硅片研磨用金刚砂(SiC)的悬浮分散性研究进展

化学机械研磨是现今硅片加工制造的重要技术,其较传统研磨方法能使硅片表面更加平整,精密度更高而损伤更低,故受到人们的广泛重视。为了今后得到悬浮分散效果更好的硅片研磨液,本文主要综述了几种常规研磨液的配制方法及这些研磨液的悬浮分散效果;研究了研磨液的zeta电位、分散剂类型及其他几种因素对金刚砂磨料的悬浮分散性的影响,最后总结出现今研磨液存在的一些问题以及研磨液领域未来的发展趋势。     

固结磨料加工硅片的技术进展

随着集成电路(IC)制造技术的飞速发展,为了进一步增加IC芯片的产量和降低单元制造成本,硅片趋向大直径化.高质量、大尺寸硅片的制造对超精密加工技术提出了更加严峻的挑战.简要地介绍了传统的及目前流行的硅片加工工艺,讨论了在线电解修整(ELID)辅助磨抛硅片技术;最后,针对固结磨具中存在的超细磨料团聚问题,介绍了几种新型的磨抛盘制备技术.     

化学机械研磨浆料对硅片质量的影响

在化学机械研磨过程中,对半导体硅片的质量影响因素主要有研磨工艺(研磨盘压力、转速、浆料流量等)和化学机械研磨液的成分。本论文重点研究了化学机械研磨浆料的成分对硅片表面粗糙度、总厚度偏差(TTV)、拉丝、划道擦伤、清洁度的影响。通过实验可知:研磨浆料组成为:1%AEO_7;2%聚乙烯吡咯烷酮PVP K90;0.4%乙二胺四乙酸;2%四羟乙基乙二胺;20%PWA 10;74.6%高纯水,可以得到优异的研磨硅片质量。     

微电子工业生产废水处理及回收利用

阐述了微电子工业芯片制造而产生的含氟废水、硅片研磨废水以及纯水处理混床再生所产生的高浓度酸碱废水的处理方法,特别对含氟废水的处理进行了大胆的浓度,取得了明显的成效。对处理后的合格废水回收用作工艺设备及动力设备的冷却水,产生了良好的经济效益和社会效益。     

台湾与拜耳合作生产化学机械研磨液

台湾工业研究院化学研究所与德国拜耳化学公司签订半导体化学品“化学机械研磨液”的合作研究合约.此项高附加值的电子化学品,将供应台湾IC、光碟、光纤研磨、晶圆回收、LCD     

金刚石丸片与固结磨料抛光垫研磨硅片的比较研究

采用金刚石丸片和固结磨料抛光垫两种方式研磨加工硅片,以硅片的材料去除率(MRR)和表面粗糙度(Sa)为指标对金刚石丸片和固结磨料抛光垫的研磨性能进行了评价.结果表明:固结磨料抛光垫研磨硅片的材料去除率高于金刚石丸片;研磨后硅片的表面粗糙度也优于金刚石丸片,且表面粗糙度(Sa)在中部和边缘相差不大.最后分析了研磨硅片的产物-磨屑的形状特征,得出固结磨料抛光垫研磨硅片时的塑性去除量远高于金刚石丸片.     

水基悬浮研磨液的研制

本文介绍了水基悬浮研磨液的研制和在轴承行业钢球研磨工序上的应用,指出了钢球研磨工艺上以水代油的意义。     

研磨液在氧化镓晶体研磨中的作用

氧化镓晶体易解理,严重阻碍了研磨过程中晶体表面质量的提升。根据摩擦学原理建立边界润滑磨损模型,探索了不同研磨液在研磨过程中的作用机理。针对晶体的解理特性,依据理论模型依次采用水、油作为研磨液对氧化镓进行加工实验研究。结果表明:首先水磨,晶体表面由粗研磨产生的解理现象得到有效抑制,表面粗糙度Ra由粗研磨后的325 nm降至70 nm;然后油磨,晶体表面的微解理缺陷逐步消失,表面粗糙度Ra由水磨后的70 nm降至24 nm。该研究为易解理晶体的精研磨提供有益参考。     

硅片兆声清洗技术的优化设计

介绍硅片表面兆声清洗技术的原理,研究硅片湿法清洗的原理,分析硅片兆声清洗的方法及流程图,比较了这些方法各自的特性,根据课题要求,基于兆声清洗的工艺流程,优化出适合于IC硅片的湿法清洗技术。     

