LED投光灯叉翅散热器热分析及优化

为探究叉翅散热器在某100 W LED舞台投光灯上的散热强化作用并进行优化设计,通过数值模拟与实验验证的方法,对影响叉翅散热器散热性能的主要几何因素及其机理进行了分析。以LED芯片最高温度和散热器质量为优化目标,对短翅长度与间距进行了单因素分析,然后通过NSGA-Ⅱ算法进行双目标优化,并进行模糊C均值聚类,得到了不同应用场景下散热器配置。结果表明：叉翅散热器可有效增强散热性能,其结构可增加翅片表面平均对流换热系数,短翅长度和间距对单位质量散热性能影响均存在最优值,短翅过长或间距过小均会使翅片表面对流换热系数下降。双目标优化后的叉翅散热器可在几乎不改变散热器质量时,降低LED芯片最高温度2.33℃。     

LED汽车前照灯散热结构设计与分析

针对LED汽车前照灯的散热问题,对比设计两款有/无散热槽的新型散热器结构形式,利用有限元分析软件ANSYS进行散热结构的热力学分析。针对初始设计的散热结构形式采用控制变量法进行参数优化,最后得出无槽结构的LED灯具最高温度为65.352℃,热应力为235.56 MPa;同等条件下有槽结构的LED灯具最高温度为62.712℃,最大应力为218.7 MPa。计算可知,具有散热槽LED灯具散热器优化后的温度相对无散热槽LED灯具散热器优化后的温度降低2.64℃,最大应力减小16.86 MPa。该仿真结果表明具有散热槽结构的散热器能够提高LED汽车前照灯的散热效果。     

基于平板热管的大功率LED散热系统模拟及优化

为解决大功率LED的散热问题,设计了平板热管散热器来实现LED芯片的高效散热。通过Flotherm模拟软件,对大功率LED在自然对流条件下的散热情况进行了三维数值模拟。通过平板热管与常规铜、铝散热基板对比,发现平板热管有效降低了大功率功率LED的结温和热阻,使得LED温度分布更为均匀。此外,还研究了平板热管LED散热系统在不同芯片功率下的热性能,并对四种不同排布方式的LED平板热管散热系统进行了优化,发现阵列分布其温度分布最为均匀,结温最低,是较优的排布方式。     

基于有限元法LED散热强化研究

为了解决大功率LED散热问题,构建了包括LED固体部件及外部流体空间的三维数学模型。基于有限元法,应用k-ε模型模拟自然对流换热条件下LED模组散热情况。模拟结果表明,LED模组温度场分布不均,芯片结温较高;受芯片功率密度及位置布设的影响,中心翅片的散热效果差。通过改变散热器结构,设计了两种翅片组合形式,虽然换热面积有所减少,但由于中心翅片的对流换热得到强化,达到了降低结温的效果,提高了散热性能。     

自散热片式LED-COB光源

提出了一种自散热片式LED-COB光源结构。将LED芯片放置在6061铝合金基板侧面,该侧面加工有光学反光槽。整个基板既作为LED芯片的支架,又作为散热片。LED芯片与外界环境之间只有固晶胶一层热阻,大大提高了LED散热系统的散热效率。所设计的COB光源的功率为1~2 W、散热面积为30 cm2、质量为1.9 g。经过测试,在环境温度为25℃、功率1.92 W、发光面处于顶部的竖直放置的条件下,红外热像仪测得散热片上的最高温度为66.2℃,通过正向电压法测得LED芯片的结温为72.4℃。自散热片式COB-LED光源不仅能提高LED灯具的散热性能,同时还能降低LED灯具的系统成本。     

大功率LED针翅式散热器散热性能数值模拟

发光二极管(LED)作为新一代光源,得到广泛应用.然而在工作过程中,大部分的电能会转变为热能,使LED的结温升高,可靠性降低.为了使LED芯片产生的热量能够及时有效地散发出去,通常采用翅片散热方法对其进行散热.采用数值模拟的方法对大功率LED针翅式散热器的散热性能进行了研究.为了验证模型的准确性,利用K型热电偶和安捷伦数据采集仪对散热器进行了实验测试.实验结果表明,该数值模型方程能够很好地模拟散热器的散热性能.此外,研究了大功率LED针翅式散热器的几何参数(翅片高度、半径、排数、列数)对LED散热性能(结温、对流换热系数和热阻)的影响,并且对翅片结构进行了优化分析.     

