应力集中式多晶硅薄膜压力传感器

介绍一种以多晶硅薄膜为敏感材料的压力传感器。该传感器利用了双岛结构膜片的应力集中效应，灵敏度得到提高，且具有良好的线性度和过载能力。     

基于压力传感器封装的波纹膜片的结构研究

针对隔离型压力传感器封装的特点,介绍了波纹膜片的设计过程并利用有限元分析方法对影响波纹膜片性能的主要因素-膜片厚度和波纹深度进行了分析研究,对波纹膜片的结构进行优化,改善了封装有波纹膜片的压力传感器的线性度和灵敏度。     

小量程压力传感器圆形平膜片的设计计算——兼和裴锡安同志商榷

本文明确给出了传感器圆形平膜片的计算公式以及这些公式的假设条件,同时给出了薄膜的计算公式,明确指出了膜片和薄膜,小挠度和大挠度板的区别,指出提高膜片的线性主要在于结构的合理设计,对《应用钛合金提高小量程压力传感器精度》一文的理论分析提出了不同看法。     

自确认压力传感器结构设计

自确认传感器能够实现传感器故障的自诊断和自恢复,除了提供被测量的确认的测量值之外,还提供测量值的不确定度、测量值的状态等表征传感器输出可信度的参数,可以实时了解传感器的工作状态,及时采取相应的措施,大大提高监测系统的可靠性.本文针对自确认圆平膜片应变式压力传感器的设计,分析了圆平膜片的应力和应变分布,建立了圆平膜片上两种传统布片方式的数学模型,在分析圆平膜片压力传感器故障模式的基础上,对传统的布片方式进行了改进,建立了在圆平膜片上进行多组布片的方案,为实现自确认圆平膜片应变式压力传感器提供了坚实的基础.     

一种航空配套微压传感器芯片设计及制备

针对航空领域微小压力测量需求,介绍了一种沟槽梁膜复合结构压力芯片的设计和制备方法。设计的压力芯片解决了传统硅压阻压力传感器灵敏度与线性度的固有矛盾,通过有限元分析可动膜片应力应变输出,并结合曲线拟合分析,提出了一种优化芯片可动膜片结构尺寸的设计方法。利用MEMS加工工艺,实现了沟槽梁膜双重应力集中结构压力芯片的制备。在量程0~1 psi范围内,传感器灵敏度30.9 mV/V/psi,非线性误差0.25%FS,综合精度0.34%FS,实现了灵敏度和线性度的同步提高,满足了飞行器高度、风洞测试等领域的微压测试需求。     

高性能SOI基纳米硅薄膜微压阻式压力传感器的研究

针对高端领域对高性能微小量程压力传感器的迫切需求，设计并实现了一种应用于电子血压计的高性能SOI基纳米硅薄膜微压阻式压力传感器，并提出了相应的检测电路。根据小挠度弯曲理论设计了传感器方形敏感薄膜结构，确定了纳米硅薄膜压敏电阻的阻值大小和尺寸。采用ANSYS有限元分析（FEA）对所设计的传感器结构进行仿真，根据仿真结果确定了压敏电阻在膜片上的最佳放置位置。基于标准MEMS制造技术，在SOI基纳米硅薄膜上设计并实现了该压力传感器。实测结果表明，室温下，在0～40 kPa微压测量范围内所设计的传感器检测灵敏度可达0.45 mV/（kPa·V），非线性度达到0.108%F.S。在-40℃～125℃的工作温度范围内，温度稳定性好，零点温度漂移系数与灵敏度温度漂移系数分别为0.004 7%F.S与0.089%F.S。所设计的压力传感器及其检测电路，在现代医疗、工业控制等领域具有较大的应用潜力。     

FBG可变灵敏度压力传感器设计

为了实现对压力的多灵敏度状态下监测,设计了一种利用光纤Bragg光栅（ FBG）的可变灵敏度压力传感探头。将裸光栅固定在薄膜片中心与下部外壳之间,传感器探头表面的压力通过薄膜片传递给裸光栅,并可通过灵敏度变换阀改变膜片大小从而改变传感器的灵敏度。对薄膜片进行有限元仿真优化计算,得到其变形特性。薄膜片厚1 mm,工作半径分别调节为10,9,8 cm状态下,最大变形出现在膜片中心区域,在0.1 MPa的表面压力作用下,膜片中心处变形分别为3.875,2.561,1.579 mm,裸光栅固定后,对应的灵敏度分别为：38.44,25.62,15.79 mm/ MPa,实现灵敏度变换。     

