从IC封装产品可靠性谈封装冲切模具优化设计

随着电子产品市场日益升温,电子产品朝超薄、超小等方向发展,产品量的需求越来越大,产品可靠性越来越高,塑料封装模具的冲切工艺产生的分层现象是影响产品可靠性的主要原因之一。文章首先叙述了冲切过程产生的分层情况,其次从模具结构方面说明冲切产生分层的原因,并针对产生分层的原因提出冲切模具的优化设计,最后总结从实际生产过程中防分层要求设计冲切模具和框架,可避免在实际生产过程中IC胶体分层导致产品可靠性问题。     

关于集成电路冲切过程“中筋上带”问题探讨

切筋成型是集成电路封装过程的重要工序之一。切筋过程产生的中筋上带问题,致使产品管脚短路,影响产品电性能、安全、可靠性。阐述切筋过程中筋上带产生的原因,针对该问题提出相应的改善建议。     

崩角问题分析探讨

在集成电路封装过程中,L（T）QFP／PQFP系列产品在胶体四角进浇口、排气槽位置的崩角问题已直接影响到封装成品率和产品可靠性。本文展现了崩角的几种现象,对出现的原因进行了分析,并提出了通过改善模具的凸凹模结构、改善框架冲切方向（反冲、胶体支撑）、优化塑封料特性、改进塑封模具等都可不同程度的改善崩角。综合考虑方案的可行性、经济性、方便性诸因素,选择最优化的途径,使解决崩角问题达到最佳效果。     

TO系列塑料封装离层探讨

文章研究了TO系列塑料封装功率器件产品产生离层的原因。同时,研究了TO系列塑料封装功率器件产品在上芯、压焊、塑封工序中的原材料、塑封模具、工艺参数等对离层的影响,并通过SAT图片,对影响离层的因素进行了论证,提出了如何预防或减轻TO系列塑料封装产品离层的产生。实验结果表明:塑封工艺参数的合理选择、塑封模具结构的合理选用、塑封料优选对TO系列塑料封装离层有较好的改善作用,并且在塑封生产线上易于实现。文章在这些方面做了相关尝试,取得了较好的效果。     

引线框架塑料封装集成电路分层及改善

分层是塑料集成电路封装过程和可靠性试验后常见的问题,如何解决分层问题是封装材料供应商、封装工程师、可靠性试验工程师共同研究与改善的课题。通过对封装产品结构、材料、工艺方法等方面进行深入的解析,详细阐述了引线框架塑料封装集成电路分层产生机理,描述了分层对集成电路的危害以及如何预防分层的发生,进而提出了有效的改善措施。结果表明,这些措施的应用能够有效预防分层问题的发生,提高塑料封装集成电路的可靠性。     

基于PLC的自动切筋分离系统设计

随着集成电路封装产业的高速发展,切筋工艺在其封装生产中的地位也不断上升,然而传统的手动切筋作业方式严重阻碍了IC封装生产效率的发展。目前,PLC技术在工控领域得到广泛应用,软件设计方法已逐步完善,适合运用于自动切筋分离系统的设计开发中。该课题中涉及的MCM-3D封装工艺,运用低弧度立体键合技术、集成电路智能塑封系统、自动切筋分离系统等多项研发成果。开发了PLC自动控制系统,设计了切筋模具定位结构、切筋刀具和自动推料装置等,利用光纤传感器,结合PLC定位电路和PLC反馈控制系统,实现了切筋工艺的自动化,提高了切筋工序的生产效率,降低了故障率和安全风险,控制了人工和设备成本。     

集成电路塑封模具错位、偏心问题探讨

就集成电路封装过程中塑封模具的错位和偏心问题做探讨,分析导致错位和偏心的各种原因,并就如何使塑封模具的错位、偏心问题对产品的质量影响降到最低提出了具体的改善措施.     

