The ohmic contact formation mechanism of Au/Pt/Pd ohmic contact to p-ZnTe

The ohmic contact formation mechanism and the role of Pt layer of Au(500Å) Pt(500Å)/Pd(100Å) ohmic contact to p-ZnTe were investigated. The specific contact resistance of Au/Pt/Pd contact depended strongly on the annealing temperature. As the annealing temperature increased, the specific contact resistance decreased and reached a minimum value of 6×10^?6 Θcm² at 200°C. From the Hall measurement, the hole concentration increased with the annealing temperature and reached a maximum value of 2.3×10¹⁹ cm^?3 at 300°C. The Schottky barrier height decreased with the increase of annealing temperature and reached a minimum value of 0.34 eV at 200°C and it was due to the interfacial reaction of Pd and ZnTe. Therefore, the decrease of contact resistance was due to the increase of doping concentration as well as the decrease of Schottky barrier height by the interfacial reaction of Pd ZnTe. The specific contact resistances of Au Pd, Au/Pt/Pd and Au/Mo/Pd as a function of annealing time was investigated to clarify the role of Pt layer.     

Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性

利用金属有机化合物化学气相淀积(MOCVD)在SiC衬底上外延生长了N-polar GaN材料,采用传输线模型(TLM)分析了Ti/Al/Ni/Au金属体系在N-polar GaN上的欧姆接触特性.结果表明,Ti/Al/Ni/Au (20/60/10/50 nm)在N-polar GaN上可形成比接触电阻率为2.2×10-3Ω·cm2的非合金欧姆接触,当退火温度升至200℃,比接触电阻率降为1.44×10-3 Ω·cm2,随着退火温度的进一步上升,Ga原子外逸导致欧姆接触退化为肖特基接触.     

Solid phase formation in Au: Ge/Ni,Ag/In/Ge,In/Au: Ge GaAs ohmic contact systems

Solid phase epitaxy formation in Au: Ge/Ni, Ag/In/Ge, and In/Au:Ge contacts to GaAs has been identified utilizing micro-spot Auger spectroscopy and selected area electron channeling. It is shown that the lateral extent of solid phase formation directly controls the value of the specific contact resistivity. Solid phase growth occurs as a result of dissolution of GaAs by the contact constituents in the vicinity of the eutectic temperature. Solid phase growth also results in regions free of oxide layers and contaminants and hence a lower contact resistivity.     

Sintered ohmic contacts to n-and p-type GaAs

Previously, all known ohmic contacts to n-GaAs have involved a so-called "alloying" procedure which consists of melting a Au-Ge eutectic or Sn-based alloy films on GaAs. We describe here a new contact metallization scheme consisting of Pd/Ge/n-GaAs which requires sintering rather than melting in order to produce ohmic contacts. The sintering is done at temperatures ranging from 350°C, 15 min to 500°C, 2 h depending on the doping level of n-GaAs (10¹⁸-10¹⁶cm^-3. For n-10¹⁶cm^-3GaAs, a specific contact resistance of 3 × 10^-4Ω.cm²was achieved. Sintering leads to the formation of some PdGe and intermetallics associated with the Pd/GaAs interaction, namely, PdAs2and PdGa. Ohmic behavior is attributed to a combination of the doping action of Ge (as donor) and fast in-diffusion kinetics of Pd. Sintered contacts to n⁺and p⁺GaAs (ND.A∼ 10¹⁸cm^-8) made by Au, Pt, and Ti Were also investigated for ohmic behavior. Each of these three metals was at least partially effective in forming ohmic contacts to p⁺GaAs; the degree of effectiveness increases on going from Ti to Au to Pt. It is proposed that a reasonable guideline to follow When searching for ohmic contacts is Xm≳ Xdwhere Xmis the width of the metallurgical junction and Xdis the ideal depletion layer width. This condition should favor ohmic contacts by promoting a micro 3-dimensional current flow at the conductor-semiconductor interface and thereby maximizing field-emission probability.     

