基于四值脉冲参数模型的单粒子瞬态传播机理与软错误率分析方法

随着工艺尺寸的不断缩小,由单粒子瞬态(Single Event Transient, SET)效应引起的软错误已经成为影响宇航用深亚微米VLSI电路可靠性的主要威胁,而SET脉冲的产生和传播也成为电路软错误研究的热点问题。通过研究SET脉冲在逻辑链路中的传播发现:脉冲上升时间和下降时间的差异能够引起输出脉冲宽度的展宽或衰减;脉冲的宽度和幅度可决定其是否会被门的电气效应所屏蔽。该文提出一种四值脉冲参数模型可准确模拟SET脉冲形状,并采用结合查找表和经验公式的方法来模拟SET脉冲在电路中的传播过程。该文提出的四值脉冲参数模型可模拟SET脉冲在传播过程中的展宽和衰减效应,与单参数脉冲模型相比计算精度提高了2.4%。该文应用基于图的故障传播概率算法模拟SET脉冲传播过程中的逻辑屏蔽,可快速计算电路的软错误率。对ISCAS89及ISCAS85电路进行分析的实验结果表明:该方法与HSPICE仿真方法的平均偏差为4.12%,计算速度提升10000倍。该文方法可对大规模集成电路的软错误率进行快速分析。     

脉冲激光试验评估模拟电路单粒子效应

利用脉冲激光对典型模拟电路的单粒子效应进行了试验评估及加固技术试验验证,研究2种不同工艺的运算放大器的单粒子瞬态脉冲(SET)效应,在特定工作条件下两者SET脉冲特征规律及响应阈值分别为79.4 pJ和115.4 pJ,分析了SET脉冲产生和传播特征及对后续数字电路和电源模块系统电路的影响。针对SET效应对系统电路的危害性,设置了合理的滤波电路来完成系统电路级加固,并通过了相关故障注入试验验证,取得了较好的加固效果。     

适用于纳米工艺的SET/SEU加固触发器设计

针对触发器在纳米级工艺下容易受空间辐射中单粒子效应的影响而产生软错误的情况,基于CPSH触发器结构,研究了一种对单粒子效应中SET/SEU加固的延时采样软错误防护(DSSEP)触发器结构.该触发器由延时采样单元、输入传输单元、软错误鲁棒存储锁存器和反相输出单元组成.延时采样单元对来自其他逻辑电路的输出数据进行采样,采样数据经输入传输单元写入软错误鲁棒存储锁存器,并通过一个反相输出单元输出.仿真结果表明,DSSEP触发器具有很好的SET/SEU加固能力.经过比较和分析,证明DSSEP触发器与具有同样SET/SEU加固能力的保护门触发器(GGFF)相比,在晶体管数目和传播延时方面仅为GGFF的62％和33％.     

SiGeBiCMOS线性器件脉冲激光单粒子瞬态效应研究

验证SiGe BiCMOS工艺线性器件的单粒子瞬态（Single Event Transient,SET）效应敏感性,选取典型运算放大器THS4304和稳压器TPS760进行了脉冲激光试验研究。试验中,通过能量逐渐逼近方法确定了其诱发SET效应的激光阈值能量,并通过逐点扫描的办法分析了器件内部单粒子效应敏感区域,并在此基础上分析了脉冲激光能量与SET脉冲的相互关系,获得了单粒子效应截面,为SiGe BiCMOS工艺器件在卫星电子系统的筛选应用以及抗辐射加固设计提供数据参考。     

SEU/SET加固D触发器的设计与分析

针对D触发器的抗单粒子辐射效应加固,提出了一种新型的保护门触发器(GGFF)设计,使用两个保护门锁存器串接成主从触发器.通过Spice仿真验证了GGFF抗SEU/SET的能力,通过比较和分析,证明GGFF对于具有同样抗SEU/SET能力的时间采样触发器(TSFF),在电路面积和速度上占据明显优势.     

纳米CMOS电路的单粒子瞬态影响因素研究

进入纳米尺度后,单粒子瞬态(SET)成为高能粒子入射VLSI产生的重要效应,准确、可靠的SET模拟对评估VLSI的可靠性有着重要的影响。以反相器为例,针对脉冲峰值和半高全宽两个指标,研究了电路模拟中影响SET的因素,主要有电流脉冲幅值、脉冲宽度、负载电容、环境温度及器件尺寸。通过对45和65 nm两种技术节点下的电路的仿真,研究了这些因素对SET的影响,并探讨了可能的原因。结果显示,这些因素对SET的影响趋势和程度有很大的差异,且器件尺寸越小,这些因素对SET的影响越显著。通过设置合适的参数,可以实现电路的抗辐射加固。     

基于向量传播的单粒子瞬态模拟方法研究

提出了一种基于向量传播的单粒子瞬态(SET)模拟方法。基于4值参数的模型来表征SET脉冲的形状,建立脉冲参数传播的数据库。使用查找表及经验公式来计算SET脉冲形状参数在逻辑门节点之间的传播。为了模拟SET脉冲在传播过程中的重汇聚,定义了4种重汇聚模式,并给出对应的等效脉冲计算方法。提出的基于向量传播的分析算法能够对SET脉冲的产生、传播及捕获过程进行精确分析。ISCAS''89电路的实验结果表明,该方法与Hspice仿真方法的平均误差为1.827%,计算速度提升了1 700倍。在不损失精度的前提下,该方法可对VLSI电路在通用或特定测试向量下的可靠性进行快速自动分析。     

