In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点的形貌和光学性质

提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点，并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点。实验结果表明，随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm，In0.5Ga0.5As量子点的密度增大、均匀性提高, Al原子扩散和浸润层对量子点PL谱的影响被消除，而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层。由此可见，选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究。     

不同淀积厚度InAs量子点的喇曼散射

利用喇曼散射方法在77K温度下对不同淀积厚度的InAs/GaAs量子点材料进行了研究.在高于InAs体材料LO模的频率范围内观察到了量子点的喇曼特征峰,分析表明应变效应是影响QD声子频率的主要因素.实验显示,随着量子点层淀积厚度L的增加,InAs量子点的声子频率由于应变释放发生红移.在加入InAlAs应变缓冲层的样品中,类AlAs声子峰随L增大发生了蓝移,从侧面证实了InAs量子点层的应变释放过程.     

GaAs（100）衬底上自组织生长InAs量子点的研究

本文利用在ＧａＡｓ（１００）衬底上自组织生长超薄层ＩｎＡｓ的方法得到了ＩｎＡｓ量子点结构．当ＩｎＡｓ的覆盖度小于１．７ＭＬ（Ｍｏｎｏ－Ｌａｙｅｒ）时，ＩｎＡｓ层仍保持二维生长模式，而当ＩｎＡｓ的覆盖度大于１．７ＭＬ时，ＩｎＡｓ层将会成岛生长，得到的量子点的尺寸和分布相当均匀．我们还研究了不同覆盖度的ＩｎＡｓ层的光致发光（ＰＬ）特性，结果发现在成岛前后，它们的ＰＬ特性有明显差异．     

不同淀积厚度InAs量子点的喇曼散射

利用喇曼散射方法在77K温度下对不同淀积厚度的InAs/GaAs量子点材料进行了研究.在高于InAs体材料LO模的频率范围内观察到了量子点的喇曼特征峰,分析表明应变效应是影响QD声子频率的主要因素.实验显示,随着量子点层淀积厚度L的增加,InAs量子点的声子频率由于应变释放发生红移.在加入InAlAs应变缓冲层的样品中,类AlAs声子峰随L增大发生了蓝移,从侧面证实了InAs量子点层的应变释放过程.     

PbSe缓冲层表面微结构的演化及PbTe量子点的制备

用分子束外延技术在BaF2衬底（111）晶面上生长了PbSe单晶薄膜，研究了不同Se/PbSe束流比（Rf）对薄膜表面形貌的影响. 在无Se束流（Rf=0）下制备的PbSe薄膜表面呈现三维岛状结构. 当Rf较小（例如0.2) 时，样品表面呈现三角形孔状结构特征，孔的尺寸随Rf的增大而减小. 当Rf较大（0.6）时，样品表面的三角形孔消失，出现单原子层厚度的螺旋结构. 螺旋由台阶环构成，平面尺寸为1～3μm，表面台阶平均宽度为150nm，台阶间高度差为一个单原子层（1ML=0.354nm) . PbSe薄膜表面微结构的演化是由于Se束流改变了薄膜中的应变弛豫方式，从而改变了薄膜的生长模式引起的. 最后，我们在以螺旋结构为特征的PbSe缓冲层表面自组织生长了PbTe量子点，观察到两种高度分布的量子点.     

InGaAs（InAIAs）／InP和InP／InAIAs湿法选择腐蚀研究

介绍了两种选择腐蚀液对InGaAs（InAlAs）／InP和InP／InAlAs异质结构材料选择腐蚀的实验结果，重点介绍在InAlAs上面生长InP的湿法选择腐蚀，用HCl：H3PO4：CH3COOH系列腐蚀液，InP／InAlAs选择比大于300。InP／InAlAs湿法选择腐蚀的结果可以很好应用到OEIC芯片制作中，并取得了较好的器件及电路结果。     

In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点的形貌和光学性质

提出了利用分子束外延方法生长In0.5Ga0.5As/In0.5Al0.5As应变耦合量子点,并分析量子点的形貌和光学性质随GaAs隔离层厚度变化的特点.实验结果表明,随着耦合量子点中的GaAs隔离层厚度从2 nm增加到10 nm,In0.5Ga0.5As量子点的密度增大、均匀性提高,Al原子扩散和浸润层对量子点PL谱的影响被消除,而且InAlAs材料的宽禁带特征使其成为InGaAs量子点红外探测器中的暗电流阻挡层.由此可见,选择合适的GaAs隔离层厚度形成InGaAs/InAlAs应变耦合量子点将有益于InGaAs量子点红外探测器的研究.     

