A 256×256 pixel smart CMOS image sensor for line-based stereovision applications

This paper presents a 256×256 pixel smart CMOS image sensor for line based vision applications. By combining the edge-based analog processing technique with an active pixel array, a dense and fast on-chip analog image processing has been achieved. The on-chip processing unit includes (1) an analog histogram equalizer, (2) a programmable recursive Gaussian filter, (3) a spatio-temporal differentiator, and (4) a local extrema extractor. An electronic shutter is applied to the active pixel sensor array in order to adapt the exposure time as a function of global illumination. The on-chip histogram equalizer extends the image into a constant and optimal range for all the following processing operators and gives a stable and predictable precision of the analog processing. A prototype chip has been designed and fabricated in a standard 0.8-μm CMOS process with double poly and double metal, giving a pixel pitch of 20 μm and die size of 7×7 mm². A line processing time is compatible with TV line scan period. The worst case power consumption measures 40 mA at 5 V     

A High-Speed, High-Sensitivity Digital CMOS Image Sensor With a Global Shutter and 12-bit Column-Parallel Cyclic A/D Converters

This paper presents a high-speed, high-sensitivity 512times512 CMOS image sensor with column parallel cyclic 12-bit ADCs and a global electronic shutter. Each pixel has a charge amplifier for high charge-to-voltage conversion gain despite of using a large-size photodiode, and two sample-and-hold stages for the global shutter and fixed pattern noise (FPN) canceling. High-speed column-parallel cyclic ADC arrays with 12-bit resolution having a small layout size of 0.09 mm ² are integrated at both sides of image array. A technique for accelerating the conversion speed using variable clocking and sampling capacitance is developed. A digital gain control function using 14-bit temporal digital code is also set in the column parallel ADC. The fabricated chip in 0.25-mum CMOS image sensor technology achieves the full frame rate in excess of 3500 frames/s. The in-pixel charge amplifier achieves the optical sensitivity of 19.9 V/lxmiddots. The signal full scale at the pixel output is 1.8 V at 3.3-V supply and the noise level is measured to be 1.8mV_rms, and the resulting signal dynamic range is 60 dB     

基于相对比率的高帧频图像采集器设计与实现

为了在机器视觉应用中是实现高动态范围（high dynamic range,HDR）图像采集,提出了一种基于检测像素相对比率的新型图像采集系统。提出的图像采集器使用全差分电路检测信号比,由基于数字计数器的紧凑列并行读出电路捕捉像素的脉冲宽度调制输出。并设计了相应的光电流比检测像素方法,能独立地捕捉局部场景特征。实验结果显示提出的COMS图像传感器性能较好,当标称帧频为9600帧/秒时,提出的32×32像素阵列原型CMOS图像传感器消耗了4 mW的功率;当最大帧频为24000帧/秒时,此图像传感器消耗了6.8 mW的功率。     

高性能TDI扫描式红外传感器读出电路研究

扫描式红外成像传感器在遥测遥感、卫星成像等远距离成像领域具有广泛的应用。为了缓解信噪比相对较低而影响图像质量的问题,提出了一种时间延时积分(TDI)型读出电路。该读出电路由电容跨阻放大器(CTIA)像素电路阵列、并行TDI电路、多路开关选择电路和输出缓冲器等组成。为实现对宽动态范围光电流的处理,CTIA电路设计有多档可选增益,且非线性度小于0.3%。该读出电路采用0.35 μm CMOS工艺设计与制造,芯片面积约为1.3 mm×20 mm,采用5 V电源时功耗小于60 mW。为了评估1024×3 TDI读出电路的功能,采用了对TDI输入端注入不同电压激励的方式进行测试,测试结果验证了所提出的设计方案。     

长线列CMOS图像传感器的性能优化设计

设计了一种基于电容反馈跨阻放大器(CTIA)的长线列CMOS图像传感器。为减小器件功耗和面积,采用基于单端四管共源共栅运算放大器。为提高信号读出速率,采用没有体效应的PMOS源跟随器,同时减小PMOS管的宽长比,有效减小了输出总线寄生电容的影响。在版图设计上,采用顶层金属走线,降低寄生电阻和电容,提高了长线列CMOS图像传感器的读出速率和输出线性范围。采用0.35μm 3.3V标准CMOS工艺对传感器进行流片,得到器件像元阵列为5×1 030,像元尺寸为20μm×20μm。测试结果表明:该传感器在积分时间为1ms、读出速率为4MHz的情况下工作稳定,其线性度达到98%,线性动态范围为76dB。     

一种新型大动态范围CMOS图像传感器

提出了一种具有新型像素结构的大动态范围CMOS图像传感器,通过调整单个像素的积分时间来自适应不同的局部光照情况,从而有效提高动态范围。设计了一种低延时、低功耗、结构简单的新型pixel级电压比较器及基于可逆计数器的时间-电压编码电路。采用0.6μm DPDM标准数字CMOS工艺参数对大动态范围像素单元电路进行仿真,积分电容电压Vcint与光电流呈良好的线性关系,其动态范围可达126dB。在3.3V供电电压下,单个像元功耗为2.1μW。     

