长波InAs/GaSb II类超晶格红外探测器

报道了50％截止波长为12.5μm的InAs/GaSb Ⅱ类超晶格长波红外探测器材料及单元器件.实验采用分子束外延技术在GaSb衬底上生长超晶格材料.吸收区结构为15ML(InAs)/7ML(GaSb),器件采用PBIN的多层异质结构以抑制长波器件暗电流.在77K温度下测试了单元器件的电流-电压(I-v)特性,响应光谱和黑体响应.在该温度下,光敏元大小为100μm×100μm的单元探测器RmaxA为2.5Ωcm2,器件的电流响应率为1.29A/W,黑体响应率为2.1×109cmHz12/W,11μm处量子效率为14.3％.采用四种暗电流机制对器件反向偏压下的暗电流密度曲线进行了拟合分析,结果表明起主导作用的暗电流机制为产生复合电流.     

128x128元InAs/GaSb II类超晶格红外焦平面探测器

报道了128×128元InAs/GaSb Ⅱ类超晶格红外焦平面阵列探测器的研究成果.实验采用分子束外延技术在GaSb衬底上生长超晶格材料.红外吸收区结构为13 ML(InAs)/9 ML(GaSb),器件采用PIN结构,焦平面阵列光敏元大小为40μm×40μm.通过台面形成、侧边钝化和金属电极生长,以及与读出电路互连等工艺,得到了128×128面阵长波焦平面探测器.在77 K时测试,器件的100%截止波长为8μm,峰值探测率6.0×109cmHz1/2W-1.经红外焦平面成像测试,探测器可得到较为清晰的成像.     

128×128元InAs/GaSb Ⅱ类超晶格红外焦平面探测器

报道了128×128元InAs/GaSb Ⅱ类超晶格红外焦平面阵列探测器的研究成果.实验采用分子束外延技术在GaSb衬底上生长超晶格材料.红外吸收区结构为13 ML(InAs)/9 ML(GaSb),器件采用PIN结构,焦平面阵列光敏元大小为40 μm×40μm.通过台面形成、侧边钝化和金属电极生长,以及与读出电路互连等工艺,得到了128×128面阵长波焦平面探测器.在77 K时测试,器件的100％截止波长为8μm,峰值探测率6.0×109 cmHz1/2 W-1.经红外焦平面成像测试,探测器可得到较为清晰的成像.     

InAs/GaSb II类超晶格中波红外探测器

InAs/GaSb II类超晶格探测器是近年来国际上发展迅速的红外探测器,其优越性表现在高量子效率和高工作温度,以及良好的均匀性和较低的暗电流密度,因而受到广泛关注。报道了InAs/GaSb超晶格中波材料的分子束外延生长和器件性能。通过优化分子束外延生长工艺,包括生长温度和快门顺序等,获得了具原子级表面平整的中波InAs/GaSb超晶格材料,X射线衍射零级峰的双晶半峰宽为28.8,晶格失配a/a=1.510-4。研制的p?鄄i?鄄n单元探测器在77 K温度下电流响应率达到0.48 A/W,黑体探测率为4.541010 cmHz1/2W,峰值探测率达到1.751011 cmHz1/2W。     

320×256元InAs/GaSb II类超晶格中波红外双色焦平面探测器

报道了320×256元InAs/GaSb II类超晶格红外双色焦平面阵列探测器的初步结果.探测器采用PN-NP叠层双色外延结构,信号提取采用顺序读出方式.运用分子束外延技术在GaSb衬底上生长超晶格材料,双波段红外吸收区的超晶格周期结构分别为7 ML InAs/7 ML GaSb和10 ML InAs/10 ML GaSb.焦平面阵列像元中心距为30μm.在77 K时测试,器件双色波段的50%响应截止波长分别为4.2μm和5.5μm,其中N-on-P器件平均峰值探测率达到6.0×10~(10) cmHz~(1/2)W~(-1),盲元率为8.6%;P-on-N器件平均峰值探测率达到2.3×10~9 cmHz~(1/2)W~(-1),盲元率为9.8%.红外焦平面偏压调节成像测试得到较为清晰的双波段成像.     

