硅薄膜中的结构缺陷研究进展

硅薄膜作为制备硅薄膜太阳电池的重要材料,得到了广泛研究和应用,而硅薄膜中的各种缺陷及缺陷密度则对薄膜电池的转换效率和稳定性有着至关重要的影响。对硅薄膜中的缺陷种类、缺陷研究方法以及缺陷对薄膜性能的影响进行总结,期望对提高和改善硅薄膜质量乃至硅薄膜太阳电池转换效率和稳定性提供一定的指导。     

金属镍诱导p型多晶硅薄膜的光电性能研究

利用电子束蒸镀方法及重掺杂p型硅为蒸发源在K8玻璃衬底上沉积非晶硅薄膜,采用镍诱导晶化法在氮气氛围下进行退火处理制备出p型多晶硅薄膜.研究了不同温度热处理条件对p型多晶硅薄膜的光电性能的影响,通过霍尔测量、拉曼光谱、原子力显微镜、紫外-可见光吸收光谱等测试手段对薄膜进行分析.结果表明,随着晶化温度的提高晶化程度先增强后...     

铝诱导晶化P型非晶硅薄膜实验研究

利用PECVD设备在普通玻璃基片上沉积硼掺杂P型非晶硅薄膜,采用铝诱导晶化法（AIC）在氮气气氛保护下进行退火处理制备出P型多晶硅薄膜,研究了不同厚度的金属铝膜和热处理温度对非晶硅薄膜的微观结构、表面形貌的影响。实验结果表明：铝膜相对厚度越厚,对a—Si的晶化诱导效果则越好,在一定温度条件下,相对较厚的铝膜可以缩短a—Si晶化为polv-Si的时间,并且能使a—Si的晶化更加完整,产生尺寸较大的硅晶颗粒。在铝膜厚度相同,退火温度相同的条件下,热处理的时间越长,则晶化发生的程度越深,晶化越为彻底。     

铝诱导晶化法低温制备多晶硅薄膜

为了满足在普通玻璃衬底上制备多晶硅薄膜晶体管有源矩阵液晶显示器,低温（＜６００℃）制备高质量多晶硅薄膜已成为研究热点．本文研究了一种低温制备多晶硅薄膜的新工艺：金属诱导非晶硅薄膜低温晶化法．在非晶硅薄膜上蒸镀金属铝薄膜,并光刻形成铝膜图形,而后于氮气保护中退火．利用光学显微镜和拉曼光谱等测试方法,研究了Ａｌ诱导下非晶硅薄膜的晶化过程,结果表明;在５６０℃退火６ｈ后;铝膜下的非晶硅已完全晶化,确定了所制备的是多晶硅薄膜．初步探讨了非晶硅薄膜金属诱导横向晶化机理．     

Growth of pseudocubic perovskite-type SrRuO3 thin films on quartz substrate using pulsed laser deposition method

Strontium ruthenium oxide (SrRuO₃) thin films have been grown using pulsed laser deposition technique on silicon, Pt coated silicon and quartz substrates. The effect of substrate temperatures on the structural, microstructure, and electrical properties of the SrRuO₃ films on quartz substrate has been investigated using XRD, SEM, AFM and four-probe method, respectively. The lowest resistivity at room temperature for the SrRuO₃ thin film on quartz substrate has been achieved at substrate temperature of 700 °C. Furthermore, the comparisons of SrRuO₃ thin films deposited on various substrates have been done with respect to structural, microstructural and electrical properties. XRD patterns exhibit that all thin films are a single phase, pseudo-cubic perovskite structure. Study of surface morphology shows that grain size and roughness varies with respect to substrate. It is observed that SrRuO₃ thin films yield larger grain size and root mean square roughness on Pt/Si substrate. Investigation of electrical properties shows that SrRuO₃ thin films can serve the purpose of the bottom electrode in dielectric and ferroelectric devices.     

Stable deposition of silicon oxynitride thin films with intermediate refractive indices by reactive sputtering

The deposition stability of silicon oxynitride thin films with intermediate refractive indices was investigated as a function of argon concentration in the process gas mixture. The silicon oxynitride thin films were deposited by pulsed dc reactive magnetron sputtering in a mixture of argon, nitrogen and oxygen. The refractive indices of the silicon oxynitride thin films gradually decreased with oxygen percentage in the reactive gas mixture when high argon concentrations were used. It is proposed that many silicon atoms were sputtered from the target and reached the substrates in high argon concentrations; consequently, drastic oxidation of the thin films did not occur.     