An improved Mo/n-GaAs contact by interposition of a thin Pd layer

The idea of limited reaction has been used to solve the adhesion and stability problems of Mo/n-GaAs and Pd/n-GaAs contacts. The structural and electrical properties of Mo/Pd/n-GaAs with different thicknesses of Pd layer, annealed from 300°C to 500°C for 30 min, were investigated. Adhesion of Mo to GaAs has been improved with the interposition of a thin Pd layer. With increasing Pd thickness, wider temperature ranges were achieved in which the contact showed rectifying Schottky behavior. The Schottky barrier heights were nearly constant below 300°C and then dropped sharply at 450°C, except for Mo(2000 Å)/Pd(200 Å)/n-GaAs diodes. The ideality factors converged to nearly unity at 300°C and then increased sharply from 300 to 500°C, except for Mo(2000 Å)/Pd(200 Å)/n-GaAs diodes, which maintained a nearly constant value of 1.34 from 400 to 500°C     

Low-resistance vertical conduction across epitaxially lifted-off n-GaAs film and Pd/Ge/Pd coated Si substrate

Low-resistance ohmic conduction across an epitaxially lifted-off (ELO) thin n-GaAs film and a Si substrate was obtained by attaching the ELO film on the Si substrate coated with a Pd/Ge/Pd multilayer. Good bonding and ohmic contacts to both GaAs and Si were achieved at the same time after annealing. The interface compound formation was studied by secondary ion mass spectroscopy and x-ray diffraction analyses. The ELO technology was used to fabricate an ELO stripe geometry diode laser on Si with the back-side contact on Si substrate. Good laser performance with comparable characteristics as conventional laser diodes on GaAs substrates was obtained.     

高Al组分n-AlGaN的Ti/Al/Ti/Au欧姆接触

采用Ti/Al/Ti/Au多层金属电极对高Al组分n-AlxGa1-xN(x=0.6)欧姆接触的制备进行了研究,通过优化Ti接触层厚度以及合金退火条件,获得了较低的比接触电阻率(5.67×10-5Ω.cm2)。研究证实,Ti接触层厚度对欧姆接触特性有着重要影响,同时发现,高低温两步退火方式之所以能够改善欧姆接触特性的本质是与Al3Ti及TiN各自的生成条件直接相关,即低温利于生成Al3Ti,高温利于生成TiN,而这对n型欧姆接触的有效形成至关重要。     

Thermally stable Ge/Ag/Ni Ohmic contact for InAlAs/InGaAs/InP HEMTs

Excellent annealed ohmic contacts based on Ge/Ag/Ni metallization have been realized in a temperature range between 385 and 500/spl deg/C, with a minimum contact resistance of 0.06 /spl Omega//spl middot/mm and a specific contact resistivity of 2.62 /spl times/10/sup -7/ /spl Omega//spl middot/cm/sup 2/ obtained at an annealing temperature of 425/spl deg/C for 60 s in a rapid thermal annealing (RTA) system. Thermal storage tests at temperatures of 215 and 250/spl deg/C in a nitrogen ambient showed that the Ge/Ag/Ni based ohmic contacts with an overlay of Ti/Pt/Au had far superior thermal stabilities than the conventional annealed AuGe/Ni ohmic contacts for InAlAs/InGaAs high electron mobility transistors (HEMTs). During the storage test at 215/spl deg/C, the ohmic contacts showed no degradation after 200 h. At 250/spl deg/C, the contact resistance value of the Ge/Ag/Ni ohmic contact increased only to a value of 0.1 /spl Omega//spl middot/mm over a 250-h period. Depletion-mode HEMTs (D-HEMTs) with a gate length of 0.2 /spl mu/m fabricated using Ge/Ag/Ni ohmic contacts with an overlay of Ti/Pt/Au demonstrated excellent dc and RF characteristics.     

Laser annealed Ta/Ge and Ni/Ge ohmic contacts to GaAs

Refractory metal ohmic contacts to n-type GaAs have been developed using epitaxial Ge films and pulsed laser annealing. Laser annealing was carried out with a 22 ns pulse from a Q-switched ruby laser operating in the TEM00mode. The specific contact resistivity of the contacts Ta/Ge and Ni/Ge on 2 × 10¹⁷cm^-3dopes GaAs exhibited sharp minima as a function of laser energy density at 1 × 10^-6Ω-cm²and 2 × 10^-6Ω-cm², respectively, which occurred near the melting point of the layered contacts. Auger electron sputter profiles revealed Ge migration into the GaAs surface after laser annealing at sufficient energy density to form ohmic contact. The contacts have applications to high temperature devices and to devices which experience high channel or contact temperatures, such as power FETs and TEDs.     

Influence of annealing on the metal/semiconductor contacts deposited on sulfur-treated <Emphasis Type="Italic">n</Emphasis>-GaAs surface

Comparative analysis of the influence of thermal annealing on Ge/Au/Ni-, Ge/Au/Ti/Au-, and Ge/Au/Ni/Ti/Au-based ohmic contacts and Ti/Au-based Schottky contacts deposited on an n-GaAs (100) surface treated and nontreated in (NH₄)₂S aqueous solution have been performed. Annealing conditions for ohmic contacts are found that lead to a decrease in the specific contact resistance of sulfur-treated samples by a factor of 2.5–15 in comparison with the nontreated samples. Optimal annealing conditions are also determined for sulfur-treated GaAs samples with Schottky contacts, which make it possible to reduce the ideality factor and increase the barrier height and the breakdown voltage with respect to the nontreated samples.     