研磨液对440c不锈钢磁力研磨效果的影响

分别以46#机械油和煤油对440c不锈钢表面进行磁力研磨。通过正交试验对研磨加工的工艺参数进行优化,从表面粗糙度、基体质量损耗、三维表面形貌等方面对比研究了上述2种研磨液对不锈钢表面光整效果的影响。结果表明,以机械油为研磨液时的光整效果更好,磁力研磨的最佳工艺条件为:主轴转速2 500 r/min,加工间隙1.8 mm,进给速率60 mm/min,磨料填充量2.0 g。在最佳工艺条件下研磨后,工件的表面粗糙度由0.381μm降至0.032μm,大量毛刺和划痕得以去除,镜面效果良好。     

Nano-precision diamond cutting tools achieved by mechanical lapping versus thermo-mechanical lapping

A comparison of lapping qualities of nano-precision diamond cutting tools achieved by the mechanical lapping versus thermo-mechanical lapping is carried out in this work. The experimental results indicate that in mechanical lapping, the removal rate is in the nanometric level, as evidenced by the groove depth ranging from several to tens nanometers. And as a result, a satisfied cutting edge radius is sharpened, ranging from 35 nm to 50 nm. In thermo-mechanical lapping, the material removal takes place not only on the surface apexes but also on the valley bottoms of grooves inherited in the previous mechanical lapping. However, the rake face has a damage layer induced by the previous mechanical lapping, and then the removal rate on the bottoms is slightly lower than that on the apexes in the initial lapping stage, as demonstrated by the lessened groove depth. Meanwhile, the successive departing of carbon atoms from diamond crystal lattice one by one is always necessary for the thermo-mechanical lapping, and resultantly, its removal rate is at atomic scale. As expected, a more sharpened cutting edge radius of less than 10 nm can be achieved. Moreover, the mechanical lapping is capable of finishing a surface roughness of 0.8 nm in Ra, but about 2.0 nm of thermo-mechanical lapping. Such difference implies that the achieved cutting edge radius is independent of the finally finished surface roughness but mostly decided by the dominant removal mode of lapped surface layer, i.e. its corresponding removal rate.     

Influence of Abrasive Properties on Residual Stresses in Lapped Ferrite and Alumina

The effect of abrasive-particle properties on surface-finishing residual stresses, surface finish, and material removal rates during the lapping of ferrite and aluminium oxide is quantified experimentally. It is shown that lapping with softer abrasives and smaller particles results in lower compressive residual stresses near the surface and improved surface finish. These results demonstrate possible methods for controlling surface finishing residual stresses in ceramics while at the same time achieving dimensional accuracy.     

A comparison of mechanical lapping versus chemical-assisted mechanical polishing and planarization of chemical vapor deposited (CVD) diamond

Polishing and planarization of CVD diamond substrates are essential steps in the processing of synthetic diamond for applications in the semiconductor industry. Using the methods of mechanical lapping and chemical-assisted mechanical polishing (CAMP), CVD diamond samples were polished against a cast-iron scaife and an alumina plate, respectively, using the same pressure on the samples. A diamond slurry was used in the mechanical lapping process, and a heated liquid chemical was used in a patented chemical-assisted mechanical polishing and planarization (CAMPP) process. The diamond samples were analyzed at several time intervals during the lapping and polishing processes, and during a combination of the two processes in which mechanical lapping preceded CAMPP. The polishing rate and surface characteristics of the diamond samples were the primary analytical measurements made, and the data were used to compare the relative lapping/polishing efficiencies of the two processes in an effort to develop an optimized process for producing highly polished CVD diamond substrates.     

光固化氧化铝陶瓷浆料流变性能研究进展

立体光固化成型技术是一种生产高精度、高性能陶瓷部件的新兴增材制造工艺。制备具有良好流动性和高固相含量的陶瓷浆料是立体光固化增材制造工艺的优势。本文讨论了固相含量、单体、分散剂、粉体级配等因素对浆料流变性能的影响规律,总结了目前配制高固相含量和低黏度光固化Al₂O₃陶瓷浆料的材料选择原则,归纳了制备高固相含量、低黏度Al₂O₃陶瓷浆料的指导方法,指出了高性能光固化Al₂O₃陶瓷浆料开发的主要趋势和面临的挑战。     