烟囱效应在大功率LED灯具散热器设计中的影响分析

烟囱效应具有强化对流、增强换热的能力。本研究设计了一款基于烟囱效应的大功率LED灯具散热器,采用有限元分析法分析烟囱效应在散热器散热过程中的作用效果。分别探讨了烟囱的高度、烟道孔径以及烟囱个数对散热器散热性能的影响。研究表明,本研究中烟囱烟道孔径的最佳尺寸为6mm。烟囱的高度可依据散热器的高度设计取40 mm~50 mm。在设计条件允许的前提下,烟囱个数越多散热器散热效果越好。     

照明用大功率LED射灯散热建模研究

散热问题是LED灯具成为新一代照明光源亟待解决的关键问题之一。提出一种LED灯具散热建模方法:选用LED射灯作为代表产品进行散热建模研究,采用三维造型软件建立LED灯具产品三维模型,然后导入有限元流体热分析软件(CFD)进行热仿真。研究散热仿真过程中的热阻设置、热量载荷计算和边界条件设定等关键问题,并求解LED射灯的工作温度分布情况;将仿真分析结果与实验室测试数据进行对比分析研究。研究结果表明,运用该方法可以对室内照明LED灯具进行较为准确的散热分析,仿真温度误差在4℃左右,仿真结果对灯具开发设计具有重要参考价值。     

大功率LED散热结构研究

目前大功率LED灯具的散热问题已经成为制约LED行业深入发展的瓶颈,体积小、重量轻、结构相对简单、制造加工成本低的散热器是研究的主要方向.不同的散热器由于结构设计不同,工作时散热特点也不尽相同.本文在实测现有主流LED灯具散热器并总结分析散热效果,进而提出传热-散热一体的LED灯具散热器结构设计理念,并对LED灯具工作温度场的分析,验证了传热跟散热一体化设计的理念.     

功率型LED散热器的研究

分析了目前功率型LED发展存在的瓶颈问题,以及散热对LED器件正常工作的重要性.散热器的设计决定了功率型LED芯片产生的热量能否顺利传至工作环境,基于现有的文献和专利总结了大功率LED散热器的技术手段及其研究内容.从对流散热、辐射散热、热传导和相变散热等多个方面介绍了一些典型散热器在功率型LED散热中的应用,并提出了未来LED照明散热设计的方向.     

Thermal simulation and optimization design on a high-power LED spot lamp

In this paper, thermal characteristics of the high-power LED spot lamp are reported. The emphasis is placed upon optimizing design of the heat sink of LED spot lamp using the optimization module and the orthogonal-experiment method. Results demonstrate that the weight of the heat sink is decreased to 46.1% of that for the initial structure, and the influence of each factor on junction temperature and weight of the heat sink is acquired by range analysis. Finally, the influence of ambient temperature and natural convection coefficient on the LED maximum temperature is analyzed. The results and the optimizing methodology are of great importance to the thermal design of LED lamps.     

LED筒灯复合结构热管散热器的数值模拟

为解决LED筒灯使用单纯自然对流散热扩散热阻过大、温度分布不均的问题,提出一种基于平板热管和热虹吸管的复合结构热管散热器,并用数值模拟的方法研究了热功率、翅片高度、翅片数目、辐射换热对该散热器性能的影响。模拟结果表明应用于LED筒灯的复合结构热管散热器的热阻随着热功率的增加而减小,翅片高度和翅片数目存在一个最优值,使得散热器温度和热阻最小,自然对流情况下不可忽视辐射换热的作用。     

Thermal design for the high-power LED lamp

This paper summarizes different kinds of heat sinks on the market for high power LED lamps. Analysis is made on the thermal model of LED, PCB and heat sink separately with a simplified mode provided. Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.     