运放和光耦的单粒子瞬态脉冲效应

利用脉冲激光模拟单粒子效应实验装置研究了通用运算放大器LM124J和光电耦合器HCPL5231的单粒子瞬态脉冲(SET)效应,获得了LM124J工作在电压跟随器模式下的瞬态脉冲波形参数与等效LET值的关系,甄别出该器件SET效应的敏感节点分布.初步分析了SET效应产生的机理.以HCPL5231为例,首次利用脉冲激光测试了光电耦合器的单粒子瞬态脉冲幅度、宽度与等效LET值的关系,并尝试测试了该光电耦合器的SET截面,实验结果与其他作者利用重离子加速器得到的数据符合较好,证实了脉冲激光测试器件单粒子效应的有效性.     

一种新颖高效抗SEU/SET锁存器设计

随着工艺技术的发展,集成电路对单粒子效应的敏感性不断增加,因而设计容忍单粒子效应的加固电路日益重要.提出了一种新颖的针对单粒子效应的加固锁存器设计,可以有效地缓解单粒子效应对于电路芯片的影响.该锁存器基于DICE和C单元的混合结构,并采用了双模冗余设计.SPICE仿真结果证实了它具有良好的抗SEU/SET性能,软错误率比M.Fazeli等人提出的反馈冗余锁存器结构减少了44.9%.与经典的三模冗余结构比较,面积开销减少了28.6%,功耗开销降低了超过47%.     

单粒子瞬态脉冲的片上测量

提出了一套适用于组合逻辑电路的单粒子瞬态(Single-Event Transient,SET)特性的片上测量方案。基于中国科学院微电子研究所350 nm SOI工艺,设计了一款集脉冲收集、测量、自测试于一体的SET辐射测试芯片。通过激光脉冲实验,验证了该方案的有效性,为在此工艺上开展加固研究奠定基础。分析了影响片上测量精度的多种因素,提出了用于修正测试结果、提高精度的校正方法。     

一款通过抗辐照设计加固技术实现的抗单粒子锁相环

本文设计了一款抗辐照设计加固的锁相环。通过增加一个由锁定探测电路、两个运放和4个MOS器件组成的电荷补偿电路,该锁相环显著地减小了单粒子瞬态引起失锁后系统的恢复时间。许多传统的加固方法主要是致力于提高电荷泵输出结点对单粒子瞬态的免疫力,本文的加固方法不仅能够降低电荷泵输出结点对单粒子瞬态的敏感性,而且也降低了其他模块对单粒子瞬态的敏感性。本文还提出了一种新的描述锁相环对单粒子顺态敏感性的系统模型,基于该模型比较了传统的和加固的锁相环对单粒子瞬态的免疫能力。通过Sentaurus TCAD 仿真平台模拟了单粒子瞬态引起的电流脉冲,用于电路仿真。基于130 nm CMOS 工艺设计了两个锁相环电路,晶体管级的仿真表明本文提出的抗单粒子加固锁相环的恢复时间比传统的锁相环提高了94.3%,同时,电荷补偿电路没有增加系统参数设计的复杂性。     

一种低开销的三点翻转自恢复锁存器设计

随着集成电路特征尺寸的不断缩减,在恶劣辐射环境下,纳米级CMOS集成电路中单粒子三点翻转的几率日益增高,严重影响可靠性。为了实现单粒子三点翻转自恢复,该文提出一种低开销的三点翻转自恢复锁存器(LC-TNURL)。该锁存器由7个C单元和7个钟控C单元组成,具有对称的环状交叉互锁结构。利用C单元的阻塞特性和交叉互锁连接方式,任意3个内部节点发生翻转后,瞬态脉冲在锁存器内部传播,经过C单元多级阻塞后会逐级消失,确保LC-TNURL锁存器能够自行恢复到正确逻辑状态。详细的HSPICE仿真表明,与其他三点翻转加固锁存器(TNU-Latch, LCTNUT, TNUTL, TNURL)相比,LC-TNURL锁存器的功耗平均降低了31.9%,延迟平均降低了87.8%,功耗延迟积平均降低了92.3%,面积开销平均增加了15.4%。相对于参考文献中提出的锁存器,LC-TNURL锁存器的PVT波动敏感性最低,具有较高的可靠性。     

基于互连线延时的SET脉冲宽度评估模型

研究了互连线延时对单粒子瞬态脉冲效应的影响。研究发现,随着互连线长度的增加,瞬态脉冲首先被展宽,在一定距离后,脉冲宽度衰减为零。基于此研究结果,提出了脉冲宽度随互连线长度变化的数学解析模型。在SMIC 130 nm、90 nm CMOS工艺下,采用Spice软件对应用该数学解析模型的多种器件进行验证。结果表明,该数学解析模型的计算值与仿真值误差最大为6.09%,最小为0.37%。该模型提高了单粒子瞬态脉冲宽度的评估准确度,可应用于单粒子瞬态脉冲效应的硬件加速模拟。     

