InGaAs／AlGaAs单量子阱激光器低阈值激射

研制了InGaAs/AlGaAs SQW激光器,对其工作特性如阈值电流密度、激射波长、特征温度、远场分布等进行了研究. 用MOCVD方法生长制备了InGaAs/AlGaAs分别限制单量子阱结构材料,得出其各层组分和能带分布.首先在GaAs衬底上生长GaAs缓冲层和AlGaAs波导层,然后生长窄能带的AlGaAs量子阱势垒层,再继续生长InGaAs量子阱有源区.其后继续生长AlGaAs势垒层、高Al组分AlGaAs波导层和GaAs高掺杂欧姆接触层.我们发现在低温范围里(160 K～220 K)阈值电流密度随温度升高而减小,与普通量子阱激光器正相反,表现出负的特征温度.随着温度进一步提高,阈值电流密度表现出指数式增大.300 K下腔长2000 μm的激光器最低的阈值电流密度约为200 A/cm2.(OD7)     

MOCVD生长1．06μm InGaAs／GaAs量子阱LDs

用低压MOCVD生长应变InGaAs/GaAs量子阱,采用中断生长、应变缓冲层(SBL)、改变生长速度和调节Ⅴ/Ⅲ等方法改善InGaAs/GaAs量子阱的光致发光(PL)质量。PL结果表明,10s生长中断结合适当的SBL生长的量子阱PL谱较好。该量子阱应用于1.06μm激光器的制备,未镀膜的宽条激光器(100μm×1000μm)有低阈值电流密度(110A/cm2)和高的斜率效率(0.256W/A,per.facet)。     

1.55μm张应变InGaAsP/InGaAsP量子阱偏振不灵敏半导体光放大器的优化设计

优化设计了 1.5 5 μm In Ga As P/In Ga As P张应变量子阱偏振不灵敏半导体光放大器的结构 .利用 k· p方法计算了多量子阱的价带结构 ,计算中考虑了 6× 6有效质量哈密顿量 .从阱宽、应变、注入载流子密度等方面计算了量子阱模式增益的偏振相关性 .     

高功率GaSb基2.6微米InGaAsSb/AlGaAsSb I型量子阱室温工作激光器

成功制备出2.6μm GaSb基I型InGaAsSb/AlGaAsSb量子阱高功率半导体激光器.利用分子束外延设备(MBE)生长出器件的材料结构.为了得到更好的光学质量, 将量子阱的生长温度优化至500℃, 并将量子阱的压应变调节为1.3%.制备了脊宽100 μm 、腔长1.5 mm的激光单管器件.在未镀膜下该激光器实现了最大328 mW室温连续工作, 阈值电流密度为402 A/cm2, 在脉冲工作模式下, 功率达到700 mW.     

2μm InGaAsSb/AlGaAsSb应变补偿量子阱结构的数值研究

为了降低2μm半导体激光器的阈值电流并提高器件的输出功率,设计了InGaAsSb/AlGaAsSb应变补偿量子阱结构,并利用SimLastip软件对器件进行了数值模拟.研究表明,在势垒中适当引入张应变可以改善量子阱的能带结构,提高对载流子的限制能力.当条宽为120 μm、腔长为1 000 μm时,采用应变补偿量子阱结构的激光器的阈值电流为91 mA,斜率效率为0.48 W/A.与压应变量子阱激光器相比,器件性能得到明显的改善.     

干法刻蚀对InAsP/InGaAsP应变多量子阱发光特性的影响

采用气态源分子束外延(GSMBE)生长了具有不同阱宽的InAsP/InGaAsP应变多量子阱,并对干法刻蚀前、干法刻蚀及湿法腐蚀不同厚度覆盖层后的多量子阱光致发光(PL)谱进行了表征.测量发现干法刻蚀量子阱覆盖层一定厚度后量子阱光致发光强度得到了明显的增强.这与干法刻蚀后量子阱覆盖层表面粗糙度变化及量子阱内部微结构变化有关.     

量子阱半导体光放大器的增益偏振相关性研究

应用能带计算理论,研究了张应变量大小、量子阱厚度对量子阱半导体光放大器(SOA)中的增益偏振相关性的影响.采用张应变量子阱为有源区,设计了增益偏振无关的1.55 μm的SOA,它可以在较宽的载流子浓度范围、较宽的光波长范围内满足增益对偏振的不灵敏要求.另外,还采用混合应变量子阱为有源区,设计了增益偏振无关的1.31μm的SOA.     

干法刻蚀对InAsP/InGaAsP应变多量子阱发光特性的影响

采用气态源分子束外延(GSMBE)生长了具有不同阱宽的InAsP/InGaAsP应变多量子阱,并对干法刻蚀前、干法刻蚀及湿法腐蚀不同厚度覆盖层后的多量子阱光致发光(PL)谱进行了表征.测量发现干法刻蚀量子阱覆盖层一定厚度后量子阱光致发光强度得到了明显的增强.这与干法刻蚀后量子阱覆盖层表面粗糙度变化及量子阱内部微结构变化有关.     

InGaN/GaN多量子阱的变温发光特性研究

采用低压金属有机化学沉积方法制备了InGaN/GaN多量子阱.变温PL测量发现,量子阱发光强度具有良好的温度稳定性,随着温度升高(10～300K),发光强度只减小到1/3左右.分析认为,InGaN/GaN多量子阱的多峰发光结构是由多量子阱的组分及阱宽的不均匀引起的.随着温度升高,GaN带边及量子阱的光致发光均向低能方向移动,但与GaN带边不同,量子阱发光峰值变化并不与通过内插法得到的Varshni经验公式相吻合,而是与InN带边红移趋势一致,分析了导致这种现象的可能因素.还分析了量子阱发光寿命随温度升高而减小的原因.     

氢离子注入法提高InAsP/InP应变多量子阱发光特性

采用气态源分子束外延系统生长了InAsP/InP应变多量子阱,研究了H 注入对量子阱光致发光谱的影响以及高温快速退火对离子注入后的量子阱发光谱的影响.发现采用较低H 注入能量(剂量)时,量子阱发光强度得到增强;随着H 注入能量(剂量)的增大,量子阱发光强度随之减小.H 注入过程中,部分隧穿H 会湮灭掉量子阱结构界面缺陷,同时H 也会对量子阱结构带来损伤,两者的竞争影响量子阱发光强度的变化.高温快速退火处理后,离子注入后的量子阱样品发光峰位在低温10K相对于未注入样品发生蓝移,蓝移量随着H 注入能量或剂量的增大而增加.退火过程中缺陷扩散以及缺陷扩散导致的阱层和垒层之间不同元素互混是量子阱发光峰位蓝移的原因.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Lanthanum diffusion in the TiN/LaOx/HfSiO/SiO2/Si stack

Band edge Complementary Metal Oxide Semiconductor (CMOS) devices are obtained by insertion of a thin LaO_x layer between the high-k (HfSiO) and metal gate (TiN). High temperature post deposition anneal induces Lanthanum diffusion across the HfSiO towards the SiO₂ interfacial layer, as shown by Time of Flight Secondary Ions Mass Spectroscopy (ToF-SIMS) and Atom Probe Tomography (APT). Fourier Transform Infrared Spectroscopy in Attenuated Total Reflexion mode (ATR-FTIR) shows the formation of La-O-Si bonds at the high-k/SiO₂ interface. Soft X-ray Photoelectron Spectroscopy (S-XPS) is performed after partial removal of the TiN gate. Results confirm La diffusion and changes in the La chemical environment.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.