浅谈IC封装材料对产品分层的影响及改善

IC封装不仅要求封装材料具有优良的导电性能、导热性能以及机械性能,还要求具有高可靠性、低成本和环保性,这也是引线框架、环氧树脂成为现代电子封装主流材料的主要原因,其市场份额约占整个封装材料市场的95%以上。由于环氧树脂封装是非气密性封装,对外界环境的耐受能力较差,尤其是受到湿气侵入时,产品会出现一些可靠性问题,最容易发生的现象是分层。简要分析了框架和环氧树脂对产品可靠性的影响,在此基础上提出一些改善措施。     

塑料封装集成电路分层浅析及改善研究

当环境温度、湿度发生变化时,塑料封装集成电路内部的不同物质界面会产生分层,分层导致电路回路的开路或间歇性接触不良,极大地影响IC的功能和使用寿命。封装主要材料BOM(如芯片/框架/装片胶/塑封料环氧树脂)是确定IC MSL等级和分层水平的基础,封装制程的工艺设计、组装过程的控制方法、产品防范外力破坏及热电应力防护都是影响分层的因素,BOM组合需要考虑加强材料间的粘结强度及接近的热膨胀系数、设计芯片PO层减少电路表面凹凸落差、框架沟槽凸台设计、制造过程防污染/防氧化控制等,都是改善IC产品内部分层的有效思路。DOE对比试验有助于从复杂的产品制造过程中发现分层产生的根源。     

引线框架电镀锡须、锡毛刺生成机理与预防

引线框架电镀纯锡时,受过程控制及原材料的影响,纯锡镀层极易产生锡须和锡毛刺。锡须和锡毛刺的产生有着不同的机理,因此预防锡须及锡毛刺的产生,需要采取有针对性的措施。本文章从原理上分析了锡须及锡毛刺的产生机理,并结合现有封装电镀工艺流程,有针对性地提出了一些可行的预防措施,为保证集成电路的可靠性提供了理论支持。     

基于激光快速成形的发动机功能塑料零件快速制造工艺

本文论述了激光快速成形技术与快速模具技术结合快速制造发动机功能塑料零件的工艺方法。该工艺在快速成形样件的基础上,通过快速模具技术实现了材料转换,解决了产品性能测试样件的制作问题,适合研制各种发动机功能塑料零件的新产品。本文通过某型号塑料进气歧管的快速制造实例,对此工艺方法进行了深入详细的探讨。     

引线框架塑封集成电路冲切过程中的检测和防护

在引线框架塑封集成电路的引线冲切成型过程中,存在塑封体破裂脱落、引脚折断等异常现象,如果不能及时发现这些异常,就会造成产品的批量报废或相关成型模具损坏的情况。介绍了如何使用光电传感器和检测针系统对集成电路引脚冲切成型中可能出现的异常进行有效监测和防护。     

An advanced laser application for controlling of electric resistivity of thick film resistors

When electric resistivity of Thick Film Resistor (TFR) is adjusted to the desired value, laser beam is irradiated onto the resistor material so that a part of the resistor material is instantaneously vaporized and cut away. This conventional laser trimming method to adjust the resistivity of TFRs is an indispensable technique for manufacturing elec-tronic devices such as hybrid ICs. A peculiar phenomena was revealed by us, that is, when specially selected pulse laser beams were irradiated to TFR, the TFR was surface modified without cutting grooves, and then resistivity of the TFR was decreased. We completed the advanced laser process to apply this peculiar phenomena. 8 By comparing with conventional trimming processes, we can show prominent features of the advanced process, for example, resistivity of fine size TFR (300 micrometers-width and under) can be easily controlled. The decrease in resistivity of the TFR is considered to result from the decrease in specific resistivity of glass in the TFR. Because it is considered that the glass in the TFR is heavily doped with ruthenium impurities during the surface modification due to results of morphology observations and x-ray diffraction analysis. We have applied this advanced laser process to fine size TFR (300 micrometers-width), and developed high density hybrid ICs.     

