磁控溅射Cd1-xZnxTe多晶薄膜组分的可控生长

采用双靶位共溅射方法制备出组分可控的Cd1-xZnxTe薄膜样品,组分偏离小于0.13.采用XRD对不同生长温度制备的样品进行了结晶性分析,研究了薄膜结晶与生长温度的关系.采用AFM、SEM对样品进行了表面和界面分析,表明薄膜表面平整,界面清晰.对不同组分的Cd1-xZnxTe样品进行了透射光谱测量,得到了光学性质随组分的变化规律,并拟合得出了这些样品的带隙和组分.     

CeO_2缓冲层热处理对Tl-2212薄膜超导特性的影响

本文采用原子力显微镜(AFM)和XRD研究了生长在蓝宝石(11-02)基片上的CeO_2缓冲层在不同的退火温度和退火时间下表面形貌和相结构的变化,以及对Tl-2212薄膜超导特性的影响.AFM和XRD研究表明,CeO_2薄膜在流动氧环境中退火,表面形貌发生显著的变化;CeO_2薄膜在最佳条件下退火后,可获得原子级光滑表面,结晶质量明显提高.实验结果表明,缓冲层的结晶质量和表面粗糙度与Tl-2212薄膜的超导特性密切相关.在经过最佳条件退火后的CeO_2缓冲层上制备了厚度为500 nm无裂纹的Tl-2212超导薄膜,其临界转变温度(T_c)达到107 K,液氮温度下临界电流密度(J_c)为3.9 MA/cm~2(77 K,0 T),微波表面电阻(R_s)约为281 μΩ(77 K,10 GHz).     

Tl-1223高温超导薄膜在蓝宝石单晶基片上的生长和性能研究

本文报道了采用射频磁控溅射法和快速升温烧结法在R面取向的蓝宝石单晶基片上生长CeO₂缓冲层和Tl-1223超导薄膜,研究了缓冲层生长情况和先驱膜后退火条件对超导薄膜结晶情况和超导特性的影响。AFM和XRD表征结果显示,蓝宝石基片经过退火后其表面形成具有光滑平台的台阶结构,同时基片的晶体质量得到了改善;本文所制备的CeO₂缓冲层和Tl-1223超导薄膜具有较好的c轴生长取向,而且两者呈现良好的ab面内织构。SEM表征结果显示,生长良好的Tl-1223超导薄膜呈层状结构,表面光滑平整、结构致密。在液氮环境下,测得所制备Tl-1223超导薄膜的临界转变温度T_c约为111 K,临界电流密度J_c(77 K,0 T)约为1.3 MA/cm²。     

热壁外延制备InAs/Si(211)薄膜及其电学性能研究

采用热壁外延(Hot Wall Epitaxy,HWE)沉积系统在单晶Si(211)衬底表面制备了InAs薄膜,研究了不同生长温度(300℃、350℃、400℃、450℃和500℃)对薄膜材料结构及其电学性能的影响.通过X射线衍射(XRD)、扫描电子显微镜(SEM)、原子力显微镜(AFM)、霍尔(Hall)测试等,对InAs/Si(211)薄膜的晶体结构、表面形貌及电学参数进行了测试分析.结果表明:采用HWE技术在Si(211)衬底表面成功制备了InAs薄膜,薄膜具有闪锌矿结构并沿(111)方向择优生长.随着生长温度从300℃升高到500℃,全峰半高宽(FWHM)先减小后增大,生长温度为400℃时薄膜的晶粒尺寸最大为73.4 nm,载流子浓度达到1022 cm-3,霍尔迁移率数值约为102 cm2/(V·s),说明优化生长温度能够降低InAs薄膜的缺陷复合,使薄膜结晶质量和电学性能得到提高.SEM及AFM的测试结果显示由于较高的晶格失配及Si衬底斜切面(211)的特殊取向,在Si(211)衬底上生长的InAs薄膜主要为三维层加岛状(S-K)生长模式,表面粗糙度(Ra)随温度的升高先减小后增大,400℃时薄膜的平均表面粗糙度Ra为48.37 nm.     

