从IC封装产品可靠性谈封装冲切模具优化设计

随着电子产品市场日益升温,电子产品朝超薄、超小等方向发展,产品量的需求越来越大,产品可靠性越来越高,塑料封装模具的冲切工艺产生的分层现象是影响产品可靠性的主要原因之一。文章首先叙述了冲切过程产生的分层情况,其次从模具结构方面说明冲切产生分层的原因,并针对产生分层的原因提出冲切模具的优化设计,最后总结从实际生产过程中防分层要求设计冲切模具和框架,可避免在实际生产过程中IC胶体分层导致产品可靠性问题。

Optimization Design of Trim-Form Die From the Reliability of IC Packing Products

With the development of electronics market, the electronic products are becoming ultra-thin and untra-small, etc, accompanied by increasing demand for product volume and increasing product reliability. The punch process resulting delamination producing in molding process is one of the main factors that influence the reliability of products. This paper firstly described several delamination problems during the process of punching. Secondly, it explained delamination causes of punch process from mold structure, and put forward optimization design of punch die by analyzing delamination causes. As a result, this paper designed a punch die and lead frame to prevent delamination in actual production process, which can avoid product reliability problems caused by IC glue delamination in the actual production process.