中频孪生靶非平衡磁控溅射制备氮化硅薄膜及其性能(英文)

本文采用中频孪生靶非平衡磁控溅射技术在不同氮气流量比例的条件下制备出氮化硅薄膜。利用傅里叶变换红外光谱仪(FTIR)、X射线衍射仪(XRD)、原子力显微镜(AFM)、椭偏仪等研究了氮气流量比率对氮化硅薄膜的微观结构、表面形貌、沉积速率、折射率的影响。结果表明:中频孪生非平衡磁控溅射技术制备的薄膜为非晶态氮化硅。随着氮气流量比率的增加,Si-N键红外光谱吸收带向低波数漂移,薄膜的沉积速率降低,表面结构更为光滑致密,氮化硅薄膜的折射率降低。薄膜的硬度和杨氏模量分别达到22和220GPa左右。     

The effects of substrates on the thin-film structures of BaTiO3

Barium titanate (BaTiO₃) thin films prepared on magnesia, silicon and strontium titanate substrates by r.f. sputtering has been investigated. As a function of substrate and annealing temperatures, the crystal structure and shape were examined by X-ray diffraction and scanning electron microscopy. Thin films were grown on both MgO and silicon substrates; they were amorphous when deposited on MgO if the substrate temperature was less than 450 °C, while for those grown on silicon the temperature had to be less than 500 °C. Above these elevated temperatures, the films were crystalline, with cubic symmetry. After annealing the thin films on magnesia, the crystal structure changed from cubic to tetragonal phase above 1100 °C; thebe c-axis or annealing thus caused the grain growth of the BaTiO₃. The thin films on SrTiO₃ were found toc-axis oriented tetragonal films for a substrate temperature above 500 °C.     

Atomic scale microstructures of high-k HfSiO thin films fabricated by magnetron sputtering

High-k hafnium-silicate films were deposited by RF magnetron sputtering approach on silicon wafer. The microstructure has been investigated using the combination of transmission electron microscopy and atom probe tomography. It was evidenced that the elaborated HfSiO thin films subsequently annealed at 950 °C during 15 min leads to a complex phase separated nanostructure where silica, hafnia and silicon nanoclusters coexist. The formation of silicon nanoclusters in hafnia-based host was never reported before. The results demonstrate the capability of RF magnetron sputtering to pave the way for realization of nanomemory devices based on silicon clusters embedded in high-k matrix.     

Structure of diamond polycrystalline films deposited on silicon substrates

The article presents results of structural studies of polycrystalline diamond thin films deposited by hot filament CVD on silicon substrates. The films were characterized using Scanning Electron Microscopy (SEM), Raman Spectroscopy (RS), Electron Backscattered Diffraction (EBSD), Energy Dispersive Spectroscopy (EDS) and Secondary Ion Mass Spectroscopy (SIMS). Both the EBSD patterns and Raman spectra confirm that the grains visible in the electron micrographs are diamond micro-crystallites. The residual stress in the films is found to be in the range between −4.29 GPa and −0.56 GPa depending on the sample thickness. No evidence of lonsdalite and graphite has been registered in the polycrystalline material of the investigated samples. Evidence of the existence of silicon carbide at the diamond/silicon interface is presented. It is also suggested that an amorphous carbonaceous film covers the silicon surface in the regions of holes in the thin diamond layers.     

磁控共溅射Ni3 Al合金薄膜的微观结构及电阻特性

研究了室温下采用直流磁控共溅射法在抛光玻璃和Si基底上沉积Ni3Al合金薄膜的制备工艺、微观结构和电阻特性.采用SEM、EDX、AFM、TEM等测试分析了不同基底、溅射功率、工作气压等因素对薄膜微观结构、成分比和电阻特性的影响.结果表明:采用大功率混合溅射可以得到多晶态Ni3Al纳米合金薄膜,且呈多层岛状生长.所得薄膜具有良好的导电性,与玻璃相比,在Si基底上的薄膜表面光滑平整,晶粒更小,电阻率略大.然而随着厚度的减小,薄膜的电阻率增加迅速,发生金属向绝缘体过渡的相变,而厚度较大时这种现象不明显,这表明Ni3Al薄膜相变与厚度及晶格中氧含量有关.     

