Synthesis of epoxy curing agents containing different ring structures and properties investigation of the cured resins

Two kinds of aliphatic epoxy curing agents containing ring structures were synthesized from rosin acid and isosorbide, respectively. They were cured with diglycidyl ether bisphenol A (DER331) and the ultimate propertied of the cured resins were investigated. For comparison, the petroleum‐based curing agent containing planar benzene ring was synthesized from terephthalic acid. The chemical structures of the synthesized curing agents were identified by Fourier transform‐infrared and H‐nuclear magnetic resonance. The ultimate properties of the cured epoxy resins were investigated by thermogravimetric analysis and dynamic mechanical analysis. Especially, the effects of ring structure on their shape memory properties were studied in terms of shape fixity, shape recovery, and shape recovery time. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 44219.     

Synthesis and characterization of diphenylsilanediol modified epoxy resin and curing agent

A series of diphenylsilanediol modified epoxy resins and novel curing agents were synthesized. The modified epoxy resins were cured with regular curing agent diethylenetriamine (DETA); the curing agents were applied to cure unmodified diglycidyl ether of bisphenol A epoxy resin (DGEBA). The heat resistance, mechanical property, and toughness of all the curing products were investigated. The results showed that the application of modified resin and newly synthesized curing agents leads to curing products with lower thermal decomposition rate and only slightly decreased glass transition temperature (T_g), as well as improved tensile modulus and tensile strength. In particular, products cured with newly synthesized curing agents showed higher corresponding temperature to the maximum thermal decomposition rate, comparing with products of DGEBA cured by DETA. Scanning electron microscopy micro images proved that a ductile fracture happened on the cross sections of curing products obtained from modified epoxy resins and newly synthesized curing agents, indicating an effective toughening effect of silicon–oxygen bond.     

Synthesis of rosin‐based flexible anhydride‐type curing agents and properties of the cured epoxy

BACKGROUND: Although rosin acid derivatives have received attention in polymer synthesis in recent years, to the best of our knowledge, they have rarely been employed as epoxy curing agents. The objective of the study reported here was to synthesize rosin‐based flexible anhydride‐type curing agents and demonstrate that the flexibility of a cured epoxy resin can be manipulated by selection of rosin‐based anhydride‐type curing agents with appropriate molecular rigidity/flexibility. RESULTS: Maleopimarate‐terminated low molecular weight polycaprolactones (PCLs) were synthesized and studied as anhydride‐type curing agents for epoxy curing. The chemical structures of the products were confirmed using ¹H NMR spectroscopy and Fourier transform infrared spectroscopy. Mechanical and thermal properties of the cured epoxy resins were studied. The results indicate that both the epoxy/anhydride equivalent ratio and the molecular weight of PCL diol play important roles in the properties of cured resins. CONCLUSION: Rosin‐based anhydride‐terminated polyesters could be used as bio‐based epoxy curing agents. A broad spectrum of mechanical and thermal properties of the cured epoxy resins can be obtained by varying the molecular length of the polyester segment and the epoxy/curing agent ratio. Copyright © 2009 Society of Chemical Industry     

Thermal and mechanical properties of tetra‐functional mesogenic type epoxy resin cured with aromatic amine

A novel tetra‐functional epoxy monomer with mesogenic groups was synthesized and characterized by ¹H‐NMR and FTIR. The synthesized epoxy monomer was cured with aromatic amine to improve the thermal property of epoxy/amine cured system. The glass transition temperature (T_g) and coefficient of thermal expansion (CTE) of the cured system were investigated by dynamic mechanical analysis and thermal mechanical analysis. The properties of the cured system were compared with the conventional bisphenol‐A type epoxy and mesogenic type epoxy system. The storage modulus of the tetra‐functional mesogenic epoxy cured systems showed the value of 0.96 GPa at 250 °C, and T_g‐less behavior was clearly observed. The cured system also showed a low CTE at temperatures above 150 °C without incorporation of inorganic components. These phenomena were achieved by suppression of the thermal motion of network chains by introduction of both mesogenic groups and branched structure to increase the cross linking density. The temperature dependency of the tensile property and thermal conductivity of the cured system was also investigated. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 46181.     