InAs/GaSb二类超晶格中/短波双色红外焦平面探测器

InAs/GaSb超晶格材料已经成为了第三代红外焦平面探测器的优选材料。开展了InAs/GaSb二类超晶格中/短波双色焦平面探测器器件结构设计、材料外延、芯片制备,对钝化方法进行了研究,制备出性能优良的320256双色焦平面探测器。首先以双色叠层背靠背二极管电压选择结构作为基本结构,设计了中/短波双色芯片结构,然后采用分子束外延技术生长出结构完整、表面平整、低缺陷密度的PNP结构超晶格材料。采用硫化与SiO2复合钝化方法,最终制备的器件在77 K下中波二极管的RA值达到13.6 kcm2,短波达到538 kcm2。光谱响应特性表明短波响应波段为1.7~3 m,中波为3~5 m。双色峰值探测率达到中波3.71011 cmHz1/2W-1以上,短波2.21011 cmHz1/2W-1以上。响应非均匀性中波为9.9%,短波为9.7%。中波有效像元率为98.46%,短波为98.06%。     

InAs/GaSb超晶格/GaSb体材料中短波双色红外探测器

采用GaSb体材料和InAs/GaSb超晶格分别作为短波与中波吸收材料,外延生长制备了NIPPIN型短中双色红外探测器。HRXRD及AFM测试表明,InAs/GaSb超晶格零级峰和GaSb峰半峰宽FWHM分别为17.57 arcsec和19.15 arcsec,10μm×10μm范围表面均方根粗糙度为1.82?。77 K下,SiO_2钝化器件最大阻抗与面积乘积值RA为5.58×10~5Ω?cm~2,暗电流密度为5.27×10~(-7)A?cm~(-2),侧壁电阻率为6.83×10~6Ω?cm。经阳极硫化后,器件最大RA值为1.86×10~6Ω?cm~2,暗电流密度为4.12×10~(-7)A?cm~(-2),侧壁电阻率为4.49×10~7Ω?cm。相同偏压下,硫化工艺使器件暗电流降低1-2个数量级,侧壁电阻率提高了1个数量级。对硫化器件进行了光谱响应测试,器件具有依赖偏压极性的低串扰双色探测性能,其短波通道与中波通道的50%截止波长分别为1.55μm和4.62μm,在1.44μm、2.7μm和4μm处,响应度分别为0.415 A/W、0.435 A/W和0.337 A/W。     

InAs/GaSb Ⅱ型超晶格中波红外光电二极管的硫化研究

采用分子束外延( MBE)技术,在GaSb衬底上生长了pin结构InAs(8 ML)/GaSb(8 ML)超晶格材料,响应光谱显示截止波长在5μm附近.通过腐蚀、光刻、溅射等工艺,制备了pin结构中波红外光电二极管.采用(NH4)2S+ZnS双层硫化对二极管表面进行钝化,(NH4)2S硫化后的二极管表面漏电流密度降低一...     

基于InAs/GaSb超晶格的中波段红外焦平面材料生长与器件制备

本文展示了基于InAs/GaSb二类超晶格材料的中红外焦平面器件制备研究。探测器材料由400周期的结构为8ML InAs /8ML GaSb 的超晶格构成。超晶格材料通过分子束外延技术在N 型GaSb(100)衬底上生长。超晶格层与GaSb衬底层的失配被降低到148.9ppm,通过高分辨X射线衍射分析得到超晶格层的1级衍射峰半缝宽达到28arcsec.。单元探测器和128×128像元红外焦平面通过柠檬酸系腐蚀配方制备完成。通过I-V测试分析表明器件工艺中的化学和物理钝化能够有效降低器件的表面漏电流。最终单元探测器件在77K温度下50%截止波长为4.73微米,R₀A 达到 10³Ωcm²量级。最后我们对焦平面器件进行了成像实验,测试条件为积分时间0.5ms,光圈F/2.0,器件黑体平均探测率达到2.01 × 10⁹cmHz^1/2W^-1.。     

320×256 InAs/GaSb超晶格中/短波双色探测器组件研制

InAs/GaSb超晶格材料制备的新型红外器件在最近十几年得到了迅速发展。文中开展了InAs/GaSb二类超晶格中/短波双色焦平面探测器组件研制,设计了中/短波双色叠层背靠背二极管芯片结构,用分子束外延技术生长出结构完整、表面平整、低缺陷密度的PNP结构超晶格材料,制备出性能优良的320×256双色焦平面探测器组件,对探测器组件进行了测试分析。结果显示,在77 K下中波二极管RA值达到26.0 kΩ·cm2,短波的RA值为562 kΩ·cm2。光谱响应特性表明短波响应波段为1.7~3 μm,中波为3~5 μm,满足设计要求。双色峰值探测率达到中波3.12×1011 cm·Hz1/2W-1,短波1.34×1011 cm·Hz1/2W-1。响应非均匀性中波为9.9%,短波为9.7%。中波有效像元率为98.46%,短波为98.06%。     

New wet etching solution molar ratio for processing T2SLs InAs/GaSb nBn MWIR infrared detectors grown on GaSb substrates

