SiC_p表面改性对Al-Si基复合材料耐磨性的影响

为了改善SiC颗粒(SiC_p)与Al-Si基体界面的润湿性,对SiC_p进行了高温氧化、NaOH溶液腐蚀、K2ZrF6溶液涂覆表面改性处理,通过粉末冶金法制备了不同表面改性状态的SiC_p增强Al-Si基复合材料。研究表明,随氧化时间的增加,SiC_p表面SiO2层的厚度增加。经过NaOH溶液腐蚀后SiC_p表面变粗糙,K2ZrF6饱和溶液处理后SiC_p表面存在一层涂层;随SiC_p氧化时间延长,试样的密度、硬度及耐磨性先增加后减小;SiC_p氧化10h时,试样磨损量最低,与未改性的SiC_p相比,磨损量降低了40%。     

不同SiCp预处理的SiCp/Al复合材料界面特征及耐蚀性

采用无压渗透法制备了经不同SiCp表面预处理的SiCp/Al复合材料,研究了SiC颗粒表面预处理对SiCp/Al复合材料界面特征及其腐蚀行为的影响。结果表明,高温氧化处理使SiC颗粒边界钝化,颗粒表面形成均匀SiO2氧化膜,复合材料界面结合良好,而未表面处理和酸洗的复合材料界面孔隙多,界面结合较差。经高温氧化SiC颗粒表面预处理的SiCp/Al复合材料耐腐蚀性能最好,酸洗次之,未表面处理最差。高温氧化处理形成的SiO2氧化膜对SiC颗粒起着保护作用,抑制了SiCp/Al界面Al4C3相形成,对复合材料耐腐蚀性能有利。     

SiC高温氧化行为及Al基复合材料界面研究

将SiC颗粒在空气中进行850~1100℃高温氧化增重试验。研究了氧化时间、氧化温度对SiC颗粒表面氧化行为和氧化层结构的影响。采用烧结温度500℃压力30MPa保压时间30min的热压烧结工艺,制备出体积分数为20%的SiC_P/Al复合材料。研究了SiC氧化过程对SiC_P/Al复合材料界面的影响。结果表明:SiC在850℃以上,随氧化时间延长或温度升高,氧化层从非晶态向晶态转变。1100℃氧化4 h后,SiO_2氧化层厚度为252nm。本文优化的正四面体模型计算厚度约190nm,传统球形模型计算厚度约110nm。氧化层中SiO_2主要为高温型方石英晶型;SiC颗粒氧化后与Al基体形成了SiC/SiO_2和Al_2O_3/Al复合界面组织。     

颗粒氧化处理对SiC_p/Al复合材料耐蚀性的影响

对SiC颗粒(SiCp)进行了1 100℃高温氧化处理,并制备了SiCp/Al复合材料。采用化学浸泡试验、扫描电镜、失重曲线、电化学测试等方法研究了氧化处理时间对SiCp/Al复合材料腐蚀行为的影响。结果表明,不同时间氧化处理后SiC颗粒表面形成不同形貌的SiO2氧化层,该氧化层可阻碍高温下铝液与SiC颗粒直接接触,避免了有害界面反应的发生,阻碍容易发生水解反应的Al4C3的生成,进而提高SiCp/Al复合材料的耐蚀性。     

SiC_p/ZL101基复合材料的界面与性能

以体积比为7:3的比例混合粒径分别为75和15μm两种尺寸的SiC颗粒,将其分别在1 200℃高温烧结2、4、6、8和10 h后采用气压浸渗法制备SiC体积分数为70%的SiCp/ZL101基复合材料,研究预制件高温烧结后复合材料的界面,讨论氧化以及界面反应对复合材料抗弯强度和导热性能的影响,并利用实验热导率反算实际界面传热系数。结果表明:双尺寸的SiC颗粒在Al合金基体中分布均匀;SiC预制件的氧化改变了SiC颗粒与Al合金基体之间的结合形式,从而有效提高了界面结合强度,在1 200℃氧化4 h,其抗弯强度和热导率均达到最高,分别为422 MPa和195 W/(m.K)。实际界面传热系数与复合材料热导率变化一致。此外,氧化钝化了SiC颗粒,其形貌的变化使得颗粒周围基体中的应力集中现象大大减少,提高了复合材料的抗弯强度,但是氧化时间过长的界面却不利于载荷的传递和基体的形变约束。     