GaSb薄膜生长的RHEED研究

采用分子束外延技术,在GaAs衬底上生长GaSb薄膜时,利用反射式高能电子衍射仪(RHEED)对衬底表面清洁状况、外延层厚度等进行在线监控.通过RHEED讨论低温缓冲层对GaSb薄膜表面结构和生长机制的作用,可以估算衬底温度,并能计算出薄膜的生长速率.实验测量GaSb的生长周期为1.96s,每秒沉积0.51单分子层.低温缓冲层提高了在GaAs衬底上外延GaSb薄膜的生长质量.     

衬底温度对共蒸发制备GaSb多晶薄膜性质的影响

采用共蒸发的方法在玻璃衬底上制备出GaSb多晶薄膜材料.研究了薄膜生长速率与衬底温度、Ga源温度和Sb源温度的关系.通过XRD、UV-Vis、Hall效应和AFM等测试方法,研究了衬底温度对于GaSb薄膜的结构特性、光电性质以及表面形貌的影响.GaSb多晶薄膜具有(111)择优取向,薄膜的吸收系数达到105 cm-1,晶粒尺寸随衬底温度升高逐渐增大;衬底温度为540℃时,薄膜的迁移率达到127 cm2/V·s,空穴浓度为3×1017 cm-3.GaSb薄膜的表面粗糙度随温度增加而增加.     

单质靶溅射制备CZTS薄膜及太阳电池

采用单质靶磁控溅射制备Cu2ZnSnS4 (CZTS)薄膜,研究了薄膜的元素组分、升温速率、硫化温度对薄膜表面平整性以及晶粒尺寸的影响.通过SEM与AFM表征薄膜的表面形貌与表面粗糙度,用EDS检测薄膜的元素组分.所制备的样品的Cu/(Zn+ Sn)、Zn/Sn处于最优范围.通过XRD及Raman检测薄膜的结晶情况以及薄膜中的二次相,经上述测试分析判定CZTS薄膜品质良好.最终制备出以CZTS为吸收层的薄膜太阳电池,并用Ⅰ～V特性检验了CZTS电池性能参数,得到效率为0.83;的CZTS薄膜太阳电池,并通过改进硫化退火工艺将效率提高至1.58;.     

卷对卷技术制备大面积柔性CIGS薄膜太阳电池吸收层

以轻质柔性聚酰亚胺(PI)材料为衬底,采用低温共蒸发"一步法"工艺制备四元化合物Cu(In,Ga)Se2(CIGS)薄膜.本文采用卷对卷(roll-to-roll)技术,在衬底幅宽300 mm的方向上实现了良好的成膜均匀性.利用XRD和XRF分别分析了所制备薄膜的晶相、组分和厚度,SEM分析了薄膜的表面形貌,讨论了不同衬底温度下制备的CIGS薄膜的性能.     

Si(111)外延GaN的表面形貌及形成机理研究

用高温AlN作缓冲层在Si(111)上外延生长出GaN薄膜.通过对薄膜表面扫描电子显微镜(SEM)和高分辨率双晶X射线衍射(DCXRD)的分析,确定缓冲层对外延层形貌的影响,分析解释了表面形貌中凹坑的形成及缓冲层生长温度对凹坑的影响.结果表明:温度的高低通过影响缓冲层初始成核密度和成核尺寸来影响外延层表面形貌.     

分层沉积GaAs/SiO2纳米薄膜的结构和吸收光谱

应用射频磁控溅射方法分别在抛光硅片和石英玻璃片上分层沉积了GaAs/SiO2纳米薄膜.通过X射线衍射(XRD)、原子力显微镜(AFM)、扫描电子显微镜(SEM)及吸收光谱的测试,发现衬底温度、退火、氢掺杂等制备工艺对分层沉积的GaAs/SiO2纳米薄膜的微观结构和光学性质有明显的影响.本文对相关机理作了探讨.     