Toughening of epoxy resins by modified m-phenylene diamine having soft ether chain

A new soften curing agent for toughening epoxy resins was synthesized by m-phenylene diamine modified with epoxypropyl butyl ether. The curing processes of epoxy resin/modified m-phenylene diamine were traced by differential scanning calorimetry (DSC), then kinetic parameters, ΔE and n, were deduced. Fourier transform infrared (FTIR) analysis showed that the longer the reaction time was, the smaller the absorption peaks of epoxy group were. The results of the mechanical properties demonstrated that the impact property of the epoxy resin cured by modified m-phenylene diamine at the moderate temperature was better than that of cured by unmodified one because of the introduction of soft ether chain. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Preparation and analysis of a flexible curing agent for epoxy resin

A kind of novel aromatic amine bis(4‐nonyl‐2,5‐diamine‐penoxyl)alkylate (RA_n) as curing agents for epoxy resins were prepared through three steps of reactions using nonyl phenol and dibromoalkylate as materials. Dynamic mechanical analysis (DMA) indicated that the secondary relaxation for the resins cured by RA_n were generated by the nonyls in RA_n molecules when temperature was below ?50°C. Comparing with other reference resins, the enhancement for toughness of RA_n cured‐resins were at least 15%, which were contributed by such secondary relaxation. Furthermore, stiffness of the networks and thermal properties of the resins were not influent by the flexible groups (nonyl) in RA_n after curing, since the groups were located only in the branched chains of the networks. The mechanical and thermal properties of the new material have been significantly enhanced. The relevant method and procedure developed through this research have been granted Chinese patent recently (Yang and Gong, Chin. Pat. CN1978483A, 2007). © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of the structure of curing agents modified by epoxidized oleic esters on the toughness of cured epoxy resins

The aim of this study was to determine the effect of the ester carbon chain length of curing agents modified by epoxidized oleic esters on the toughness of cured epoxy resins. An amine‐terminated prepolymer (i.e., curing agent G) was synthesized from a bisphenol A type liquid epoxy resin and triethylene tetramine. The toughening curing agents (G1 and G2) were prepared by reactions of epoxidized oleic methyl ester and epoxidized oleic capryl ester, respectively, with curing agent G. Fourier transform infrared spectrometry was used to characterize the chemical structure of the curing agents. The effects of the carbon chain length of the oleic ester group in the curing agents on the toughness and other performances of the curing epoxy resins were investigated by analysis of the Izod impact strength, tensile strength, elongation at break, thermal properties, and morphology of the fracture surfaces of the samples. The results denote that the toughness of the cured epoxy resins increased with the introduction of oleic esters into the curing agents without a loss of mechanical properties and that the toughness and thermal stability of the materials increased with increasing ester carbon chain length. The toughness enhancement was attributed to the flexibility of the end carbon chains and ester carbon chains of the oleic esters in the toughening curing agents. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2011     

Bonding properties of epoxy resins containing two mesogenic groups

Liquid‐crystalline epoxy resins, with introduced aliphatic chains between two mesogenic groups, were synthesized and their adhesive bonding properties were compared to those of the bisphenol‐A–type epoxy resin and the liquid‐crystalline epoxy resin, previously reported. The bonding strength of the former resin system was higher than that of the two later systems. We suggest that the high bonding strength of the twin mesogenic epoxy resins, cured with an aromatic amine, was attributable to the large plastic deformation of the adhesive layer in the fracturing process. We also investigated the effects of the aliphatic chain length in the twin mesogenic epoxy resin on their dynamic mechanical and bonding properties. The bonding strength of the cured twin mesogenic epoxy resins increased with an increase in the aliphatic chain length. We suggest that the high bonding strength of the system introduced by the long aliphatic chain was attributable to the large plastic deformation of the adhesive layer because of the higher network mobility. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 3721–3729, 2004     

Structure and properties of novel epoxy resins containing naphthalene units and aliphatic chains