Al含量及SiC预处理对SiCp/Ti基复合材料高温抗氧化性能的影响

通过800℃氧化试验,研究了不同Al含量以及SiC经600℃×3 h预处理后,SiCp/Ti基复合材料的氧化行为.利用SEM、EDS以及XRD分析了表面氧化层的形貌以及相组成.结果表明,未加Al复合材料氧化层的氧化产物主要为金红石TiO2,添加Al的材料中有少量Al2O3;对于SiC颗粒增强的Ti基复合材料,未加Al的抗氧化性能最好;当比较所有含Al的复合材料时,随着Al含量的增加,抗氧化性增强;对于具有相同Al含量的材料,SiC预处理可以促使界面较好结合,故可提高材料的抗氧化性.     

热压烧结SiCp/ZL101A复合材料显微组织研究

采用真空热压烧结在不同工艺参数下制备SiC颗粒体积分数分别为10%,20%,30%,40%的SiCp/ZL101A复合材料,研究烧结温度、保温时间等工艺参数对SiCp/ZL101A复合材料显微组织的影响以及SiC含量对SiC颗粒在基体ZL101A中分布均匀性的影响,同时对SiCp/ZL101A复合材料界面进行透射电镜显微分析。结果显示,随着烧结温度的增加,组织致密度增加,气孔数量及尺寸减小;保温时间的增加导致复合材料平均晶粒尺寸的增加;随着SiC颗粒体积分数的增加,SiC颗粒在基体ZL101A中分布均匀性变差;固相烧结法制备的SiCp/ZL101A复合材料中没有出现界面反应现象。     

烧结温度对SiC增强铝基复合材料组织和性能的影响

SiC/ZL109复合材料中增强体SiC分别在不同的氧化温度(800、900、1 000、1 100℃)下高温氧化5 h,并通过搅拌铸造法制备复合材料。结果表明,SiC氧化温度在800℃时,SiC颗粒氧化层基本形成;在800℃以上,SiC颗粒被氧化层全部覆盖。在800~1 100℃,Si O2层厚度的变化范围在0.096~0.542 5μm,其中在1 000℃时,SiC增厚0.383μm。在1 000℃氧化5 h条件下,SiC/ZL109复合材料的界面存在MgAl_2O_4相,但无脆性相Al_4C_3存在,这有利于界面结合,且此条件下材料的密度最大,孔隙率和磨损率最小。     

影响颗粒增强铝基复合材料热导率因素研究

研究了颗粒种类、粘接剂含量和界面状态对颗粒增强铝基复合材料热导率的影响.制备了碳化硅和立方氮化硼两种颗粒及粘接剂添加量不同复合材料,并通过1 300 ℃下湿氧气氛氧化、氢氟酸酸洗及将复合材料在600 ℃时进行长时间热处理从而获得不同的界面状态.由于立方氮化硼颗粒本身的热导率高于碳化硅颗粒,尽管前者的体积分数高,但其复合材料的热导率仍高于后者.随着粘接剂添加量增多,复合材料的热导率逐渐降低.高温湿氧气氛处理后,碳化硅颗粒表面被氧化硅覆盖,制备的复合材料热导率明显降低;酸洗处理后,碳化硅颗粒中的杂质基本去除,制备的复合材料热导率得到提高.随着高温处理时间延长,复合材料的热导率先升高后降低.     

SiCp氧化处理对SiCp/Al复合材料润湿性和界面结合的影响

通过对SiCp在不同温度下的氧化处理,研究了颗粒氧化对搅拌铸造法制备的SiCp增强铝基复合材料的润湿性和界面结合的影响.结果表明,氧化处理后的颗粒表面形成了具有一定厚度的SiO2氧化层,该氧化层在高温下与铝熔体发生界面反应,从而有效地改善了颗粒与基体间的润湿性,提高了界面结合强度;所制备的复合材料颗粒分布均匀,界面结合良好;界面处有MgAl2O4、Mg2Si生成,没有发现有害界面反应产物Al4C3;复合材料的断裂方式为颗粒的断裂和颗粒从基体中的拔出.     

