电沉积法制备SnS薄膜

采用了电沉积在SnO2透明导电玻璃上制备了硫化锡（SnS)薄膜，并对用电化学法实现Sn和S共沉积的条件参数进行了理论探讨，实验中，利用SnCl2和Na2S2O3的混合水溶液作为电沉积液制备了均匀的SnS薄膜，对实验参数进行了优化，对薄膜进行了X－射线衍射（XRD），扫描电子显微（SEM）测量及光学测试，。实验发现，制备的薄膜为多晶的斜方晶系结构，晶粒大小约为150nm，直接光学带隙在1．36－1．73eV之间可调。     

LBL法制备Cu3SbS4薄膜

针对水溶液化学沉积法沉积过程复杂且难于控制的缺点,利用LBL(layer-by-layer)法,在玻璃基片上制备出了Cu3SbS4薄膜。即首先在玻璃基片上沉积Sb2S3薄膜,然后再在其上制备CuS薄膜,最后进行退火处理。探讨了薄膜的制备机理、生长速度、结构特性和光学特性。制备的薄膜为多晶Cu3SbS4(四方晶系)结构,厚度为344nm,直接光学带隙约为0.47eV。     

CoS QDs/PDMS纳米复合薄膜的制备与红外特性研究EI北大核心CSCD

过渡金属硫属化合物(TMCs)由于具有优异的光学、电学及光电等特性,被广泛应用于光催化、太阳电池、激光器等领域。作为一类典型的TMCs材料,硫化钴量子点(CoS QDs)因禁带宽度较窄而具有优异的近红外吸收特性,有望用于红外技术领域。文中采用液相超声剥离法制备了CoS QDs,再用共混法制备得到CoS QDs/PDMS纳米复合薄膜,并对它们的光学性质进行了研究,结果表明:CoS QDs的平均尺寸约为5 nm,大小均匀,呈球形;CoS QDs与CoS QDs/PDMS纳米复合薄膜在红外波段均存在明显的吸收和发光特性,且复合薄膜的红外吸收特性优于CoS QDs薄膜;随着激发光波长的增加,纳米复合薄膜的光致发光(PL)峰出现了红移,表现出明显的Stokes位移效应和激发波长依赖性。CoS QDs/PDMS纳米复合薄膜优异的红外吸收和发光特性,表明其在红外探测、荧光成像、纳米光子器件等研究领域中具有重要的潜在应用价值,有望成为一种新型红外探测材料。     

Cu2SnS3薄膜的制备及性能研究

采用LBL(1aYer-by-layer)法制备了Cu2SnS3薄膜。即首先采用电化学方法在SnO2衬底上制备SnS薄膜,然后又在其上用化学沉积法制备CuS薄膜,最后进行退火处理得到厚度约为960nm的CuzSnS3薄膜。探讨了薄膜的制备机理、生长速度、结构和光学特性。制备的薄膜为多晶(Cu2SnS3)72z(三斜或假单斜晶系)结构,其直接光学带隙约为1．05eV。     

Cu2SnS3薄膜的制备及性能研究

采用LBL(layer-by-layer)法制备了Cu2SnS3薄膜.即首先采用电化学方法在SnO2衬底上制备SnS薄膜,然后又在其上用化学沉积法制备CuS薄膜,最后进行退火处理得到厚度约为960 nm的Cu2SnS3薄膜.探讨了薄膜的制备机理、生长速度、结构和光学特性.制备的薄膜为多晶(Cu2SnS3)72z(三斜或假单斜晶系)结构,其直接光学带隙约为1.05 eV.     

偏置电压对PECVD法沉积TiO2薄膜的结构和性能影响

该文采用射频等离子体增强化学气相沉积法制备了TiO<,2>薄膜样品,并通过椭圆偏振仪、红外光谱仪和扫描电子显微镜测量了薄膜厚度、组织结构和光学特性.结果表明:沉积速率随偏置电压升高而增大,在偏置电乐为10V时,沉积速率达到最大值为3.9nm/min,然后沉积速率下降,偏置电压在20V以后,沉积速率基本不变为3.0nm/...     