Mid-wave infrared (MWIR) technology is dominated by HgCdTe. However, in terms of performance, InAs/GaSb type-II superlattice (T2SL) has shown the theoretical potential to compete with HgCdTe. T2SLs InAs/GaSb technology is under development, where proper detector’s architecture formation must be considered as one of the most important steps of the fabrication process. The paper presents experimental results related to chemical etching of the T2SLs InAs/GaSb with bulk AlGaSb barriers, mesa type nBn MWIR detectors. Although, we attempted to transfer HgCdTe etching solutions: Br₂+C₂H₆O₂ into T2SLs InAs/GaSb technology, H₃PO₄+C₂H₈O₇+H₂O₂+H₂O (molar ratio: 1:1:4:16) at temperature ~21 °C was estimated to have optimal parameters in terms of the mesa profile and current–voltage characteristics. Repeatability of the mesa profiles and surface uniformity was reached. Overetching close to the mesa sidewalls was not observed.     

256×256 focal plane array midwavelength infrared camera based on InAs/GaSb short-period superlattices

An infrared camera based on a 256×256 focal plane array (FPA) for the second atmospheric window (3–5 μm) has been realized for the first time with InAs/GaSb short period superlattices (SLs). The SL detector structure with a broken gap type-II band alignment was grown by molecular beam epitaxy on GaSb substrates. Effective bandgap and strain in the superlattice were adjusted by varying the thickness of the InAs and GaSb layers and the controlled formation of InSb-like bonds at the interfaces. The FPAs were processed in a full wafer process using optical lithography, chemical-assisted ion beam etching, and conventional metallization technology. The FPAs were flip-chip bonded using indium solder bumps with a read-out integrated circuit and mounted into an integrated detector cooler assembly. The FPAs with a cut-off wavelength of 5.4 μm exhibit quantum efficiencies of 30% and detectivity values exceeding 10¹³ Jones at T=77 K. A noise equivalent temperature difference (NETD) of 11.1 mK was measured for an integration time of 5 ms using f/2 optics. The NETD scales inversely proportional to the square root of the integration time between 5 ms and 1 ms, revealing background limited performance. Excellent thermal images with low NETD values and a very good modulation transfer function demonstrate the high potential of this material system for the fabrication of future thermal imaging systems.     

多晶锗硅室温微测辐射热计线性阵列的研制

采用超高真空气相淀积系统 ( UHVCVD)制备了多晶锗硅薄膜 ( poly-Si0 .7Ge0 .3) ,研究了它的退火特性和电阻温度特性。将多晶锗硅薄膜电阻作为微测辐射热计的敏感元件 ,采用体硅微机械加工技术制作了 8× 1桥式微测辐射热计线性阵列 ,优化设计的微桥由两臂支撑 ,支撑臂的长和宽分别为 2 2 0 μm和 8μm,桥面面积为 80μm× 80μm。测试结果表明 ,在 773 K黑体源 8～ 1 4μm红外辐射下 ,调制频率为 3 0 Hz时 ,阵列中各单元的电压响应率为 6.2 3 k V/W～ 6.40 k V/W,探测率为 2 .2 4× 1 0 8cm Hz1 /2 W- 1～ 2 .3 3× 1 0 8cm Hz1 /2 W- 1 ,热响应时间为2 1 .2 ms～ 2 2 .1 ms,表明了器件具有较高的性能及较好的一致性。     

Thermal Conductivity of InAs/GaSb Type?II Superlattice

The cross-plane thermal conductivity of a type?II InAs/GaSb superlattice (T2SL) is measured from 13?K to 300?K using the 3?? method. Thermal conductivity is reduced by up to two orders of magnitude relative to the GaSb bulk substrate. The low thermal conductivity of around 1?W/m?K to 8?W/m?K may serve as an advantage for thermoelectric applications at low temperatures, while presenting a challenge for T2SL interband cascade lasers and high-power photodiodes. We describe a power-law approximation to model nonlinearities in the thermal conductivity, resulting in increased or decreased peak temperature for negative or positive exponents, respectively.     

Growth of InAs-AlSb quantum wells having both high mobilities and high concentrations

Low-temperature mobilities in InAs-AlSb quantum wells depend sensitively on the buffer layer structures. Reflection high energy electron diffraction and x-ray diffraction show that the highest crystalline quality and best InAs transport properties are obtained by a buffer layer sequence GaAs → AlAs → AlSb → GaSb, with a final GaSb layer thickness of at least 1 μm. Using the improved buffer scheme, mobilities exceeding 600,000 cm²/Vs at 10 K are routinely obtained. Modulation δ-doping with tellurium has yielded electron sheet concentrations up to 8 × 10¹² cm⁻² while maintaining mobilities approaching 100,000 cm²/Vs at low temperatures.     