电子封装SiCp／Al复合材料导热性能研究与进展

概述了电子封装用SiCp／Al复合材料导热性能研究的现状与进展,分析了基体成分、增强体SiCp颗粒体积分数、增强体SiCp颗粒尺寸及形貌、热处理工艺以及复合材料中界面对SiCp／Al复合材料导热性能的影响,并介绍了复合材料热导率的理论计算模型与测试方法。     

SiC颗粒增强体对铝基复合材料微弧氧化膜生长的影响

用微弧氧化方法在SiCp／2024铝基复合材料表面沉积出较厚的陶瓷膜，测定了陶瓷膜的生长曲线和相组成，提出了金属基复合材料微弧氧化膜生长模型．结果表明，微弧放电烧结作用下，膜层内SiCp增强体大部分已被熔化并氧化，只有少数残余的SiCp颗粒仍然保留在靠近界面的膜层内．SiCp增强体阻碍了微弧氧化膜的生长，但它并未破坏微弧氧化膜的完整性，这同铝基复合材料阳极氧化膜结构完全不同．     

Hot Deformation Behavior of 6061 and 7108 Al-SiCp Composites

Hot deformation behavior of Al 6061- and Al 7108-SiC particulated composites (Al-PMMCs), prepared by stir casting with SiC particulates (SiCp) size of 8 and 15 μm and volume fraction from 0 to 20% is studied by uniaxial compression test carried out at temperature range from room temperature to 500 °C. The flow stress, work hardening behavior, and Young’s modulus are determined. Dynamic recrystallization is also studied. Work hardening and Young’s modulus are directly correlated with composite constituents, whereas the flow stress is greatly influenced by the porosity and SiCp agglomeration. The role of the SiCp in increasing the flow stress decreases by increasing the deformation temperature. The dynamic recrystallization process is stimulated by refining the SiCp and increasing their fraction in soft Al matrix. On the other hand, the PMMCs with Al6061 matrix has more potential for strain hardening than that with Al 7108 matrix. The strain hardening rate is influenced by the matrix type more than the SiCp volume fraction and size.     

Influence of Reinforcement Content and Matrix Composition on the Oxidation Resistance of Aluminum-Matrix Composites (A3xx.x/SiCp)

A study was made on the influence of the SiCp proportion and the matrix concentration of four composites (A360/SiC/10p, A360/SiC/20p, A380/SiC/10p, A380/SiC/20p) on their oxidation behavior. Gravimetric tests were used in a kinetics study of the corrosion process at different temperatures (350, 400, 450, and 500°C). The influence of corrosion on mechanical properties was evaluated by hardness measurements. The nature of corrosion products and the influence of the microstructure on the morphology and growth of the oxidation layer were analyzed by SEM and low-angle XRD. The extent of the damage due to oxidation for Al/SiCp composites increases with the SiCp concentration due to the increase of nucleation sites. One of these nucleation sites is in the interface region between the matrix and the particles. Oxidation was influenced more by the percentage of alloy elements in the matrix than by the proportion of SiCp reinforcement. The presence of Cu and Ni in the matrix favors the oxidation process through the formation of different intermetallic compounds.     

SiC颗粒氧化行为及SiCp/铝基复合材料界面特征

界面反应和界面产物对SiCp/Al基复合材料的性能具有重要影响。对SiCp 的高温氧化行为进行了试验研究。结果表明 :SiCp 氧化起始温度为 80 0～ 85 0℃ ,其氧化增量和氧化产物SiO2 的体积分数及厚度与高温氧化处理的保温时间呈抛物线关系。以氧化处理的SiCp 为增强体 ,含Mg铝合金为基体 ,通过挤压铸造工艺制备复合材料。利用TEM和FE TEM对所得的复合材料界面进行观察 ,结果表明 ,在SiCp 表面形成了一定数量的尖晶石(MgAl2 O4 ) ,其数量和尺寸与Mg含量有关。由此 ,通过控制SiCp 的氧化处理工艺参数和基体合金成分 ,可以实现对SiCp/Al基复合材料界面反应及产物的控制     