Thermal design for the high-power LED lamp

This paper summarizes different kinds of heat sinks on the market for high power LED lamps.Analysis is made on the thermal model of LED,PCB and heat sink separately with a simplified mode provided.Two examples of simulation are illustrated as a demonstration for the thermal simulation as guidance for LED lamp design.     

Thermal analysis of high power LED package with heat pipe heat sink

The goal of this study is to improve the thermal characteristics of high power LED (light-emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of high power LED package are analyzed and a novel flat heat pipe (FHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of high power LED package with flat heat pipe heat sink have been investigated experimentally. The obtained results indicate that the junction temperature of LED is about 52 °C for the input power of 3 W, and correspondingly the total thermal resistance of LED system is 8.8 K/W. The impact of the different filling rates and inclination angles of the heat pipe to the heat transfer performance of the heat pipe should be evaluated before such a structure of heat pipe cooling system is used to cool high power LED system.     

Thermal Analysis of High Power LED on Heat Sink

Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED＇s distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.     

照射角度对大功率LED筒灯散热性能影响的分析

为了满足照明需求,有时需要将LED灯具设计成照射角度可调的结构,采用有限元软件分析了三款搭配常见散热器的大功率LED筒灯在不同照射角度下的散热性能,结果发现搭配辐射状散热器的LED筒灯在低于30°照射角下散热效果较佳;搭配平板状散热器的LED筒灯绕不同方向转动照射时散热效果不同,在绕文中所示X轴方向转动时散热效果较好,适合多角度照射;搭配柱状散热器的LED筒灯在多角度照射情况下都具有较好的散热效果。研究结果为以后的筒灯设计提供了参考依据。     

Flow and heat transfer in porous micro heat sink for thermal management of high power LEDs

A novel porous micro heat sink system is presented for thermal management of high power LEDs, which has high heat transport capability. The operational principle and heat transfer characteristics of porous micro heat sink are analyzed. Numerical model for the micro heat sink is developed to describe liquid flow and heat transfer based on the local thermal equilibrium of porous media, and it is solved with SIMPLE algorithm. The numerical results show that the heated surface temperature of porous micro heat sink is low at high heat fluxes and is much less than the bearable temperature level of LED chips. The heat transfer coefficient of heat sink is very high, and increasing the liquid velocity can enhance the average heat transfer coefficient. The overall pressure loss of heat sink system increases with the increasing the inlet velocity, but the overall pressure drop is much less than the pumping pressure provided by micro pump. The micro heat sink has good performance for thermal management of high power LEDs, and it can improve the reliability and life of LEDs.     

大功率 LED 汽车前照灯散热系统设计

针对大功率发光二极管(Light-emitting diode, LED)对结点温度要求严格控制的特点,提出一种基于导热板+热沉的散热技术来满足LED 前照灯散热封装的需求。通过数值模拟和试验方法研究了芯片的结温随环境温度、导热板长度、散热器倾斜角度、芯片封装深度的变化规律,试验值与数值模拟值基本吻合。结果均表明,环境温度及散热器的倾斜角对芯片结温有较大影响,芯片结温随环境温度基本呈线性变化关系,散热装置水平放置的散热效果最高。     

Development of a thermal resistance model for chip-on-board packaging of high power LED arrays

The performance of high power LEDs strongly depends on the junction temperature. Operating at high junction temperature causes degradation of light intensity and lifetime. Therefore, proper thermal management is critical for LED packaging. While the design of the heat sink is a major contributor to lowering the overall thermal resistance of the packaged luminaire, another area of concern arises from the need to address the large heat fluxes that exist beneath the die. In this study we conduct a thermal analysis of high power LED packages implementing chip-on-board (COB) architecture combined with power electronic substrate focusing on heat spreading effect. An analytical thermal resistance model is presented for the LED array and validated by comparing it with finite element analysis (FEA) results. By using the analytical expression of thermal resistance, it is possible to understand the impact of design parameters (e.g., material properties, LED spacing, substrate thickness, etc.) on the package thermal resistance, bypassing the need for detailed computational simulations using FEA.