Influence of working pressure on ZnO:Al films from tube targets for silicon thin film solar cells

Mid-frequency magnetron sputtering of aluminum doped zinc oxide films (ZnO:Al) from tube ceramic targets has been investigated for silicon based thin film solar cell applications. The influence of working pressure on structural, electrical, and optical properties of sputtered ZnO:Al films was studied. ZnO:Al thin films with a minimum resistivity of 3.4 × 10⁻⁴ Ω cm, high mobility of 50 cm²/Vs, and high optical transmission close to 90% in visible spectrum region were achieved. The surface texture of ZnO:Al films after a chemical etching step was investigated. A gradual increase in feature sizes (diameter and depth) was observed with increasing sputter pressure. Silicon based thin film solar cells were prepared using the etched ZnO:Al films as front contacts. Energy conversion efficiencies of up to 10.2% were obtained for amorphous/microcrystalline silicon tandem solar cells.     

SiNx薄膜中硅纳米粒子的制备及表征

通过等离子增强化学气相沉积(PECVD)法, 以氨气和硅烷为反应气体, P型单晶硅和石英为衬底, 低温下(200℃)制备了含硅纳米粒子的非化学计量比氮化硅(SiN_x)薄膜. 经高温(范围500~950℃)退火处理优化了薄膜结构. 室温下测试了不同温度退火后含硅纳米粒子SiN_x薄膜的拉曼(Raman)光谱、光致发光(PL)光谱及傅立叶变换红外吸收(FTIR)光谱, 对薄膜材料的结构特性、发光特性及其键合特性进行了分析. Raman光谱表明. SiN_x薄膜内的硅纳米粒子为非晶结构. PL光谱显示两条与硅纳米粒子相关的光谱带, 随退火温度的升高此两光谱带峰位移动方向相同. 当退火温度低于800℃时, PL光谱峰位随退火温度的升高而蓝移. 当退火温度高于800℃时, PL光谱峰位随退火温度的升高而红移. 通过SiNx薄膜的三种光谱分析发现薄膜的光致发光源于硅纳米粒子的量子限制效应. 这些结果对硅纳米粒子制备工艺优化和硅纳米粒子光电器件的应用有重要意义.     

Orientation study of iron phthalocyanine (FePc) thin films deposited on silicon substrate investigated by atomic force microscopy and micro-Raman spectroscopy

In this article, we present temperature and orientation study of iron phthalocyanine (FePc) thin films with different thickness deposited on silicon substrate. The organic thin films were obtained by the quasi-molecular beam evaporation. The micro-Raman scattering spectra of FePc thin layers were investigated in the spectral range 550–1,800 cm⁻¹ using 488-nm excitation wavelength. The Raman scattering and atomic force microscopy studies were performed at room temperature before and after annealing process. Annealing process of thin layers was carried out at 453 K for 6 h. From polarized Raman spectra using surface Raman mapping procedure the information on distribution of polymorphic phases of FePc layers has been carried out. Moreover, the obtained results showed the influence of the annealing process on the ordering of the molecular structure of thin films deposited on silicon substrate. For the very thin layers we did not observe the change of the polymorphic phase but only reordering of the thin layers and change of molecular structure to intermediate phase. Using atomic force microscopy method, we observed arrangement of the thin layers structure connected with the change of roughness of the thin layers after annealing process. The obtained results indicate that the structure of thin layer deposited on silicon substrate is strongly affected by the annealing process.     

Synthesis and characterization of a novel precursor for thin films of zinc oxide by SSCVD

A novel solid organic zinc fountain as a precursor for thin films of zinc oxide by single source chemical vapour deposition (SSCVD) had been prepared through simple procedures. To synthesize the precursor, zinc oxide and acetic acid of the molar ratio 2:3 were used to react with ethanol as solution in this experiment. The reaction products as the precursor obtained after reflux of the mixture solution were characterized by Fourier transform infrared spectroscopy analysis and thermogravimetric analysis, and the thin films on silicon substrate by SSCVD using the precursor were investigated by X-ray photoelectron spectroscopy analysis. All these provide evidence that the precursor has volatility and thermolysis properties suitable for SSCVD of ZnO thin films. It is interesting to note that the films are found to have a small amount of excess O, whereas ZnO films obtained by other techniques are often O deficient.     