A sensitivity and linearity improvement of a 100-dB dynamic range CMOS image sensor using a lateral overflow integration capacitor

In a CMOS image sensor featuring a lateral overflow integration capacitor in a pixel, which integrates the overflowed charges from a fully depleted photodiode during the same exposure, the sensitivity in nonsaturated signal and the linearity in saturated overflow signal have been improved by introducing a new pixel circuit and its operation. The floating diffusion capacitance of the CMOS image sensor is as small as that of a four transistors type CMOS image sensor because the lateral overflow integration capacitor is located next to the reset switch. A 1/3-inch VGA format (640/sup H//spl times/480/sup V/ pixels), 7.5/spl times/7.5 /spl mu/m/sup 2/ pixel color CMOS image sensor fabricated through 0.35-/spl mu/m two-poly three-metal CMOS process results in a 100 dB dynamic range characteristic, with improved sensitivity and linearity.     

新型电流镜积分红外量子阱探测器读出电路的设计分析

设计了一种偏压可调电流镜积分(Current Mirroring Integration,CMI)红外量子阱探测器焦平面CMOS读出电路。该电路适应根据偏压调节响应波段的量子阱探测器,其中探测器偏压从0.61 V到1.55V范围内可调。由于CMI的电流反馈结构,使得输入阻抗接近0,注入效率达0.99;且积分电容可放在单元电路外,从而可以在一定的单元面积下,增大积分电容,提高了电荷处理能力和动态范围;为提高读出电路的性能,电路加入撇除(Skimming)方式的暗电流抑制电路。采用特许半导体(Chartered)0.35 m标准CMOS工艺对所设计的电路(16×1阵列)进行流片,测试结果表明:在电源电压为3.3V,积分电容为1.25pF时,电荷处理能力达到1.3×107个电子;输出摆幅达到1.76V;功耗为25mW;动态范围为75dB;测试结果显示CMI可应用于高性能FPA。     

A charge pump for driving CMOS active pixel reset

To overcome the limitation of low image signal swing range and long reset time in four Iransistor CMOS active pixel image sensor, a charge pump circuit is presented to improve the pixel reset performance. The charge pump circuit consists of two stage switch capacitor serial voltage doubler. Cross-coupled MOSFET switch structure with well close and open performance is used in the second stage of the charge pump. The pixel reset transistor with gate voltage driven by output of the pump works in linear region, which can accelerate reset process and complete reset is achieved. The simulation results show that output of the charge pump is enhanced from 1.2 to 4.2 V with voltage ripple lower than 6 inV. The pixel reset time is reduced to 1.14 ns in dark. Image smear due to non-completely reset is elIminated and the image signal swing range is enlarged. The charge pump is successfully embedded in a CMOS image sensor chip with 0.3 × 10^6 pixels.     

A novel monolithic ultraviolet image sensor based on a standard CMOS process

We present a monolithic ultraviolet(UV) image sensor based on a standard CMOS process.A compact UV sensitive device structure is designed as a pixel for the image sensor.This UV image sensor consists of a CMOS pixel array,high-voltage switches,a readout circuit and a digital control circuit.A 16×16 image sensor prototype chip is implemented in a 0.18μm standard CMOS logic process.The pixel and image sensor were measured. Experimental results demonstrate that the image sensor has a high sensitivity of 0.072 V/(mJ/cm~2) and can capture a UV image.It is suitable for large-scale monolithic bio-medical and space applications.     

A single-chip CMOS APS camera with direct frame difference output

A complementary metal-oxide-semiconductor (CMOS) active pixel sensor (APS) camera chip with direct frame difference output is reported in this paper. The proposed APS cell circuit has in-pixel storage for previous frame image data so that the current frame image and the previous frame image can be read out simultaneously in differential mode. The signal swing of the pixel circuit is maximized for low supply voltage operation. The pixel circuit occupies 32.2×32.2 μm² of chip area with a fill factor of 33%. A 128×98 element prototype camera chip with an on-chip 8-bit analog-to-digital converter has been fabricated in a 0.5-μm double-poly double-metal CMOS process and successfully tested. The camera chip consumes 56 mW at 30 frames/s with 3.3 V power supply     

一种6T像素全局曝光CMOS图像传感器

提出了一种基于6T像素结构的全局曝光CMOS图像传感器。通过采用PPD结构的6T像素、高复位电平和低阈值器件,提高了动态范围,并优化设计了像素单元的版图,使之获得较高的填充系数;模拟读出电路部分,通过采用双采样、增益放大和减小列级固定模式噪声(FPN)处理,以及对列选控制电路进行优化,减小了对全局PGA的运放设计要求。芯片的工作频率为20MHz,动态范围为66dB,实现了全局曝光方式CMOS图像传感器的设计。     

CMOS图像传感器用像素级双采样存储技术

多次曝光技术是扩展CM O S APS图像传感器动态范围较为有效的方法,但多于两次的曝光,信号处理复杂,使传感器的帧频受到限制,而像素级双采样存储技术将两次曝光采样及图像组合处理在像素内实现,在获得高动态范围的同时,可有效提高图像实时处理的速度,并且可以工作于高速同步曝光模式。     

New Active Digital Pixel Circuit for CMOS Image Sensor

A new active digital pixel circuit for CMOS image sensor is designed consisting of four components: a photo-transducer, a preamplifier, a sample & hold (S & H) circuit and an A/D converter with an inverter. It is optimized by simulation and adjustment based on 2 μm standard CMOS process. Each circuit of the components is designed with specific parameters. The simulation results of the whole pixel circuits show that the circuit has such advantages as low distortion, low power consumption, and improvement of the output performances by using an inverter.     