Two novel epoxy resins; namely, R1 and R2 were synthesized and characterized. These two resins were isomers and both contained naphthalene units and two symmetric flexible aliphatic ester chains terminated by epoxy groups. To investigate the influence of different structural isomers on the performance of these epoxy resins, they were both cured with various curing agents which results in the choosing of 4,4′-diaminodiphenylmethane (DDM) as the optimized curing agent. The curing technical temperature was obtained from extrapolated plots of T–β curve at different heating rates. The kinetic parameters, the activation energy (E _a) and the reaction order (n) were deduced by Kissnger’s isoconversional method and Crane equation. The moisture absorption and mechanical and thermal properties of the cured epoxy resins were investigated. Experimental results indicated that the R1/DDM and R2/DDM epoxy resins displayed improved mechanical performance without significant decrease in their important inherent properties, e.g., temperature of glass transition (T _g), moisture absorption and thermal properties when compared with the corresponding commercial biphenyl-type epoxy resins. The average inter-segment distances in R1/DDM and R2/DDM systems were 4.46 and 4.88 Å, respectively, which were measured by wide-angle X-ray diffraction. The result showed R1/DDM (1,5-di-substituted) was strongly hindered in comparison with R2/DDM (2,7-di-substituted) and E _a and T _g values of the R1/DDM were slightly higher than those of R2/DDM. Furthermore, mechanical properties and moisture absorption of the R1/DDM were lower than those of R2/DDM. Nevertheless, the position of the substituent only weakly affected the thermal properties and the reaction order (n).     

The synthesis and properties of tetrafunctional epoxy resins

N,N,N′,N′-tetraglycidyl-4,4′-diaminodiphenylalkane epoxy resins with alkyl substituents on the methylene carbon were synthesized and characterized. The thermal and dynamic mechanical properties of these resins when cured with diaminodiphenylsulfone were compared with those of the cured unsubstituted epoxy resin. Although the resins have similar structures, the cured resin from the unsubstituted epoxy has the higher polymer decomposition temperature and glass transition temperature. The substituted epoxy resins have higher dynamic Young's moduli and loss moduli.     

Synthesis,thermal properties,and flame retardance of the epoxy‐silsesquioxane hybrid resins

Epoxy/silsesquioxane‐OH (EP‐SDOH, ED) hybrid resins were prepared from cyclohexyl‐disilanol silsesquioxane (SDOH) and diglycidyl ether of bisphenol A via the reaction between silanol and the oxirane group, with the cobalt naphthanate as a catalyst. It was found that incorporation of SDOH allows the reaction between oxirane ring and Si? OH, and the silsesquioxane cage structure can be the main chain or as the side chain of the hybrid resin. The EP‐SDOH hybrid resins with various SDOH contents were cured by 4,4′‐diaminodiphenylsulphone, and the curing reaction was investigated by differential scanning calorimetry. The curing characteristics of EP‐SDOH hybrids had been observed to be influenced by the content of SDOH in the hybrid. The differential scanning calorimetry thermograms indicated that the EP‐SDOH hybrid exhibited a higher initial temperature, peak temperature, as well as final temperature than those of the pure epoxy resin when cured by the same curing agent 4,4′‐diaminodiphenylsulphone. The curing kinetic parameters were calculated by using the Ozawa method and the results indicated that EP‐SDOH hybrids possess the same curing mechanism as the pure epoxy resin. The properties of the cured EP‐SDOH hybrid resins such as the glass transition temperature (T_g), dynamic mechanical analysis, thermal stability, as well as the flame retardance were also investigated, and the results showed that introducing silsesquioxane‐OH unit into epoxy resin successfully modified the local structure, made the chain stiffness, restrict the chain mobility, and eventually improved thermal stability and flame retardance of epoxy resin. POLYM. ENG. SCI., 47:225–234, 2007. © 2007 Society of Plastics Engineers.     

Physical and Mechanical Interfacial Properties of Epoxy Copolymers Initiated by Latent Thermal Catalysts

Summary: The epoxy copolymers containing sulfone groups, diglycidyl ether of bisphenol‐A – Bisphenol‐S (DGEBA‐S) were synthesized by a hot‐melt method. The thermal properties of the epoxy systems initiated by two cationic latent catalysts, i.e., N‐benzylpyrazinium hexafluoroantimonate (BPH) and N‐benzylquinoxalinium hexafluoroantimonate (BQH), were investigated by using a dynamic DSC, DMA, and TGA. The mechanical properties were measured by single‐edge‐notched (SEN) beam fracture toughness tests. As a result, the thermal stability and mechanical interfacial properties of the DGEBA‐S/catalyst system were found to be higher than those of the DGEBA/catalyst. This was probably due to the fact that the introduction of sulfone groups with a polar nature to the main chain of the epoxy resins led to an improvement of thermal stability and toughness of the cured epoxy copolymers.

