塑封集成电路离层对可靠性的影响及解决方法

塑封集成电路因其是非气密性封装,封装材料热膨胀系数的不同以及被粘接材料表面能低,是造成塑封电路离层或开裂的内部原因。通过选择特殊的封装材料（特别是框架材料）和工艺可以解决离层或开裂问题,大大提高塑封集成电路的稳定性和可靠性。水汽是造成塑封集成电路离层或开裂的外部原因,可以通过驱除和防潮措施来解决。要提升塑封集成电路可靠性,必须从技术和工艺上解决塑封电路离层或开裂问题。我们在这方面做了有益的尝试,取得了良好的效果,为拓展塑封集成电路的应用领域创造了条件。     

基于GJB7400的军用塑封集成电路检验标准探讨

塑封集成电路凭借其五大优势,势必会在军用集成电路发展之路上大有作为.目前我国军用塑封集成电路正在处于高速发展阶段,提高其可靠性是军用塑封集成电路发展的重要任务.为加强军用集成电路质量控制,制定了GJB7400-2011《合格制造厂认证用半导体集成电路通用规范》,是军用塑封集成电路筛选检验的主要标准.通过梳理GJB740...     

塑封集成电路分层研究

目前塑封集成电路的分层问题越来越受到半导体集成电路封装厂商以及整机厂商的关注和重视。文章对塑封集成电路的分层产生的机理和塑封表面贴装集成电路潮湿敏感度等级的认定作了介绍。另外,对几种主要的分层失效的标准作了详细解释和说明。文章对影响塑封表面贴装集成电路分层的主要因素进行了详细的分析和说明,并对三种不同封装形式塑封集成电路的吸湿和去湿过程进行了分析和研究,并给出了结论。最后文章就如何防止分层问题提出了相应的措施。     

塑封集成电路的抗潮湿性研究

本文介绍了影响塑封集成电路抗潮湿性的主要因素,塑封集成电路潮湿失效的几种类型,提高集成电路抗潮湿性的办法,并介绍了提高集成电路抗潮湿性的实验。实验结果说明,塑封料是影响集成电路抗潮湿性能的最重要因素之一。     

提高厚膜混合集成电路产品的一次塑封合格率

本文从厚膜混合集成电路产品塑封不合格品产生的原因分析入手，结合厚膜混合集成电路的工艺特点，采用过程质量统计分析方法，给出提高厚膜混合集成电路产品一次塑封合格率的方法。     

塑封IC失效分析及对策

阐述了塑封IC(集成电路)常见的失效现象,对塑封IC失效的几种分析方法和分析技术做了叙述,然后提出塑封IC失效分析的步骤,并从设计、工艺和材料控制、包装、运输等方面提出改善塑封IC可靠性的措施。     

声学扫描显微镜检查在塑封器件检测中的应用

随着塑封器件在武器系统中的使用越来越广泛,塑封器件在使用中也暴露出了一些问题,如塑封器件易打磨、翻新,内部易进入水汽产生爆米花效应或内部界面分层等。作者总结近几年塑封器件DPA试验中出现的各种失效,重点对塑封器件内部界面分层以及分层产生的原因、危害进行了论述。同时,论述了声学扫描显微镜检查对内部界面分层的辨别、原理及其相关试验标准等,提出了塑封器件在型号产品中的使用建议。     

贯彻国军标产品封装问题探讨

简要介绍了厚膜混合集成电路（ＨＩＣ）贯彻国军标用金属管不汽含量和盐雾试验３的现状，重点探讨了半导体集成电路（ＳＩＣ）贯军标塑封的可靠性、塑封材料的吸水性、热膨胀系数和模化合物的组份等。     

引线框架塑封集成电路冲切过程中的检测和防护

在引线框架塑封集成电路的引线冲切成型过程中,存在塑封体破裂脱落、引脚折断等异常现象,如果不能及时发现这些异常,就会造成产品的批量报废或相关成型模具损坏的情况.介绍了如何使用光电传感器和检测针系统对集成电路引脚冲切成型中可能出现的异常进行有效监测和防护.     

集成电路封装模具三维CAD／CAM系统

本文对集成电路封装模具CAD/CAM系统进行了概述，集成系统包括的部分有引线框架精密级进模CAD，集成电路塑封模CAD以及模具CAM。     

塑封器件的外部目检方法与判据研究

目前,塑封器件由于其在尺寸、重量、成本、可用性和性能,以及工艺和设计方面的先进性,使得其在高可靠性领域中的应用越来越广泛,国内已有相当数量的塑封器件应用于国防领域。但是,其外部目检试验项目所依据的方法与判据仍然沿用气密性封装器件外部目检的方法与判据,已经不能满足日益增多的塑封器件的外部目检筛选要求。结合GJB 548B-2005的方法 2009.1外部目检要求,开展塑封器件外部目检试验方法与判据的研究。     