金刚石固结磨料研磨K9玻璃的研究

为提高光学材料的研磨效率与质量,提出一种亲水性固结磨料研磨方法.采用图形转移与UV固化工艺,将粒径为5～10 μm的金刚石磨料固结于亲水性光固化树脂中,制备固结磨料研磨抛光垫(FAP).选取工件的材料去除率(MRR)和表面粗糙度(Sa)来评价研磨的加工性能.对比研究了在相同粒径磨粒下的游离磨料研磨、固结磨料丸片研磨、及亲水性FAP研磨三种不同方法对K9光学玻璃的加工性能.实验结果表明:采用FAP研磨K9玻璃,MRR为350 nm/min,表面粗糙度Sa为3.24 nm,达到了精研的加工效率和抛光的表面质量.提出了固结磨料抛光丸片和亲水性FAP的加工模型,以及亲水性FAP的自修整机理.     

丁基橡胶合成研究进展与市场展望

简述了丁基橡胶(IIR)的合成技术进展,丁基橡胶生产技术有淤浆及溶液聚合两种工艺,近年来的合成技术主要围绕两种工艺的改进进行,如使用茂金属、二卤代单烷基铝和铝氧烷混合物等新型催化剂;使含卤单体参与共聚合直接制备卤化IIR等。通过分析橡胶和医用胶塞等的市场前景,提出了在国内开发丁基橡胶的必要性和紧迫性。     

Dispersion and stability of SiC ceramic slurry for stereolithography

Stereolithography based additive manufacturing provides an effective method to fabricate complex-shaped SiC ceramic components. The dispersion and stability of the ceramic slurry are very important for stereolithography. In this study, the dispersion and stability of SiC ceramic slurries were investigated systematically. The effects of resin monomers, dispersants, particle size, solid loading and ball milling time on the dispersion, rheological behavior and stability of SiC ceramic slurries were studied in detail. Finally, an optimal SiC ceramic slurry for stereolithography based additive manufacturing was obtained, and complex-shaped SiC ceramic architectures were fabricated.     

Additive manufacturing low shrinkage Si-based composite ceramics with SiCO microsphere/polyvinyl silicon acetylene slurry

In this paper, SiCO microsphere/polyvinyl silicon acetylene slurry was prepared for the first time with low viscosity and good rheological behavior. The dispersion of microspheres in the precursor resin and the UV-light curing performance of the slurry were investigated. After pyrolysis at 1000 °C, the properties of the three-dimensional (3D) printed samples were characterized. The introduction of SiCO microspheres reduced the specimen shrinkage of the pure precursor photosensitive resin used for additive manufacturing and improved their mechanical properties. When the addition of SiCO powder increased from 0 wt% to 10 wt%, the linear shrinkage decreased from 33 % to 26 %, and the flexural strength increased from 43.9 MPa to 79.8 MPa. This study realizes the preparation of Si-based composite materials through low-cost LCD additive manufacturing technology. It confirms the great potential of low-cost light-curing additive manufacturing to fabricate complex functional composite ceramic materials.     

Performance modulation and 3D printing parameters optimization of implantable medical tricalcium-silicate/polyetherimide composite

Tricalcium silicate (C3S)/polyetherimide (PEI) stents are manufactured through an additive manufacturing process using binder jetting. The key issues of C3S/PEI composite ceramic slurry and additive manufacturing process parameters are discussed in detail. Firstly, the low-temperature auxiliary sintering temperature of the sample was determined, and the influence of PEI content on the compressive strength and bending strength before and after sintering was studied. The sintering temperature and optimal PEI content are 340 °C and 10 wt%. Under this PEI content, the flow rate change during the printing process of the slurry was measured, and a C3S/PEI composite slurry suitable for binder jetting additive manufacturing was obtained, and it had excellent mechanical properties. The effect of the parameters of the binder jetting additive manufacturing process on the molding quality of the C3S/10PEI composite ceramic slurry was studied. The effect of the printed layer height on the deposition line width and height was explored, resulting in a selection rule for the printing layer height using nozzle diameters. The influence of the number of layers of the printed sample on the height and line width of the sample is studied. Under the condition that the height of the printing layer is 80% of the nozzle diameter and the hot air assisted drying, the maximum error of the forming size is only 3.13%. Finally, the biocompatibility and cell adsorption effect of the scaffold were studied, and it was found that the C3S/PEI scaffold, which was additively manufactured by binder jetting and sintered at low temperature, had good biological properties.