Conversion of the epoxy/catalyst systems as a function of curing temperature.     

Phthalonitrile‐epoxy blends: Cure behavior and copolymer properties

Binary blends composed of 4,4′‐bis(3,4‐dicyanophenoxy)biphenyl (biphenyl PN) and diglycidyl ether of bisphenol A (epoxy resin) and oligomeric n = 4 phthalonitrile (n = 4 PN) and epoxy resin were prepared. The cure behavior of the blends was studied under dynamic and isothermal curing conditions using differential scanning calorimetry, simultaneous thermogravimetric/differential thermal analysis, infrared spectroscopy, and rheological analysis. The studies revealed that phthalonitrile‐epoxy blends exhibited good processability and that they copolymerized with or without the addition of curing additive. In the absence of curing additive, the blends required higher temperatures and longer cure times. The thermal and dynamic viscoelastic properties of amine‐cured phthalonitrile‐epoxy copolymers were examined and compared with those of the neat epoxy resin. The properties of the epoxy resin improved with increasing biphenyl PN content and with n = 4 PN addition. Specifically, the copolymers exhibited higher glass transition temperatures, increased thermal and thermo‐oxidative stabililty, and enhanced dynamic mechanical properties relative to the commercially available epoxy resin. The results showed that the phthalonitrile‐epoxy blends and copolymers have an attractive combination of processability and high temperature properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Preparation and properties of halogen-free flame retardant epoxy resins with phosphorus-containing siloxanes

Novel epoxy resin modifiers, DOPO–TMDS and DOPO–DMDP were synthesized by addition reaction of divinylsiloxane with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). Halogen-free flame retardant epoxy resins were obtained through modification of o-cresol novolac epoxy resin cured by phenol novolac resin using DOPO–TMDS and DOPO–DMDP which were characterized by ¹H NMR, ¹³C NMR, ³¹P NMR and FT-IR measurements. Effects of the phosphorus-containing siloxanes on thermal stabilities, mechanical properties and flame retardant properties of the epoxy resins were investigated. The cured epoxy resins exhibited better mechanical properties and greatly improved flame retardant properties due to the presence of phosphorus-containing siloxanes. The cured epoxy resins with phosphorus loading of 2.0 wt% showed LOI values of 32–33 and achieved UL94V-0 ratings.     

Preparation and Application of a New Curing Agent for Epoxy Resin

A new curing agent based on palmitoleic acid methyl ester modified amine (PAMEA) for epoxy resin was synthesized and characterized. Diglycidyl ether of bisphenol A (DGEBA) epoxy resins cured with different content of PAMEA along with diethylenetriamine (DETA) were prepared. The mechanical properties, dynamic mechanical properties, thermal properties, and morphology were investigated. The results indicated that the PAMEA curing agent can improve the impact strength of the cured epoxy resins considerably in comparison with the DETA curing agent, while the modulus and strength of the cured resin can also be improved slightly. When the PAMEA/epoxy resin weight ratio is 30/100, the comprehensive mechanical properties of the cured epoxy resin are optimal; at the same time, the crosslinking density and glass transition temperature of the cured epoxy resin are maximal.     

Curing behavior of epoxy resin having hydroxymethyl group and different molecular weight distribution

o-Cresol novolac-type epoxy resins having hydroxymethyl group were synthesized. These epoxy resins were cured with a mixture of 4,4′-diaminodiphenylmethane and m-phenylenediamine (molar ratio, 6:4) as a hardener. Effects of molecular weight distribution of epoxy resins on curing behavior were studied. Curing behavior of epoxy resins with hardener were examined by differential scanning calorimetery (DSC), and cure reaction parameters were obtained. Viscoelastic properties of the cured epoxy resins were studied by dynamic mechanical analyzer. It was found that the lower the average molecular weight of the epoxy resin, that is, the higher the concentration of hydroxymethyl group, the shorter the onset time of exothermal reaction, the higher the rate constant (k), and the lower the activation energy (E_a) were. It was also found that glass transition temperature (T_g) of fully cured epoxy resins was higher than those of fully cured general novolac-type epoxy resins.     