不同单晶硅衬底的多孔硅的拉曼和致发光谱研究

用拉曼谱和光致发光谱研究了不同掺杂类型和掺杂浓度的单晶硅衬底上制备的多孔硅（PS）。根据拉曼谱估计了不同衬底PS的硅残留体的尺寸，结果与其它实验的结论相符。把由拉曼谱得到的PS尺寸和由光致发光谱得到的PS荧光峰能量相对比，发现单纯的量子限制模型不能统一解释不同衬底PS的光发射现象。     

不同单晶硅衬底的多孔硅的拉曼和光致发光谱研究

用拉曼谱和光致发光谱研究了不同掺杂类型和掺杂浓度的单晶硅衬底上制备的多孔硅（ＰＳ）．根据拉曼谱估计了不同衬底ＰＳ的硅残留体的尺寸，结果与其它实验的结论相符．把由拉曼谱得到的ＰＳ尺寸和由光致发光谱得到的ＰＳ荧光峰能量相对比，发现单纯的量子限制模型不能统一解释不同衬底ＰＳ的光发射现象．     

二维Ge岛成核早期阶段的动力学蒙特卡罗模拟

采用动力学蒙特卡罗(Kinetic Monte Carlo)方法模拟了Si／Ge系统自组织生长Ge量子点过程中二维Ge岛成核的早期阶段，引入吸附原子导致的应力场，对原子扩散的势垒进行了修正，研究了温度和应力场分布对二维Ge岛成核位置以及尺寸分布的影响，结果表明应力场对二维岛的成核具有决定作用，采用调制应力的方法可以有效控制量子点的自组织生长过程。     

Capacitance-voltage analysis of InAs quantum dots grown on InAlAs/InP(0 0 1)

The electronic properties of InAs quantum dots (QDs) grown on InAlAs/InP(0 0 1) were studied by using capacitance-voltage (C-V) analysis and photoluminescence (PL) measurements. The level positions of electrons and holes could be studied separately by using n- and p-type InAlAs matrices, respectively. The holes are found to be more confined than electrons in these kinds of dots.     

InAlAs/InGaAs复合限制层对InAs量子点发光性质的影响

系统研究了InAlAs/InGaAs复合限制层对InAs量子点光学性质的影响;发现InAs量子点的基态发光峰位、半高宽以及基态与第一激发态的能级间距都强烈地依赖于InAlAs薄层的厚度和In的组分;得到了室温发光波长在1.35μm,基态与第一激发态的能级间距高达103 meV的InAs量子点的发光特性。这一结果对实现高T_0的长波长InAs量子点激光器的室温激射具有重要意义。     

Nonequilibrium room-temperature carrier distribution in InAs quantum dots overgrown with thin AlAs/InAlAs layers

The optical properties of quantum dots (QDs) formed in GaAs or Al_0.3Ga_0.7As matrices by overgrowth of initial InAs islands formed in the Stranski-Krastanov mode with thin AlAs/InAlAs layers have been studied. It is shown that no transport of carriers between the QDs occurs in the temperature range 10–300 K, so the carrier distribution is of a nonequilibrium nature. The thermal excitation of carriers from the QDs is suppressed by an increase in the energy spacing between the ground and excited states, absence of the level related to the wetting layer, and higher carrier localization energy in the QDs with respect to the continuum states when the Al_0.3Ga_0.7As matrix is used.     

纳米硅量子点/氮化硅三明治结构的电致发光

采用等离子体化学气相沉积技术制备了两种不同非晶硅层厚度的氮化硅/氢化非晶硅/氮化硅三明治结构,研究了不同能量激光退火对薄膜晶化的影响。通过拉曼分析,发现在激光能量为320mJ时,样品开始晶化,随着能量的提高晶化程度增加,在340mJ时达到最大。根据拉曼晶化峰的偏移,计算得出硅量子点尺寸为2.8nm和4.7nm,表明三明治结构对形成的硅量子点的尺寸具有限制作用。设计并制备了基于该结构的电致发光器件,在偏压大于10V时,在室温下可观测到电致发光。发现不同激光能量下晶化后的样品的电致发光强度不同,发光峰位在680nm和720nm附近。分析表明电致发光来源可以归结为电子空穴对在硅量子点中的辐射复合发光。     