沉积电流对ZnO薄膜的结构和光学性质的影响

采用阴极电沉积的方法在导电玻璃上制备了ZnO薄膜.研究了沉积电流对薄膜结构特性和光学特性的影响.XRD分析表明ZnO薄膜为纤锌矿结构,晶粒尺寸随电流的增大而增大,择优取向随电流的变化发生了转变.光学测试表明样品的透射率最大值可达84%,禁带宽度随电流变化不大,接近于3.3 eV.     

溅射功率对In2S3薄膜结构及其性能的影响

采用磁控溅射法,在玻璃基底上一步沉积In2S3薄膜.研究了溅射功率对In2S3薄膜的成分、结构、表面形貌和光电性能的影响.结果表明:所制备的所有薄膜均为β-In2S3,无杂相存在,且具有(222)面择优生长特性.溅射功率对薄膜的成分、厚度和结晶度具有明显的影响,并因此影响薄膜的光学和电学性能.薄膜在100 W沉积时最接近化学计量比,薄膜的透过率随着溅射功率增大在500 nm波段附近显著提高,禁带宽度达到2.45 eV,同时电流密度增大两个数量级.     

无水化学沉积法制备Sb2S3薄膜

采用无水化学沉积(NCBD)法在玻璃基片上制备了Sb2S3薄膜。先用无水乙醇将4．0mL浓度为0．1mol／L的SbCl3乙醇溶液稀释至39．6mL,再加入0．4mL浓度为0．5mol／L的CH3CSNH2乙醇溶液,搅拌均匀后垂直放入玻璃基片,在15～18℃温度下沉积72h后,进行退火处理。利用X射线衍射(XRD)和扫描电子显微镜(SEM)对薄膜在退火前后的结构特性进行了研究,利用光学测试计算了薄膜的光学带隙。结果表明,高温退火使薄膜由退火前的非晶态转变为多晶的Sb2S3结构(正交晶系),薄膜的直接光学带隙从1．86eV降低为1.75eV。     

乙醇对含水氧化镍薄膜电色特性的影响

研究了在脉冲电沉积法制备含水氧化镍薄膜中,乙醇对薄膜的结构特性及电色特性的影响。实验表明,在电沉积液中加入乙醇将明显改变材料的结晶特性,并对提高薄膜的变色速度起着重要的作用。     

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 °C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time. After aging for 200 h, the solder joints of SAC, SAC-0.5Ni and -1Ni presented duplex intermetallic compound (IMC) layers regardless of the initial interfacial structure on as-reflowed joints, whose upper and lower IMC layers were comprised of (CuNi)₆Sn₅ and (NiCu)₃Sn₄, respectively. Only a single (NiCu)₃Sn₄ IMC layer was ever observed at the SAC-2Ni/Ni interface on whole aging process. Based on the compositional analysis, the amount of Ni within the IMC regions increased as the proportion of Ni addition increased. The IMC (NiCu)₃Sn₄ layer thickness on the interface of SAC and SAC-0.5Ni grew more slowly when compared to that of SAC-1Ni and -2Ni, while for the (CuNi)₆Sn₅ layer the reverse is true. Except the IMCs sizes are increased with increased aging time, the interfacial IMCs tended to transfer their morphologies to polyhedra. In all composite joints testing, the shear strengths were approximately equal to non-composite joints. The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability.     

有机发光二极管中ADN掺杂ErQ的1.54μm电致发光

自行设计了基于8-羟基喹啉铒(ErQ)为发射层(EMLs)和二硝酰胺铵(ADN)为蓝光主体材料的近红外有机发光二级管.器件的基本结构为(p-Si/NPB/EML/Bphen/Bphen:Cs2CO3/Sm/Au),设计并比较了三套不同发射层结构(ErQ/ADN为双层结构器件,(ErQ/ADN)×3为多层结构器件,ErQ:ADN为掺杂结构器件)的器件.三组器件在一定的偏压下,均可发出1.54μm的光,对应三价铒离子4I13/2→4I15/2的跃迁.其中,ADN:ErQ(1∶1)掺杂结构的近红外电致发光强度是ADN/ErQ双层结构中的三倍.此外,不同掺杂浓度的ADN:ErQ复合膜做了以下表征:吸收谱、光致发光谱和荧光寿命谱.实验结果证实了在近红外电致发光过程中存在从ADN主体分子到ErQ发射分子的高效率的能量转移.     