Stability of External α-Al<Subscript>2</Subscript>O<Subscript>3</Subscript> Scales on Alloy 602 CA at 1100–1200 °C

An external ultrathin α-Al₂O₃ scale grown on the Ni-base alloy 602 CA during air oxidation at 800 °C was characterized by means of high-resolution TEM/EDX and electron diffraction. Alloy samples pre-oxidized at 800 °C were subsequently exposed at 1100, 1150 and 1200 °C for up to 100 h. Whereas the external alumina remained stable at 1100 °C, with the increasing exposure temperature, the pre-grown alumina scale tended to break down resulting in an external chromia scale accompanied by internal alumina precipitation. The transition from external to internal Al oxidation was investigated using SEM/EDX/EBSD. The critical Al depletion at the scale-alloy interface during the post-exposure at 1100–1200 °C was modeled using the CALPHAD-based thermodynamic-kinetic approach.     

Microstrucmre and thermal properties of recyclable Sip/1199A1 composites

Recyclable Si_p/1199Al composites with high volume fraction of Si particles were fabricated by squeeze-casting method. The microstructure was observed and the thermal properties were tested and calculated by theoretical models. Si_p/1199Al composites are all dense and macroscopically homogeneous without any particle clustering. The interface of Si_p/1199Al is clean, smooth and free from any interfacial reaction products. Si_p/1199Al composites have high thermal diffusivity (65.083 mm²/s) and thermal conductivity (168.211 W/(m· °C)). The specific heat capacity of Si_p/1199Al composites at constant pressure increases while the thermal diffusivity and thermal conductivity decrease with increasing temperature. Annealing treatment could improve the thermal properties. The results of Maxwell model and P.G. model are higher than those of experiment.     

Effect of graphite intercalation compounds in the interfacial zone on the mechanical and thermal properties of unidirectional carbon fiber reinforced spodumene composite

The interface in unidirectional carbon-fiber-reinforced β-spodumene matrix composite (UD-Cf/β-spodumene) significantly affected the thermal conductivity characteristics and mechanical properties due to the presence of a multi-layer interface. The mechanical and thermal properties of UD-Cf/β-spodumene composites with and without a multi-layer interface have been studied. The measured thermal conductivities, flexural strength and fracture toughness of composites with a multi-layer interface were much better than those composites with a clear interface. Interfacial layers with a multi-layer morphology originated from the diffusion of lithium from the β-spodumene matrix to the surface of the carbon fiber, which led to the formation of graphite intercalation compounds. The mechanical properties and thermal conductivity of UD-Cf/β-spodumene hot pressed at 1350 and 1400 °C were enhanced due to the textured interfacial microstructure and high thermal conductivity of graphite intercalation compounds. The textured interface decomposed at 1450 °C, resulting in the formation of a “strong” interface. Inevitably, the mechanical properties and thermal conductivity decreased.     

Thermal conductivity behavior of SPS consolidated AlN/Al composites for thermal management applications

AlN/Al composites are a potentially new kind of thermal management material for electronic packaging and heat sink applications.The spark plasma sintering (SPS) technique was used for the first time to prepare the AlN/Al composites,and attention was focused on the effects of sintering parameters on the relative density,microstructure and,in particular,thermal conductivity behavior of the composites.The results showed that the relative density and thermal conductivity of the composites increased with increasing sintering temperature and pressure.The composites sintered at 1550 ℃ for 5 min under 70 MPa showed the maximum relative density and thermal conductivity,corresponding to 99% and 97.5 W m-1 K-1,respectively.However,the thermal conductivity of present AlN/Al composites is still far below the theoretical value.Possible reasons for this deviation were discussed.     

压渗SiCp／Al电子封装复合材料的研究

采用压渗的方法制取了ＳｉＣ体积分数基本相同、而颗粒大小不同的ＳｉＣｐ／Ａｌ电子装封复合材料。测定热膨胀系数表明，在ＳｉＣ体积分数基本相同时，ＳｉＣ颗粒的大小对ＳｉＣ／Ａｌ复合材料的热膨胀系数影响很大。颗粒和基体界面面积的大小直接影响热应力的大小，从而影响基体的弹塑性行为。