一种光纤压力传感器的设计理论分析

设计了一种用于流体压力的反射式光纤压力传感器.利用高反射率的弹性膜片作为光纤位移传感器的反射镜,由光纤光强分布理论出发,通过理论计算,分别给出了膜片直径、光纤芯径、光纤端面到膜片的初始距离与灵敏度的关系,为传感器设计最佳参数选择提供了参考.文中指出,传感器中光纤可以选用200 μm左右大芯径光纤,膜片直径可以选2～3 mm,光纤端面与膜片初始距离可选2 mm左右.在此情况下,传感器具有较高灵敏度和较好的线性.     

TPMS硅基压阻式压力传感器的研制

:轮胎压力监测系统(TPMS)对压力传感器越来越大的市场需求使得这类传感器再次成为一个研究热点.商业领域对新一代压力传感器的要求是小尺寸、高性能、低价格,针对在30 μm厚度的硅杯方形薄膜上采用新型折线形状和位置的压敏电阻,设计并制作了一系列压阻式压力传感器.分析和讨论了膜的面积、电阻形状和位置等参数对压力传感器的灵敏度和线性度的影响.测试得到1000 kPa量程下边长为370μm的压力传感器灵敏度和线性度分别为15.5 mV/V·FS、0.012%/FS;边长为470μm的传感器的灵敏度和线性度分别为32.2 mV/V·FS、0.078%/FS,满足TPMS应用标准.这种器件体积小、成品率高,灵敏度和线性度均得到提高,也可用于医学、航空等其他领域.     

焊接结构光纤Bragg光栅土压力传感器设计

针对传统土压力传感器长期稳定性差、抗电磁干扰能力不强以及组网难度大等问题,根据传感器与土介质的匹配原则,设计了一种焊接结构双膜片光纤Bragg光栅(FBG)温度自补偿土压力传感器,可实现温度和土压力2个参量的同时测量.传感器主要由2个膜片与基体组成,膜片与光栅固定柱一次成型,便于加工封装.对传感器灵敏度系数进行了计算分析.根据分析结果,加工封装传感器并对其进行了压力校准及温度自补偿性能实验.实验结果表明:传感器的输出波长分别与温度和压力呈线性关系,压力灵敏度系数为528.1 pm/MPa,输出分辨率为0.19%,线性相关度99.988%;在5~45℃内温度灵敏度系数为31.9 pm/℃,线性相关度99.998%,传感器在5~45℃范围内具有良好的温度自补偿能力,其性能参数符合工程应用要求.     

薄膜应变计的横向效应及其影响因素

从电阻公式出发，利用金属的应变－电阻效应理论、弹性力学理论和薄膜的电导理论，导出了薄膜应变计的横向效应的表达式．分析了薄膜的厚度对薄膜应变计的横向效应的影响，并给出了实验结果与理论分析结果的对比．     

Computing crowd loads using a nonlinear equation of motion

Structural serviceability problems such as excessive vibrations and deflections associated with human movements have recently become of great concern. The recommended design values for human loading in the current U.S. building codes and standards were developed over half a century ago and are based on strength requirements alone. Recent investigations have led to load models for individuals and small groups of people using laboratory measurements on small and medium size force platforms. The current project has been directed towards testing the group load model. We designed and built a floor system instrumented with strain gages and displacement transducers to measure dynamic loads due to large groups of people. We investigated the floor system experimentally and analytically. The input dynamic forces were determined using data from the displacement transducers and also from the strain gages. The measured results compared closely with the predicted group loads obtained from our computer simulation model developed previously.     

混合集成力敏传感器的研制

本文对半导体应变式传感器的非线性、温度零漂、灵敏度温度系数、蠕变等参数进行了研究,建立了电子线路综合补偿方法,并采用半导体平面工艺研制成功了小型硅应变片,与混合集成电路技术结合,使敏感元件与补偿、放大电路组合成为一体。     

Controllable fabrication and electromechanical characterization of electrophoresis assembled single-walled carbon nanotube-polymer film transducers

This paper presents a controllable electrophoresis allowing a directed deposition of negatively charged single-walled carbon nanotubes (SWNTs) on an electro-active polymer to fabricate thin-film transducers under an electric field excitation. The assembled high-density SWNT networks are verified with SEM micrograph and Raman spectroscopy, and the electric filed-induced mechanism for electrophoresis of SWNT is investigated using electrochemical analysis technique. The dynamic electromechanical properties are characterized by a combinative approach of piezoelectric excitation and laser vibrometer measurement. A remarkable performance enhancement and tunability for such thin-film transducers in both resonant frequency and quality factor is demonstrated, compared with pure polymer. This observed enhancement can not only be exploited to tailor the thin-film transducers for desired electromechanical properties, but also create versatile pathways for variety of applications including polymeric electronic technologies.     

