共查询到20条相似文献,搜索用时 406 毫秒
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为解决高热流密度、大功耗电子器件散热问题,设计了一种串、并联结合的微小流道集成模块冷板进行局部强化传热。结合热源温度、流体压降、均温性等因素,基于流体传热仿真的评估方法对冷板进行换热性能分析和优化。在微小通道区域,研究对比矩形长直型、圆形扰流柱、菱形扰流柱3种不同流道结构形式对冷板传热性能及流动特性的影响。研究结果表明:使用菱形扰流柱形式的微流道与矩形长直流道相比,最高温度降低23.8℃,均温性减小7.7℃,能满足冷板表面最高温度≤65℃的要求。菱形扰流柱可以大幅强化换热效果,散热效果提高了27%左右,取得了较好的工作温度和均温性。 相似文献
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《电子技术与软件工程》2016,(8)
针对目前军用计算机数据处理系统集成化、高功率的发展趋势,液冷散热在数据处理系统热设计中的需求越来越必要。本文结合实际研究的项目,详细介绍了冷板、液冷机箱、液冷散热系统架构的设计模式、流道的设计及仿真分析、试验及测试验证等项目设计中的关键技术,形成一套具有高效散热的一体化解决方案。 相似文献
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散热不良导致的热失效是电子设备失效的主要形式,而微通道液冷冷板具有较高的换热效率.使用专业流体热仿真软件CFX分析相同边界条件下不同结构参数微通道冷板的热效性能,寻求最优设计方案. 相似文献
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本文研究了3种典型构型微通道冷板的散热特性,分别为冷板盖板与翅片焊接、冷板盖板与翅片不焊接以及翅片双面插排形式。对比了3种不同构型冷板的散热能力并对3种构型冷板的流阻特性进行了研究,发现翅片排布越密集流阻越大,越不利于整个液冷系统的流量分配。研究了冷却液流量对功率芯片温度的影响,发现冷却液流量较小时,流量增加可大幅降低芯片温度,当冷却液流量足够大时,冷却液流量对芯片温度影响不大。通过对不同翅片高度和不同单边厚度的冷板进行研究,发现翅片高度6mm工况下当翅片和盖板间隙0.3mm时冷板散热能力最强,其余厚度冷板翅片盖板间隙0.2mm时散热能力最强。冷板单边厚度越小,传热热阻越小,功率器件温度越低。 相似文献
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针对某大功率电源短时工作模式应用需要,对其进行热设计及热仿真。对发热热源进行分析,基于传热基本原理和实际工况,选择流道散热的方法对电源进行散热。对电源结构布局和散热布局进行了一体化设计,确定了散热的流道和流向,并重点阐述了导热胶的选取和散热结构的安装设计。构建了液冷散热仿真模型和自然散热仿真模型,对所设计的散热结构进行热仿真分析。液冷热仿真结果表明:在1 L/min、 60℃、0.3 MPa水冷条件下,最高温度为76℃,流导压降为0.05 bar。自然散热仿真结果表明:在环境温度为60℃的条件下,各工况最高温度为83.87℃。液冷散热和自然散热实测结果表明温升分别为10和25℃,验证了热仿真的正确性。 相似文献
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针对某瓦式一体化T/R组件全负荷工作时热耗大、散热要求高的问题,从组件结构布局、冷板设计和热学仿真的角度对其进行散热性能研究。结果表明:组件结构布局合理,冷板散热性能良好,主要设计参数如组件最高温度、冷板出入口流体温差、冷板表面最大温差以及冷板流道最大流阻均满足组件相关的热设计要求。 相似文献
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通过对大功率液冷散热冷板的设计过程分析,介绍一种利用计算机进行散热设计计算的方法,对常见的板翅式均温散热冷板的计算机辅助设计方法进行了论述。 相似文献
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利用冷却塔供冷实践初探 总被引:1,自引:0,他引:1
介绍冷却塔进行节能供冷的工作过程,通过对工程实例中发现的一些问题进行分析,提出利用开式冷却塔加板式热交换器并联于制冷机的冬季供冷系统是较经济实用的形式,且必须同时注意冷却塔冬季的热工曲线、冷却塔供冷与制冷机供冷工况切换、冷水机组配置、冷却水系统水处理问题等。 相似文献
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介绍冷却塔进行免费供冷的原理,通过对工程实例中发现的一些问题进行分析,提出利用开式冷却塔加板式热交换器并联于制冷机的冬季免费供冷系统是较经济实用的形式,且必须同时注意冷却塔冬季的热工曲线、冷却塔免费供冷与制冷机供冷工况切换、冷水机组配置、冷却水系统水处理问题等. 相似文献
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闭式冷却塔广泛应用于大型水冷空调系统中,其效率会对空调机组的COP产生很大影响.为了分析结构及运行参数对蒸发式闭式冷却塔冷却性能的影响,对冷却塔内部的换热机理进行分析,并建立了盘管传热传质的数学模型,选取了研究变量,确定了研究条件.结合Matlab改变单一参数对数学模型进行计算,得到结构及运行参数的改变对冷却水出口温度... 相似文献
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《Electronics Systems and Software》2006,4(6):34-39
With densely populated boards such as COM-Express modules, you need to look carefully at the system design to ensure that you are taking the heat away effectively. If you don't, you could find the design is less reliable than it ought to be. A frequently cited benefit of reduced processor size is reduced power consumption. But this is really only true at the level of the individual devices within the chip. The overall power reduction has not progressed at the rate of miniaturisation. As processors became smaller, we have packed more heat generation into that smaller space and the devices now run hotter. With this higher performance, thermal management needs to be addressed, especially in embedded computers that operate in warm environments inside a closed chassis or other densely packed enclosures 相似文献
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Cooling a Microprocessor Chip 总被引:3,自引:0,他引:3
Mahajan R. Chiu C. Chrysler G. 《Proceedings of the IEEE. Institute of Electrical and Electronics Engineers》2006,94(8):1476-1486
Increasing microprocessor performance has historically been accompanied by increasing power and increasing on-chip power density, both of which present a cooling challenge. In this paper, the historical evolution of power is traced and the impact of power and power density on thermal solution designs is summarized. Industrial and academic researchers have correspondingly increased their focus on elucidating the problem and developing innovative solutions in devices, circuits, architectures, packaging and system level heatsinking. Examples of some of the current packaging and system thermal solutions are provided to illustrate the strategies used in their design. This is followed by a brief discussion of some of the future trends in demand and solution strategies that are being developed by academic and industrial researchers to meet these demands. Potential opportunities and limitations with these strategies are reviewed. 相似文献
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Microscale thermoelectric cooling elements (TECs) are being proposed to cool down an integrated circuit to maintain its performance. The maximum cooling power of microscale TECs is significantly reduced by the interfacial resistance. For our particular application, we calculate the optimal dimension of the TECs, made of Bi2Te3, that reduce the temperature at a hotspot on an IC chip by 10°C. By the one-dimensional analytical model that we developed and numerical solutions of TEC equations using MATLAB©, we obtain performance characteristics that relate the cooling power density to other control variables and material constants. The optimal dimension of microscale TECs is calculated for cooling at a hotspot region by a range of temperature differences, for example from 10°C to 50°C. Further, the percentage change in the optimal thickness for various thermal resistances and electrical contact resistances can be predicted. These results act as a good guideline for two-dimensional analysis and assembly of TECs. 相似文献