Reliability of new packaging concepts

Today, most of the microelectronics packaging needs are met by semiconductor devices in plastic surface mount (SM) packages. Microelectronics packaging of the future will be either bare chip or chip size/scale packaging (CSP). Of the 45 billion SM packaged ICs to be manufactured in 2000, CSPs will be a small 3.4% but growing at 62% (compound annual growth rate). The use of direct bonded chip-on-board and flip chip (FC) technology for custom solutions may not match the growth of CSPs. The popcorn problem of existing plastic packages has been solved in many ways including the use of hydrophobic composite encapsulants as the best solution and thorough bake-out and storage as the long-standing practical solution. The popcorn problem which was more severe with the smaller and thinner encapsulations of CSPs is also solved with modern hydrophobic materials and new non-paddle package designs. Further, there is good evidence that reliability is not impaired even by delaminations in the bulk of the encapsulations – small delaminations being an inevitable consequence of stress relaxation following transfer moulding. CSP and FC bump joint reliability is safeguarded both by good soldering practice and by effective underfill. High reliabilities are achievable with the range of new packages built from modern materials, with random failure rates down to 10 failure units, infant mortalities controlled to low levels by six sigma manufacturing processes and wearout lifetimes exceeding 100 years even in tropical operation.     

创新型超薄IC封装技术

圆片薄型化工艺技术的改进,以及对小型化、便携式产品的强烈的市场需求,共同推动了封装技术的创新。文中主要论述了与超薄型集成电路封装技术相关的薄型硅集成电路应用、超薄型圆片的制造、薄型化切割技术、同平面互连技术、倒装片装配及其可靠性问题。     

集成电路封装线系统性静电防护

文中分析了静电产生的原因、电路静电损伤机理及失效机制。制定了集成电路封装线系统性静电防护措施。其涉及到封装厂房环境静电防护、封装生产设备静电防护、工艺操作静电防护、电路包装和运输过程中的静电防护以及静电防护检测等多个环节。对这些环节的全面控制有利于消除静电对集成电路的损伤。     

QFN器件在湿热环境中的界面裂纹分析

因吸潮而引起的界面破裂是塑封电子器件失效的一个重要原因。通过吸潮实验、无铅回流焊环境实验和湿热老化实验研究了QFN塑封器件内部界面裂纹情况。结果表明,未吸潮的器件经历无铅回流焊后很少产生裂纹,吸潮器件在吸潮期间未产生裂纹,但经历无铅回流焊后器件产生裂纹的几率达100%;裂纹在芯片、芯片粘结材料(DA)和塑封材料(EMC)的交界处的破坏程度最大;产生的裂纹的位置和扩展方向与结合材料的特性、结合界面的强度紧密相关。     

外来物导致的塑封器件金属化层损伤机理分析

对塑封器件进行破坏性物理分析(DPA),发现有样品芯片表面存在金属化层损伤。对损伤部位进行背散射电子成像和能谱分析,确定损伤部位存在钢颗粒。结合塑封封装工艺环节进一步分析损伤形貌,结果表明钢颗粒来源于塑封模具破损或老化,在环氧固化过程中产生的应力导致钢颗粒压碎金属化层。分析了具有这类缺陷的塑封器件在高可靠应用领域中的危害性。这类缺陷形成机理不常见,研究结论对改进塑封器件生产工艺具有参考价值。     

Design and development of optoelectronic mixed signal system-on-package (SOP)

This paper describes the design and development of a 2.5-Gb/s optical transceiver module as a mixed signal SOP for access networks. The module development consists of concurrent design of an optoelectronic package optimizing optical, electrical, thermal, mechanical functions and optical subassembly and RFICs housed in a chip-on-board package. The optical subassembly (OSA) consists of laser and photodiode assembled on a silicon substrate. The transmit and the receiver sections are combined into a single fiber through a polymer coupler on silicon. The splitter between the transmit and receive section is realized using a polymer waveguide. The electronic ICs are assembled on a multilayer organic substrate. The package design includes optical coupling design, impedance matched transmission line design for RF signals, electrical layout design for mixed signals and thermal design for the package. The module is housed in a plastic molded nonhermetic package to achieve low cost packaging. The assembly is completed using passive alignment of optical devices and attachment of electronic devices using adhesives. In this paper, we present the details of the component design and the development of packaging process methods to achieve the design specifications, test results and process guidelines for assembly and integration.     

FOCKE 350S商标库小胶缸胶水控制方式改进

FOCKE350S包装机是德国生产的经典卷烟包装机组。由于原装小胶缸胶水控制系统易出现错误检测而造成停机和质量问题。经过长期的数据分析,对胶水检测系统进行改进,增加胶水消耗监测报警,使得FOCK350S商标库小胶缸胶水控制系统拥有更为精确、稳定的工作性能。改造完成后,包装机因胶水检测器引起的故障次数和由此造成的次品均大幅降低,提高了机器生产的效率与稳定性。     

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA

In this decade, many new techniques have been introduced into the integrated circuit (IC) packaging industry. Packaging technology used in liquid crystal displays (LCDs) has requirements related to critical issues such as high density interconnects, thinner packaging size, and environmental safety. Driver IC chips are directly attached to LCD panels using flip chip technology with adhesives in the so called chip on glass (COG) packaging processes. To investigate the dependence of the bonding force on the bump deformation during packaging, this study established a mathematical model to analyze COG packaging processes with non-conductive adhesives (NCAs). The plastic deformation of the bumps and the NCA flow between the chip and substrate are taken into account in this model. With this model, the contact resistance and the gap height after bonding can be estimated for different bonding force.