Microfabrication and characterization of metal-embedded thin-film thermomechanical microsensors for applications in hostile manufacturing environments

Effective monitoring and diagnosis of manufacturing processes is of critical importance. If critical manufacturing process conditions are continuously monitored, problems can be detected and solved during the processing cycle. However, current technology still evidently lags behind practical needs. Microfabricated thin-film thermocouples and strain gauges are attractive for their small size and fast response. It is challenging to fabricate and embed these sensors into metallic components that are widely used in manufacturing. This paper investigates the fabrication, embedding, and characterization of metal embedded thin-film thermocouples and strain gauges. The materials (dielectric and metallic) constituting a complete microsensor were characterized and optimized. The results obtained from characterization and optimization of materials are presented and discussed. Thin-film thermocouples on stainless steel substrates (before and after embedding) were calibrated to elevated temperatures. The behavior of thin-film strain gauges was also studied. The metal embedded sensors demonstrated good accuracy, sensitivity, and linearity that matched the performance of commercial thermocouples and strain gauges well. The metal embedded microsensors are promising for in situ monitoring in hostile manufacturing environments.     

传感器独立线性度的研究

独立线性度是衡量传感器线性特性的最客观标准。求独立线性度的关键在于求最佳直线。提出一个求点集最佳直线的新方法,它能保证所有实验点相对于最佳直线的最大偏差为最小。依据该方法设计的程序结构简单、层次清晰,可用于计算传感器的独立线性度。     

二氧化碳薄膜微电极器件的制作 及其特性研究

提出一种用微细加工技术构制的二氧化碳薄膜微电极器件。这类器件具有常规微电极所特有的全部优点，而且结构紧凑，便于集成化。用作电流型二氧化碳气敏器件，在室温下有良好的工作特性：响应电流在整个ＣＯ２浓度范围内呈线性，并通过原点；９０％响应时间约３０ｓ；连续工作６ｈ性能稳定，重现性好。     

Low-temperature wafer-level transfer bonding

In this paper, we present a new wafer-level transfer bonding technology. The technology can be used to transfer devices or films from one substrate wafer (sacrificial device wafer) to another substrate wafer (target wafer). The transfer bonding technology includes only low-temperature processes; thus, it is compatible with integrated circuits. The process flow consists of low-temperature adhesive bonding followed by sacrificially thinning of the device wafer. The transferred devices/films can be electrically interconnected to the target wafer (e.g., a CMOS wafer) if required. We present three example devices for which we have used the transfer bonding technology. The examples include two polycrystalline silicon structures and a test device for temperature coefficient of resistance measurements of thin-film materials. One of the main advantages of the new transfer bonding technology is that transducers and integrated circuits can be independently processed and optimized on different wafers before integrating the transducers on the integrated circuit wafer. Thus, the transducers can be made of, e.g., monocrystalline silicon or other high-temperature annealed, high-performance materials. Wafer-level transfer bonding can be a competitive alternative to flip-chip bonding, especially for thin-film devices with small feature sizes and when small electrical interconnections (<3×3 μm²) between the devices and the target wafer are required     

基于表格语义的Web信息抽取方法的研究

在Web页面常用到表格这种元素。本文提出一种根据表格语义来进行信息抽取方法。首先提出了一种短语语义相似度的度量方法,然后利用短语语义的相似度确定表格标题行(列),并对表格行(列)与抽取字段的对应关系进行计算,最后计算表格的整体语义,度量该表格与所要抽取的内容有多大相关度。     

一种基于超声阻抗和回波能量的液位检测方法

针对超声波液位检测方法中,传感器和容器壁间的耦合度不佳所带来的稳定性和可靠性降低的问题,提出了一种基于阻抗法并利用回波能量来实现液位检测的方法.该方法利用液位上下方气液介质的阻抗不相等的特性,计算和比较两个接收传感器所接收到的回波能量之间的差异,以此来确定液位的位置.实验结果表明,该方法能够有效地克服因耦合条件不佳所带来的问题,检测精度满足应用需求.