BNBST无铅压电陶瓷的制备工艺研究

设计了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3（BNBST[100x-100a／100b]）无铅压电陶瓷新体系。该体系压电陶瓷具有工艺特性及压电响应好，压电常数高的特点，且有实际应用前景的新型压电陶瓷材料体系。采用传统的陶瓷工艺制备了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3无铅压电陶瓷，研究了制备工艺参数对其物化结构性能的影响。生料的热重-差热（TGA-DTA）分析表明，粉料合成过程中，先是SrTiO3、BaTiO3的形成，然后是（Bi0．5Na0．5）Tio，的形成，同时三者形成固溶体；密度测试表明，陶瓷的体积密度随烧结温度的升高而增大，可较易获得理论密度94％的陶瓷；X-射线能谱分析（EDAX）研究表明，陶瓷的Bi、Na的挥发随着烧结温度的升高而加剧。研究结果表明，要制备性能优良的无铅压电陶瓷，需要精确控制制备工艺。     

Emerging interconnects: a state-of-the-art review and emerging solutions

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years.     

聚对苯撑苯并双(口恶)唑发光及其器件制备

采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加.     

钠离子对poly(dT).poly(dA).poly(dT)三螺旋DNA分子呼吸模式的影响

利用分子结构的螺旋对称性,建立了一个包括钠离子的三链DNA分子poly(dT)*poly(dA)*poly(dT)的晶格动力学模型,计算了poly(dT)*poly(dA)*poly(dT)的氢键呼吸模式.结果发现钠离子的加入明显地淬灭了位于较低频率的几个最为强烈的Hoogensteen氢键呼吸模式,而对Watson-Crick氢键呼吸模式影响不明显,这说明钠离子能提高poly(dT)*poly(dA)*poly(dT)三螺旋结构的稳定性.该计算结果很好地解释了poly(dT)*poly(dA)*poly(dT)的热融化实验.     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

Arsenic deposition as a precursor layer on silicon (211) and (311) surfaces

We investigate the properties of arsenic (As) covered Si(211) and Si(311) surfaces by analyzing data from x-ray photoelectron spectroscopy (XPS) and low-energy electron diffraction (LEED) images. We then create a model using total surface energy calculations. It was found that both Si(211) and Si(311) had 0.68±0.08 surface As coverage. Si(211) had 0.28±0.04 Te coverage and Si(311) had 0.24±0.04 Te coverage. The Si(211) surface replaces the terrace and trench Si atoms with As for a lower surface energy, while the Si edge atoms form dimers. The Si(311) surface replaces all terrace atoms and adsorbs an As dimer every other edge site. These configurations imply an improvement in the mean migration path from the bare silicon surface by allowing the impinging atoms for the next epitaxial layer, tellurium (Te), to bind at every other pair of edge atoms, and not the step terrace sites. This would ensure a nonpolar, B-face growth.     

Joint estimation of TOA and DOA in IR-UWB system using a successive propagator method

Impulse radio ultra-wideband (IR-UWB) ranging and positioning require accurate estimation of time-of-arrival (TOA) and direction-of-arrival (DOA). With receiver of two antennas, both of the TOA and DOA parameters can be estimated via two-dimensional (2D) propagator method (PM), in which the 2D spectral peak searching, however, renders much higher computational complexity. This paper proposes a successive PM algorithm for joint TOA and DOA estimation in IR-UWB system to avoid 2D spectral peak searching. The proposed algorithm firstly gets the initial TOA estimates in the two antennas from the propagation matrix, then utilises successively one-dimensional (1D) local searches to achieve the estimation of TOAs in the two antennas, and finally obtains the DOA estimates via the difference in the TOAs between the two antennas. The proposed algorithm, which only requires 1D local searches, can avoid the high computational cost in 2D-PM algorithm. Furthermore, the proposed algorithm can obtain automatically paired parameters and has better joint TOA and DOA estimation performance than conventional PM algorithm, estimation of signal parameters via rotational invariance techniques algorithm and matrix pencil algorithm. Meanwhile, it has very close parameter estimation to that of 2D-PM algorithm. We have also derived the mean square error of TOA and DOA estimation of the proposed algorithm and the Cramer-Rao bound of TOA and DOA estimation in this paper. The simulation results verify the usefulness of the proposed algorithm.     

系统级封装新型埋入式电源滤波结构的研究

在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65～4GHz的频带内隔离深度可达-40～75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证.