内串联型二极管封装产品研发

介绍一种新封装半导体器件的研发。通过对产品开发过程中各技术难点及相应解决方案的介绍,展现该产品的主要研发过程和所涉及到的关键技术难点。关键技术难点包括引线框架设计、设备改造、工艺控制等。引线框架(一种正向串联的二极管框架结构)设计产品的总体结构问题,是该过程的第一技术关键点。设备改造和工艺控制解决了生产实现和质量控制问题。     

New trim configurations for laser trimmed thick-film resistors—theoretical analysis, numerical simulation and experimental verification

In this paper a new approach to laser trimming is investigated and compared with traditional trimming. It relies on creating an additional contact for lowering resistance values thus simplifying the design and widening resistance trimming ranges. This enables to achieve a correction with shorter cut length of, so it can lead to a faster and cheaper fabrication process of hybrid integrated circuit. This paper analyses trimming range and trimming characteristics computed for different shapes of added contact using a new, very fast and easily programmable method. Moreover the experimental verification of such approach is presented. The relative trimming range and sensitivity are analyzed as a function of additional contact shape and cut length. Next long-term stability, pulse durability and low frequency noise are compared for two- and three-contact resistors versus trim pathway length.     

通过工控组态软件实现高压变频器监控系统的设计与应用

本文介绍了工控组态软件在高压变频器监控系统中的应用情况。阐明了利用组态软件进行监控软件开发的基本过程。实践证明,系统具有界面友好、易于操作、运行可靠、便于升级扩充等特点。     

Technology adoption, product design, and process change: a casestudy in the machine tool industry

The experience of the machine tool industry suggests that many manufacturing organizations are reexamining their manufacturing processes and technologies in response both to the need to gain flexibility and efficiency in their operations and to a rising awareness of resource costs and environmental concerns. The adoption of new technologies, especially technologies which reduce material requirements and waste, will require organizations to rethink how they design and manufacture their products. Changes in product and process design will affect the technologies and operations of numerous organizations along the production supply chain. Through a case study of the machine tool industry, this paper explores the impacts of the adoption of forming technology instead of conventional cutting technology on the production of selected metal parts. This paper is organized in three parts. In the first part, the costs, technical advantages, and environmental compatibility of cutting and forming technologies are profiled. Forming technology is shown to provide substantial savings in raw material, energy and waste disposal over cutting technology for a class of high-volume metal parts. The second part explores the changes in part and process design which occur when forming technology is adopted for parts which have traditionally been made by cutting. The costs of these design changes must be balanced against the environmental savings. The third part explores the extent to which changes due to the adoption of new forming technology ripple along the production supply chain to suppliers and other upstream organizations     

含有空位缺陷的单晶锗纳米切削过程分子动力学仿真

针对含有空位缺陷的单晶锗纳米切削过程展开研究,利用分子动力学仿真软件构建了含有空位缺陷的单晶锗切削模型并进行了分子动力学仿真切削。文中从原子角度考虑了切削过程中系统势能的变化、切削力的变化,解释了材料的去除过程和切屑的形成机理,并分析了空位缺陷对切削的影响。结果显示在切削过程中,单晶锗晶体所含空位数越多则基础系统势能越大,且随着切削的进行系统势能逐渐增大。该结果表明空位缺陷的增加会加剧系统的不稳定性。     

Trimmer工艺参数对切割效果的影响

激光焊切机(Trimmer)是显示面板(TFT-LCD)工业中不可或缺的设备,其作用是利用激光束切除显示面板上的Shorting Bar结构。Trimmer切割效果对于后工段良率有很大影响,因此研究Trimmer的工艺参数对切割效果的影响对于提升产品良率具有重要意义。本工作首先通过实验探究激光单脉冲能量E、激光频率f、切割速度v、加工光斑沿切割方向的边长a等工艺参数对于某款165cm(65in)产品的切割效果的影响,然后深入分析了Trimmer的切割机理,提出了囊括所有工艺参数的变量"ε",然后通过实验给出了对于膜厚为0.45μm的Cu材质Shorting Bar,Trimmer激光单脉冲能量必须在7mJ以上,ε在400mJ/mm~2以上,Trimmer可以将Shorting Bar切除干净,并且得出ε与表征切割效果的参量ω之间的函数关系,证实了ε值对于切割效果的影响。