Blended hybrids based on silsesquioxane–OH and epoxy resins

Blended hybrids based on silsesquioxane cyclohexyl trisilanol [STOH; i.e., (c‐C₆H₁₁)₇Si₇O₉(OH)₃] and epoxy resin 4,5‐epoxyhexyl‐1,2‐dimethyl acid diglycidyl ester (TDE‐85) were prepared with good compatibility of STOH up to 5 wt % with TDE‐85. The blended hybrid resins, with various STOH additions, were cured by 4,4′‐diaminodiphenylsulfone, and the curing reactions were investigated with differential scanning calorimetry. The incorporation of STOH increased the curing reaction of TDE‐85 for three active hydrogens existing in the STOH molecule. The storage moduli and glass‐transition temperatures of the cured hybrid resins were studied with dynamic mechanical analysis. The cured hybrids had higher storage moduli than the pure epoxy resins at lower temperatures and increased slightly even when the temperature was above the glass‐transition temperature. Two peaks appearing in tan δ curves indicated the block copolymer structure and two different glass‐transition temperatures of the cured hybrid resins. The thermal stability and flame retardancy of the cured hybrid resins were investigated with thermogravimetric analysis and limited oxygen index values, respectively. The results showed that introducing silsesquioxane–OH units into epoxy resins could improve the thermal stability and flame retardancy of the resins. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Amino‐capped aniline trimer/epoxy resin intercrosslinked networks

An amino‐capped aniline trimer (ACAT) in emeraldine base form was reacted with an epoxy resin to produce intercrosslinked networks. The quinoid structure of the ACAT was able to crosslink on curing and, thus, led to a very high glass‐transition temperature of the cured resin. The epoxy resin cured with the ACAT showed superior thermal properties over the resins cured with p‐phenylenediamine and 4,4′‐diamino diphenylamine. These findings were based on differential scanning calorimetry, IR, dynamic mechanical analysis, and thermogravimetric analysis data. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 222–226, 2006     

A novel flame retardant UV‐curable vinyl ester resin monomer based on industrial dipentene: Preparation,characterization, and properties

A novel bio‐based and flame‐retardant UV‐curable vinyl ester resin (VER) monomer named Diglycidyl ester of maleinized dipentene modified with dibutyphosphate and methacrylic anhydride (MDDMD) was synthesized from industrial dipentene via Diels‐Alder reaction, glycidylation, epoxy ring‐opening reaction, and esterification. Its chemical structures were characterized by Fourier transform infrared (FTIR) analysis and proton nuclear magnetic resonance (¹H‐NMR). In order to improve its flexibility, we prepared a series of copolymers under UV light radiation by mixing it with certain proportions of poly(ethylene glycol) dimethacrylate‐200 (PEGDMA‐200) which contained flexible groups. Their tensile property, curing degrees (CD), hardness, limiting oxygen index (LOI), dynamic mechanical thermal properties, and thermostability were all investigated. The cured mixed resins have a relatively high tensile strength of 10.05 MPa and curing degrees up to 92.5%. Both hardness (range: 50 to 23 HD) and LOI (range: 22.8% to 24.4%) of cured resins are improved with the increase of MDDMD content. Dynamic mechanical analysis (DMA) shows that their glass transition temperatures rise with the increase of MDDMD content. Thermogravimetric analysis (TGA) shows that the thermal stability of cured resins is enhanced with the increase of PEGDMA‐200 content, as the main thermal initial decomposition temperatures are all above 260 °C and char yield at 800 °C are above 18.10%. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 44084.     

The properties of epoxy–imide resin cured by phosphorylated diamines containing different alkyl groups on phosphorus

Cured networks of epoxy–imide resin cured with four types of phosphorylated diamine curing agents that contained different alkyl groups on phosphorus were studied. The structures of these novel phosphorus‐containing curing agents were confirmed by Mass, EA, IR, and ¹H‐NMR and ¹³C‐NMR spectra characterization. The reactivities were measured by differential scanning calorimetry (DSC). It is found that the reactivities were not affected by the types of alkyl groups in the curing agents. In thermal gravimetric analysis (TGA), those polymers that were obtained through the curing reactions between epoxy–imide resin and four curing agents (BAMP, BAEP, BAPP, and BABP) also demonstrated excellent thermal properties as well as a high char yield. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 141–147, 2002