A monolithically integrated HgCdTe short-wavelength infrared photodetector and micro-electro-mechanical systems-based optical filter

A monolithically integrated low-temperature micro-electro-mechanical systems (MEMS) and HgCdTe infrared (IR) detector technology is introduced, implemented, and characterized. The ultimate aim of this project is to develop a MEMS-based optical filter, integrated with an IR detector, that selects narrow wavelength bands within the short-wavelength IR (SWIR) region of the spectrum. The entire fabrication process is compatible with two-dimensional IR focal plane array technology, and needs to be compatible with a proposed electrically tunable MEMS filter based on a Fabry-Perot optical cavity. The fabricated device consists of an HgCdTe SWIR photoconductor, distributed Bragg mirrors formed of Ge-SiO-Ge, a sacrificial spacer layer within the cavity, and a silicon nitride membrane for structural support. Mirror stacks fabricated on silicon, identical to the structures that will form the optical cavity, have been characterized to determine the optimum filter characteristics. The measured full-width at half-maximum (FWHM) was 34 nm at the center wavelength of 1,780 nm with an extinction ratio of 36.6. Fully integrated filters on HgCdTe photoconductors with a center wavelength of approximately 1,950 nm give a FWHM of approximately 100 nm, and a peak responsivity of approximately 8×10⁴ V/W. The experimental results are in good agreement with the optical model, which takes into account mirror reflectivity, absorption within the cavity by the spacer material, and absorption by the silicon nitride support structure.     

Properties of InAs/(Ga,In)Sb strained layer superlattices grown on the {111} orientations

Following the proposal of the extreme type-II InAs/(Ga,In)Sb strained layer superlattice system by Mailhiot and Smith in 1987 for long wavelength infrared detection, a number of groups have experimentally investigated (100) oriented InAs/(Ga,In)Sb strained layer superlattices and demonstrated that these structures can possess energy gaps in the 8–12 μm range with absorption coefficients comparable to HgCdTe. However, a number of advantages are predicted if these structures are grown on the {111} orientations. In this paper, we present details of our investigation of the growth of InAs/GaSb heterostructures and InAs/(Ga,In)Sb strained layer superlattices on the (111)A and (111)B orientations by molecular beam epitaxy, compared to growth on the (100) orientation. Heterojunction growth and incorporation rates of Sb (As) into InAs (GaSb) on (111)A, (111)B, and (100) orientations have been assessed and implications for growth and optical properties of InAs/(Ga,In)SB strained layer superlattices are discussed. GaSb/InAs and InAs/GaSb interfaces on the (111)B orientation are investigated by x-ray photoelectron spectroscopy, and the structural quality of InAs/(Ga,In)Sb strained layer superlattices are investigated by x-ray diffraction.     

双色量子阱红外探测器大面阵芯片的研制

采用GaAs/AlGaAs和InGaAs/AlGaAs多量子阱，研制出了双色同像素读取结构的中波/长波量子阱红外探测器及160×128元中波/长波双色多量子阱红外探测器芯片。器件的材料结构生长是采用分子束外延技术，在5.08 cm半绝缘GaAs衬底上完成的。发展了双色大面阵制备工艺，二维光栅的制备使用标准光刻和离子束刻蚀技术。在77 K时，对量子阱红外探测器测试，得到中、长波段峰值探测率分别为Dλ*=（1.61～1.90）×1010 cmHz1/2W-1和（1.54～2.67）×1010 cmHz1/2W-1。中、长波段峰值波长分别为(2.7~3.8) μm和8.3 μm。     

基于石墨烯/铟砷量子点/砷化镓异质结新型光电探测器

研究了一种石墨烯/铟砷量子点/砷化镓界面形成的异质结探测器的暗电流特性以及光电响应性质.虽然石墨烯具有很高的电子迁移率,但受限于较低的光子吸收率,使其在光电探测领域的应用受到了限制.而半导体量子点具有量子效率高,光吸收能力强等独特优点.于是利用石墨烯-砷化铟量子点-砷化镓异质结结构制备了一种新型光电探测器.并对该探测器的响应率、I-V特性曲线、暗电流特性、探测率、开关比等关键性能进行了研究.其在637 nm入射光情况下的响应率、探测率以及开关比可分别达到为17. 0 m A/W、2. 3×10~(10)cm Hz~(1/2)W~(-1)和1×10~3.而当入射光为近红外波段的940纳米时,响应率进一步增加到了207 m A/W.同时,还证实了该器件的暗电流、肖特基势垒高度和理想因子对温度的都具有较高的依赖性都较强.