The impact of Miller and coupling effects on single event transient in logical circuits

With feature size scaling down, Miller feedback effects of gate-to-drain capacitance for transistors and coupling effects between interconnects will dramatically affect single event transient (SET) generation and propagation in combinational logic circuits. Two ways of ICs are arranged: linear and “S” types. For pulse width and delay time, SET propagations in two layouts of digital circuits are compared under considering the coupling effects between interconnects. An analytical model is used to describe the impact of Miller and coupling effects on SET propagation. A criterion for SET occurrence in digital circuits with effects of coupling and Miller feedback is presented. The influence of temperature and technology node on SET generation and propagation is analyzed. The results indicate that (1) the existence of these effects will improve the critical charge for SET generation and also reduce the estimated SER, and (2) the way of “S” type is more immune to SET than the scheme of linear.     

Low cost and highly reliable radiation hardened latch design in 65 nm CMOS technology

As a consequence of technology scaling down, gate capacitances and stored charge in sensitive nodes are decreasing rapidly, which makes CMOS circuits more vulnerable to radiation induced soft errors. In this paper, a low cost and highly reliable radiation hardened latch is proposed using 65 nm CMOS commercial technology. The proposed latch can fully tolerate the single event upset (SEU) when particles strike on any one of its single node. Furthermore, it can efficiently mask the input single event transient (SET). A set of HSPICE post-layout simulations are done to evaluate the proposed latch circuit and previous latch circuits designed in the literatures, and the comparison results among the latches of type 4 show that the proposed latch reduces at least 39% power consumption and 67.6% power delay product. Moreover, the proposed latch has a second lowest area overhead and a comparable ability of the single event multiple upsets (SEMUs) tolerance among the latches of type 4. Finally, the impacts of process, supply voltage and temperature variations on our proposed latch and previous latches are investigated.     

A New Analytical Model of SET Latching Probability for Circuits Experiencing Single- or Multiple-Cycle Single-Event Transients

As technology scales down, more single-event transients (SETs) are expected to occur in combinational circuits and thus contribute to the increase of soft error rate (SER). We propose a systematic analysis method to precisely model the SET latching probability. Due to the decreased critical charge and shortened pipeline stage, the SET duration time is likely to exceed one clock cycle. In previous work, the SET latching probability is modeled as a function of SET pulse width, setup and hold times, and clock period for single-cycle SETs. Our analytical model does not only include new dependent parameters such as SET injection location and starting time, but also precisely categorizes the SET latching probabilities for different parameter ranges. The probability of latching multiple-cycle SETs is specifically analyzed in this work to address the increasing ratio of SET pulse width over clock period. We further propose a method that exploits the boundaries of those dependent parameters to accelerate the SER estimation. Simulation results show that the proposed analysis method achieves up to 97% average accuracy, which is applicable for both single- and multiple-cycle SETs. Our case studies on ISCAS’85 benchmark circuits confirm our analysis on the impact of SET injection location and starting time on the SET latching probability. By exploiting our analytical model, we achieve up to 78% simulation time reduction on the process of SET latching probability and SER estimation, compared with Monte-Carlo simulation.     

电荷共享对于CMOS逻辑门单粒子瞬态响应的影响

随着CMOS工艺继续缩小,单粒子瞬态脉冲已经成为航天用数字电路的重要故障来源。同时,相邻晶体管之间的电荷共享也随之增加并导致组合电路中单粒子瞬态脉宽缩短,即脉宽抑制效应。之前的文献提出了PMOS到PMOS的脉宽抑制,而本文提出了三种新的脉宽抑制机理(NMOS到PMOS,PMOS到NMOS和NMOS到NMOS),并且通过90纳米三维工艺混合仿真进行了验证。本文的贡献主要有以下三点：1）除了PMOS到PMOS的情况,90纳米工艺下脉宽抑制在PMOS到NMOS和NMOS到NMOS中同样比较明显;2）脉宽抑制效应总体上与粒子入射能量关系较弱,而与粒子入射角度和版图结构(晶体管间距和N阱接触)关系较强。3）紧凑的版图和级联反向单元可以用来促进组合电路中的单粒子瞬态脉宽抑制效应。     

Low cost and highly reliable hardened latch design for nanoscale CMOS technology

With technology node shrinking, the susceptibility of a single chip to soft errors increases. Hence, the critical charge (Qcrit) of circuit decreases and this decrease is expected to continue with further technology scaling. In this paper previous hardened latch circuits are analyzed and it is found that previous designs offer limited protection against soft error especially for soft error caused by high energy particles and not all the nodes are under soft error protection. Therefore, in this paper we propose a low cost hardened latch design in 45 nm CMOS technology with full protection for all internal nodes as well as output node against soft error. Moreover, the proposed hardened approach is technology independent. Compared to previous hardened latch designs, the proposed design reduces cost in terms of power delay product (PDP) 59% on average.