比分析了掺杂类型、厚度和掺杂方式对氮化镓材料表面光电压的影响,确定了多层结构氮化镓材料表面光电压产生机理;借助亚带隙激光辅助,针对均匀掺杂和δ-掺杂氮化镓（GaN）光电阴极薄膜材料进行了表面光电压测试;实验数据表明,相较于均匀掺杂,δ-掺杂可以获得更好生长质量,但也提高了在能级(E_v+0.65)eV~(E_v+1.07)eV范围的缺陷态密度。     

Study of schottky barrier heights of indium-tin-oxide on p-GaN using x-ray photoelectron spectroscopy and current-voltage measurements

In this study, the current density-voltage (J-V) characteristic of Schottky diodes of indium-tin-oxide (ITO) contacts to p-type GaN (p-GaN) has been investigated. The calculated barrier-height value of ITO/p-GaN samples using the thermionic field-emission (TFE) model is 3.2 eV, which implies that the work function of ITO is equal to 4.3 eV. The result is supported by J-V measurements of ITO/n-type GaN Schottky diodes. On the other hand, the barrier height of ITO/p-GaN was also determined from x-ray photoelectron spectroscopy (XPS) data. The analysis of the XPS spectral shifts indicated that this observed barrier-height value of ITO/p-GaN by XPS is in good agreement with the value of 3.2 eV obtained from J-V measurements.     

Interface observation in Au/Ni/p-GaN studied by HREM and energy-filtering TEM

The contact resistance of Au/Ni/p-GaN ohmic contacts for different annealing conditions was measured. This was then correlated with microstructure, including phase distribution, observed by high-resolution electron microscopy combined with energy-filtering imaging. A contact resistance of 2.22 x 10(-4) ohms cm2 for Au/Ni contacts to p-GaN after annealing at 500 degrees C for 5 min in air ambient was obtained. NiO layers were identified at the interface and upper area of annealed Ni/Au/p-GaN for air ambient. In addition, an Au layer was found at the interface of p-GaN due to a reversal reaction during annealing. Identification of the observed phases is discussed, along with possible formation mechanisms for the ohmic contacts in the Au/Ni/p-GaN system.     

High-reflectivity Al-Pt nanostructured Ohmic contact to p-GaN

The effect of nanoscale Pt islands on the electrical characteristics of contacts to p-type gallium nitride (GaN) has been investigated to explore the feasibility for the flip-chip configuration light-emitting diodes (LEDs) using an Al-based reflector. An as-deposited Al contact to p-GaN with a net hole concentration of 3/spl times/10/sup 17/cm/sup -3/ was rectifying. However, an Al contact with nanoscale Pt islands at the interface exhibited ohmic behavior. A specific contact resistivity of 2.1/spl times/10/sup -3//spl Omega//spl middot/cm/sup 2/ and a reflectance of 84% at 460 nm were measured for the Al contact with nanoscale Pt islands. Current-voltage temperature measurements revealed a Schottky barrier height reduction from 0.80 eV for the Al contact to 0.58 eV for the Al contact with nanoscale Pt islands. The barrier height reduction may be attributed to electric field enhancement and the enhanced tunneling due to the presence of the nanoscale Pt islands. This will offer an additional silver-free option for the p-type ohmic contact in flip-chip configuration LEDs. Theory suggests that the ohmic contact characteristics may be improved further with smaller Pt islands that will enhance tunneling across the interface with the GaN and in the vicinity of the Pt-Al interface.     

Electron auger spectroscopy and reflectance anisotropy spectroscopy of monolayer nitride films on (001) surfaces of GaAs and GaSb crystals

The methods of electron Auger spectroscopy and reflectance anisotropy spectroscopy are used to study monolayer films of gallium nitride formed on the (001) surface of GaAs by chemical nitridization in hydrazine-sulfide solutions. It is found that the Auger signal for nitrogen N KLL from the nitride film is shifted to higher kinetic energies by ??17.2 eV in comparison with its position for the same signal for a bulk GaN crystal. The observed shift is caused by the specific configuration of the valence orbitals of nitrogen atoms terminating the nitridized GaAs (001) surface. One of the valence orbitals for these atoms does not form a chemical bond and is occupied by an uncoupled pair of electrons. The suggested configuration is confirmed by the results of an analysis of the spectra of anisotropic reflectance from the nitridized GaAs (001) surface. Experiments with chemical nitridization of a GaSb surface have been performed for the first time. The Auger spectra for a nitridized GaSb (001) surface are found to be similar to those for a nitridized GaAs (001) surface. This is indicative of the similar character of chemical processes on these surfaces and the formation of a monolayer nitride film on the GaSb surface.     

大功率倒装结构GaN LED p电极研究

从接触电阻、反射率、电流扩展等方面对Ni/Au/Ag,ITO/Ag,Ag等多种倒装结构p电极金属体系进行分析比较，给出了实现倒装结构大功率GaN LED p电极的多种设计方案. 指出Ni/Au金属化体系在大功率LED应用中存在的热稳定性问题及Ru,Ir等新型金属体系实现GaN p电极接触的潜在优势.