Global Shutter CMOS Image Sensor With Wide Dynamic Range

A novel concept for global shutter CMOS image sensors with wide dynamic range (WDR) implementation is presented. The proposed imager is based on the multisampling WDR approach and it allows an efficient global shutter pixel implementation achieving small pixel size and high fill factor. The proposed imager provides wide DR by applying adaptive exposure time to each pixel, according to the local illumination intensity level. Two pixel configurations, employing different kinds of a 1-bit in-pixel memory were implemented. An imager, including two different pixels was designed and simulated in 0.18-mum CMOS technology. System architecture and operation are discussed and simulation results are presented.     

A low power dissipation high-speed CMOS image sensor with column-parallel sigma–delta ADCs

A 60frames/s CMOS image sensor with column-parallel inverter-based sigma–delta (ΣΔ) ADCs is proposed in this paper. In order to improve the robustness of the inverter, instead of constant power supply, two buffers are designed to provide power supply for inverters. Instead of using of an operational amplifier, an inverter-based switch-capacitor (SC) circuit is adopted to low-voltage low-power ΣΔ modulator. Detailed analysis and design optimization are provided. Due to the use of the inverter-based ΣΔ ADCs, the conversion speed is improved while reducing the area and power consumption. The proposed CMOS image sensor has been fabricated with 0.18 μm CMOS process. The measurement results show that the random noise (RN) is 7e_rms⁻, the pixel conversion gain is 100 μV/e⁻. Since the measured full well capacity of the pixel is 25000e⁻, the CMOS image sensor achieves a 71 dB dynamic range (DR). The total power consumption at 60frame/s is 58.2 mW.     

PWM digital pixel sensor based on asynchronous self-resetting scheme

In this letter, a pulse-width modulated digital pixel sensor is presented along with its inherent advantages such as low power consumption and wide operating range. The pixel, which comprises an analog processor and an 8-bit memory cell, operates in an asynchronous self-resetting mode. In contrast to most CMOS image sensors, in our approach, the photocurrent signal is encoded as a pulse-width signal, and converted to an 8-bit digital code using a Gray counter. The dynamic range of the pixel can be adapted by simply modulating the clock frequency of the counter. To test the operation of the proposed pixel architecture, an image sensor array has been designed and fabricated in a 0.35-/spl mu/m CMOS technology, where each pixel occupies an area of 45/spl times/45 /spl mu/m/sup 2/. Here, the operation of the sensor is demonstrated through experimental results.     

全局快门CMOS图像传感器研究进展

全局快门CMOS图像传感器广泛应用于高速运动物体的成像,包括机器视觉、工业测量、航空航天,以及军事应用等领域.介绍了全局快门CMOS图像传感器的主要类型,具体分析了灵敏度、寄生光灵敏度、读出噪声、动态范围和帧频等性能参数的研究进展.最后对国内外有代表性的全局快门CMOS图像传感器产品进行了介绍.     

A 128×128-pixel standard-CMOS image sensor with electronicshutter

A 128×128-pixel image sensor with a 20 s-10^-4 s electronic shutter has been integrated in a 1.2-μm digital CMOS technology. The pixel cell consists of four PMOS transistors and a photodiode with antiblooming suppression. Each pixel measures 24 μm by 24 μm and has a fill factor of 25%. Current is used to transfer pixel signals to the column readout amplifiers in order to minimize voltage swings on the highly capacitive column lines. Correlated double sampling is used to reduce intracolumn fixed pattern noise. The saturation voltage is 470 mV. The peak output signal to noise ratio is 45 dB, and the optical dynamic range is 56 dB. The frame transfer rate is 1.7 ms per frame     

Time-Delay-Integration Architectures in CMOS Image Sensors

Difficulty and challenges of implementing time-delay-integration (TDI) functionality in a CMOS technology are studied: synchronization of the samples forming a TDI pixel, adder matrix outside the array, and addition noise. Existing and new TDI sensor architecture concepts with snapshot shutter, rolling shutter, or orthogonal readout are presented. An optimization method is then introduced to inject modulation transfer function and quantum efficiency specification in the architecture definition. Moderate spatial and temporal oversamplings are combined to achieve near charge-coupled device (CCD) class performances, resulting in an acceptable design complexity. Finally, CCD and CMOS dynamic range and signal-to-noise ratio are conceptually compared.