MOVPE growth of InN buffer layers on sapphire

We report on the MOCVD growth of InN buffer layers on sapphire substrate for InN growth. The approach used assumes that an optimized InN buffer layer has to exhibit at least the same crystalline quality and sapphire surface coverage than the GaN buffer layers allowing to grow high crystalline quality GaN on sapphire. The buffer layers were characterized by AFM and GID measurements. Sapphire nitridation was investigated: it has a strong influence on in-plane crystalline quality. Two kinds of buffer layers were optimized according to the GaN buffer layer specifications: one of them only presented In droplets at its surface. It was shown that the small amount of In droplets increases the adatoms mobility of the main layer overgrown, leading to a 25% decrease of its in-plane mosaicity, compared to InN films directly grown on sapphire. To achieve a same improvement on InN buffer layer free of In droplets, the InN main layer growth temperature had to be increased from 550 °C. to 600 °C.     

Suppression of phase separation in InGaN layers grown on lattice-matched ZnO substrates

Sapphire and SiC are typical substrates used for GaN growth. However, they are non-native substrates and result in highly defective materials. The use of ZnO substrates can result in perfect lattice-matched conditions for 22% indium InGaN layers, which have been found to suppress phase separation compared to the same growths on sapphire. InGaN layers were grown on standard (0 0 0 2) GaN template/sapphire and (0 0 0 1) ZnO substrates by metalorganic chemical vapor deposition. These two substrates exhibited two distinct states of strain relaxation, which have direct effects on phase separation. InGaN with 32% indium exhibited phase separation when grown on sapphire. Sapphire samples were compared with corresponding growths on ZnO, which showed no evidence of phase separation with indium content as high as 43%. Additional studies in Si-doping of InGaN films also strongly induced phase separation in the films on sapphire compared with those on ZnO. High-resolution transmission electron microscopy results showed perfectly matched crystals at the GaN buffer/ZnO interface. This implied that InGaN with high indium content may stay completely strained on a thin GaN buffer. This method of lattice matching InGaN on ZnO offers a new approach to grow efficient emitters.     

Method for HVPE growth of thick crack-free GaN layers

Twenty-five micrometer thick GaN was grown with hydride vapor phase epitaxy (HVPE) on metal-organic chemical vapor deposition (MOCVD) grown templates on sapphire substrates with the gallium treatment step (GTS) technique with varying buffer layer thickness. The samples are studied with atomic force microscopy (AFM), etching and scanning electron microscopy (SEM), photo-luminescence (PL), X-ray diffraction (XRD) and optical microscopy. The results show that the thickness of the buffer layer is not important for the layer quality once the growth in MOCVD starts to make the transition from 3D growth to 2D growth and HVPE continues in the same growth mode. We show that the MOCVD templates with GTS technique make excellent templates for HVPE growth, allowing growth of GaN without cracks in either sapphire or GaN.     

The origin of the residual conductivity of GaN films on ferroelectric materials

In this paper, the origin of the conductivity of GaN films grown on ferroelectric materials was investigated using XPS, AES, and XRD analysis tools. Depth profiles confirmed the existence of impurities in the GaN film originating from the substrates. Bonding energy analysis from XPS and AES verified that oxygen impurities from the substrates were the dominant origin of the conductivity of the GaN film. Furthermore, Ga-rich GaN films have a greater chance of enhancing diffusion of lithium oxide from the substrates, resulting in more substrate phase separation and a wider inter-mixed region confirmed by XRD. Therefore, the direct GaN film growth on ferroelectric materials causes impurity diffusion from the substrates, resulting in highly conductive GaN films. Future work needs to develop non-conductive buffer layers for impurity suppression in order to obtain highly resistive GaN films.     