Green synthesis of yellow emitting PMMA–CdSe/ZnS quantum dots nanophosphors

We herein report the fabrication of highly fluorescent yellow emitting nanophosphors using CdSe/ZnS quantum dots (QDs) dispersed in polymethyl methacrylate (PMMA). The QDs were synthesised via a simple, non-phosphine and one pot synthetic method in the absence of an inert atmosphere. The as-prepared nanocrystallites were characterised by Fourier transform infrared spectroscopy (FTIR), ultraviolet–visible (UV–vis) and photoluminescence spectroscopy, energy-dispersive spectroscopy (EDS), Raman spectroscopy, transmission electron microscopy (TEM) and high resolution TEM (HRTEM) microscopy. Optical analysis confirmed that the as-synthesised CdSe/ZnS QDs were of high quality with sharp absorption peaks, bright luminescence, narrow emission width and high PL quantum yield (up to 74%). The electron microscope images showed that the QDs are small and spherical in shape with narrow size distributions while the HRTEM micrograph confirmed the high crystallinity of the material. The Raman analysis of the QDs revealed the formation of core–shell structure and the energy dispersive spectroscopy confirmed the presence of the corresponding elements (i.e., Cd, Se, Zn and S). The dispersion of the core–shell QDs in PMMA matrix led to the red-shifting of the emission position from 393 nm in the neat PMMA to 592 nm in the nanocomposite. The fabricated highly fluorescent yellow emitting PMMA–CdSe/ZnS core–shell QDs polymer nanocomposite film display excellent optical properties without loss of luminescence. Furthermore, the as-synthesised organic soluble CdSe/ZnS QDs were successfully converted into highly water soluble QDs after ligand exchange with mercaptoundecanoic acid (MUA) without the loss of their emission properties. The simplicity of the method and the quality of the as-synthesised nanocomposite make it a promising material for the large scale fabrication of diverse optical devices.     

UHV/CVD自对准生长Ge量子点(英文)

在超高真空化学汽相淀积设备(UHV/CVD)上生长了小尺寸、大密度、垂直自对准的Ge量子点。采用原子力显微镜分析量子点的尺寸,可优化其生长温度和时间,在550℃,15s的条件下生长出尺寸最小的量子点,直径30nm,高约2nm。最上层多层结构Ge量子点中岛状量子点的比例为75%,其直径66nm,高11nm,密度4.5×109cm-2。利用透射电子显微镜分析了垂直自对准的Ge量子点的截面形貌,结果表明多层结构Ge量子点是垂直自对准的。Ge量子点及其浸润层的喇曼谱峰位分别为299cm-1和417cm-1,说明Ge量子点是应变的并且界面存在互混现象。采用光荧光谱分析了Ge量子点的光学特性。     

1.46μm room-temperature emission from InAs/InGaAs quantum dot nanostructures

We present a study on InAs/InGaAs QDs nanostmctures grown by molecular beam epitaxy on InGaAs metamorphic buffers,that are designed so as to determine the strain of QD and, then, to shift the luminescence emission towards the 1.5 μm region (QD strain engineering). Moreover, we embed the QDs in InAlAs or GaAs barriers in addition to the InGaAs confining layers, in order to increase the activation energy for confined carrier thermal escape; thus, we reduce the thermal quenching of the photoluminescence, which prevents room temperature emission in the long wavelength range. We study the dependence of QD properties, such as emission energy and activation energy, on barrier thickness and height and we discuss how it is possible to compensate for the barrier-induced QD emission blue-shift taking advantage of QD strain engineering. Furthermore, the combination of enhanced barriers and QD strain engineering in such metamorphic QD nanostructures allowed us to obtain room temperature emission up to 1.46 μm, thus proving how this is a valuable approach in the quest for 1.55 μm room temperature emission from QDs grown on GaAs substrates.     

Effect of a Two-Step Recess Process Using Atomic Layer Etching on the Performance of In0.52Al0.48As/In0.53Ga0.47As p-HEMTs

The characteristics of 0.15- mum InAlAs/InGaAs pseudomorphic high-electron mobility transistors (p-HEMTs) that were fabricated using the Ne-based atomic layer etching (ALET) technology and the Ar-based conventional reactive ion etching (RIE) technology were investigated. As compared with the RIE, the ALET used a much lower plasma energy and thus produced much lower plasma-induced damages to the surface and bulk of the In_0.52AI_0.48As barrier and showed a much higher etch selectivity (~70) of the InP spacer against the In_0.52Al_0.48As barrier. The 0.15-mum InAlAs/InGaAs p-HEMTs that were fabricated using the ALET exhibited improved G_m,max (1.38 S/mm), I_ONn/I_OFF(1.18X10⁴), drain-induced barrier lowering (80 mWV), threshold voltage uniformity (V_th,avg = -190 mV and alpha = 15 mV), and ftau (233 GHz), mainly due to the extremely low plasma-induced damage in the Schottky gate area.