Dynamic behaviour of a nanoscale-patterned phospholipid thin film on mica and silicon studied by atomic force microscopy

The temporal evolution of the morphology of nanoscale-patterned phospholipid thin films on mica and silicon surfaces has been investigated with an atomic force microscope (AFM). The AFM images reveal that nanoscale scratch lines on thin films prepared on mica contract with time and eventually form roundish holes. An elevated sample temperature accelerates this morphological evolution. We model such an evolution based on the interplay of the thin-film surface line tension and the friction between the thin film and the substrate. The results show that the temperature-dependent contraction is governed by the ratio of the friction coefficient and the surface line tension. The friction at the lipid/mica interface decreases to a seventh as the sample temperature rises from 18 to 60 °C. This model is supported by experiments on silicon surfaces, on which contraction of the scratch patterns is limited because of an expected greater interfacial friction.     

石英衬底上柱状多晶硅薄膜的制备

利用射频等离子体增强化学气相沉积法(RF-PECVD)在已经预沉积有非晶硅薄膜的石英衬底上低温沉积了N/I非晶硅薄膜, 对样品进行了两步快速光热(RTP)退火. 采用 Raman、X射线衍射(XRD)、扫描电子显微镜(SEM)和透射电子显微镜(TEM)等测试仪器对样品退火前后的结晶状况和微观形貌进行了分析. 结果表明, 该N/I非晶硅薄膜退火后的晶化率达到了94%左右, 断面形貌为柱状结构, 样品中的平均晶粒尺寸约30nm, 晶粒团簇的尺寸最大约1.5μm.     

PECVD法生长氮化硅工艺的研究

采用了等离子体增强化学气相沉积法(plasma-enhanced chemical vapor deposition,PECVD)在聚酰亚胺(polyimide,PI)牺牲层上生长氮化硅薄膜,讨论沉积温度、射频功率、反应气体流量比等工艺参数对氮化硅薄膜的生长速率、氮硅比、残余应力等性能的影响,得到适合制作接触式射频MEMS开关中悬梁的氮化硅薄膜的最佳工艺条件.     

High performance multilayered nano-crystalline silicon/silicon-oxide light-emitting diodes on glass substrates

A low-temperature hydrogenation-assisted sequential deposition and crystallization technique is reported for the preparation of nano-scale silicon quantum dots suitable for light-emitting applications. Radio-frequency plasma-enhanced deposition was used to realize multiple layers of nano-crystalline silicon while reactive ion etching was employed to create nano-scale features. The physical characteristics of the films prepared using different plasma conditions were investigated using scanning electron microscopy, transmission electron microscopy, room temperature photoluminescence and infrared spectroscopy. The formation of multilayered structures improved the photon-emission properties as observed by photoluminescence and a thin layer of silicon oxy-nitride was then used for electrical isolation between adjacent silicon layers. The preparation of light-emitting diodes directly on glass substrates has been demonstrated and the electroluminescence spectrum has been measured.     

Effect of silane flow rate on structural,electrical and optical properties of silicon thin films grown by VHF PECVD technique

Hydrogenated silicon thin films deposited by VHF PECVD process for various silane flow rates have been investigated. The silane flow rate was varied from 5 sccm to 30 sccm, maintaining all other parameters constant. The electrical, structural and optical properties of these films were systematically studied as a function of silane flow rate. These films were characterized by Raman spectroscopy, Scanning Electron Microscopy (SEM), atomic force microscopy (AFM), Fourier transform infrared (FTIR) spectroscopy and UV–visible (UV–Vis) spectroscopy. Different crystalline volume fraction (22%–60%) and band gap (∼1.58 eV–∼1.96 eV) were achieved for silicon thin films by varying the silane concentration. A transition from amorphous to nanocrystalline silicon has been confirmed by Raman and FTIR analysis. The film grown at this transition region shows the high conductivity in the order of 10⁻⁴ Ω⁻¹ cm⁻¹.