Growth of quaternary AlInGaN/GaN heterostructures by plasma-induced molecular beam epitaxy

Epitaxial growth of AlInGaN/GaN heterostructures on sapphire substrates was achieved by plasma-induced molecular beam epitaxy. Different alloy compositions were obtained by varying the growth temperature with constant Al, In, Ga and N fluxes. The In content in the alloy, measured by Rutherford backscattering spectroscopy, increased from 0.4% to 14.5% when the substrate temperature was decreased from 775°C to 665°C. X-ray reciprocal space maps of asymmetric AlInGaN (2.05) reflexes were used to measure the lattice constants and to verify the lattice match between the quaternary alloy and the GaN buffer layers.     

Thick GaN layers on sapphire with various buffer layers

Thick GaN layers deposited in HVPE system on composite substrates made on sapphire substrates in Metalorganic Vapour Phase Epitaxy (MOVPE) system have been investigated. The following substrates were used: (00.1) sapphire substrates with AlN, AlN/GaN and GaN thin layers. The crystallographic structure and the quality of the epitaxial thick GaN layers were determined. Comparison of the three types of thick layers was performed. Significant differences were observed. It was found that thick GaN deposited on the simplest MOVPE‐GaN/sapphire composite substrate has comparable structure's properties as the other, more complicated. (© 2007 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)     

Defect reduction in GaN epilayers and HFET structures grown on (0 0 0 1)sapphire by ammonia MBE

The quality of GaN epilayers grown by molecular beam epitaxy on substrates such as sapphire and silicon carbide has improved considerably over the past few years and in fact now produces AlGaN/GaN HEMT devices with characteristics among the best reported for any growth technique. However, only recently has the bulk defect density of MBE grown GaN achieved levels comparable to that obtained by MOVPE and with a comparable level of electrical performance. In this paper, we report the ammonia-MBE growth of GaN epilayers and HFET structures on (0 0 0 1)sapphire. The effect of growth temperature on the defect density of single GaN layers and the effect of an insulating carbon doped layer on the defect density of an overgrown channel layer in the HFET structures is reported. The quality of the epilayers has been studied using Hall effect and the defect density using TEM, SEM and wet etching. The growth of an insulating carbon-doped buffer layer followed by an undoped GaN channel layer results in a defect density in the channel layer of 2×10⁸ cm⁻². Mobilities close to 490 cm²/Vs at a carrier density of 8×10¹⁶ cm⁻³ for a 0.4 μm thick channel layer has been observed. Growth temperature is one of the most critical parameters for achieving this low defect density both in the bulk layers and the FET structures. Photo-chemical wet etching has been used to reveal the defect structure in these layers.     

High quality MOCVD GaN film grown on sapphire substrates using HT-AlN buffer layer

In this work we report on the growth and characterization of high quality MOCVD GaN film grown on Al₂O₃ substrates by using a HT (>1150 °C)-AlN buffer layer. We have investigated the most favorable growth conditions in terms of temperature, thickness and growth rate of AlN buffer layer in order to optimize the high temperature GaN layer. The improved morphological and structural properties of GaN layer were verified by AFM and XRD measurements. The optimized GaN layer presents a smooth surface with a rms value of 1.4 Å. The full width at half maximum (FWHM) for 800 nm thick GaN films is 144″. Furthermore PL measurements and C–V analysis confirm that in GaN layer grown on HT-AlN buffer layer defect density is drastically reduced.     

在MOCVD系统中用预淀积In纳米点低温下合成生长InN

利用低压金属有机化学气相淀积(LP-MOCVD)系统,在(0001)蓝宝石衬底上采用预淀积In纳米点技术低温合成制备了立方相的InN薄膜.首先以TMIn作源在蓝宝石衬底表面预淀积了一层金属In纳米点,然后在一定条件下合成生长InN薄膜.X射线衍射谱(XRD)和X射线光电子发射谱(XPS)显示适当的预淀积In不仅能够促进InN的生长,同时还能够抑制金属In在InN薄膜中的聚集.原子力显微镜(AFM)观察表明,金属In纳米点不仅增强了成核密度,而且促进了InN岛的兼并.自由能计算表明预淀积的In优先和NH3分解得到的NH与N基反应生成InN.我们认为这种优先生成的InN为接下来InN的生长提供了成核位,从而促进了InN的生长.