Ohmic contact using the Si nano-interlayer for undoped-AlGaN/GaN heterostructures

Excellent ohmic characteristics for undoped-AlGaN/GaN heterostructures have been achieved by using a Si nano-interlayer: a 1-nm Si layer has been evaporated followed by Ti/Al/Mo/Au evaporation. A contact transfer resistance of 0.18 Ω-mm and a specific contact resistivity of 1 × 10⁻⁶ Ω-cm² have been achieved along with excellent surface morphology at an optimized annealing temperature (800°C). Both ohmic contact characteristics and surface morphology are significantly better than those obtained without the Si nano-interlayer. Auger depth profiles and temperature-dependent current-voltage characteristics were investigated to understand ohmic formation. It is suggested that titanium silicide formation at the interface during rapid thermal annealing lowers the barrier height and enhances thermionic emission current.     

退火参数对p型GaAs欧姆接触性能的影响

采用磁控溅射的方法在p型GaAs衬底上沉积了Ti/Pt/Au金属薄膜,研究了退火工艺参数(温度和时间)对p-GaAs/Ti/Pt/Au欧姆接触性能的影响。结果表明:p-GaAs上制作的Ti/Pt/Au金属系统能在很短的退火时间(60 s)内形成很好的欧姆接触。过分延长退火时间,并不能改善系统的欧姆接触性能。退火温度在400~450℃时均可得到较好的欧姆接触。当退火温度为420℃,退火时间为120 s时,比接触电阻率达到最低,为1.41×10–6.cm2。     

Pd-Ge contact to n-GaAs with the TiW diffusion barrier

Pd-Ge based ohmic contact to n-GaAs with a TiW diffusion barrier was investigated. Electrical analysis as well as Auger electron spectroscopy and the scanning electron microscopy were used to study the contact after it was subjected to different furnace and rapid thermal annealing and different aging steps. All analyses show that TiW can act as a good barrier metal for the Au/Ge/Pd/n-GaAs contact system. A value of 1.45 × 10⁻⁶ Ω-cm² for the specific contact resistance was obtained for the Au/TiW/Ge/Pd/n-GaAs contact after it was rapid thermally annealed at 425°C for 90 s. It can withstand a thermal aging at 350°C for 40 h with its ρ_c increasing to 2.94 × 10⁻⁶Ω-cm² and for an aging at 410°C for 40 h with its ρ_c increasing to 1.38 × 10⁻⁵ Ω-cm².     

Improved uniformity of contact resistance in GaAs MESFET usingPd/Ge/Ti/Au ohmic contacts

Improved contact resistance uniformity, with a low resistance on high-low doped GaAs MESFET, was demonstrated using a Pd/Ge/Ti/Au ohmic contact. The lowest contact resistivity obtained was 2.8×10^-6 Ω-cm². The average value and standard deviation (ΔRc) of the contact resistance (Rc) were 0.73 and 0.07 Ω-mm, respectively, which were more uniform than those for AuGe/Ni contacts with an average Rc of 0.77 Ω-mm and ΔRc of 0.16 Ω-mm. The improved uniformity was attributed to the uniform penetration of the ohmic junction into the buried high-doped channel layer by solid-state reactions, resulting in the improved uniformity of device performance     

The thermal stability of ohmic contact to n-type InGaAs layer

The thermal stability of ohmic contact to n-type InGaAs layer is investigated. When Ni/Ge/Au is used as the contact metal, the characteristics of the ohmic contact are degraded after thermal treatment. The specific contact resistance of (Ni/Ge/Au)-InGaAs ohmic contact after annealing at 450°C is about 15 times larger than that of as-deposited sample. This is due to the decomposition of InGaAs and the interdiffusion of Ga and Au. A new phase of Au₄ln appears after annealing at 300°C. While in the case of Ti/Pt/Au, Au does not penetrate into the InGaAs layer as revealed by secondary ion mass spectroscopy. The specific contact resistance of (Ti/Pt/Au)-InGaAs ohmic contact after annealing at 450°C is eight times larger than that of as-deposited sample. Therefore, the thermal stability of (Ti/Pt/Au)-InGaAs ohmic contact is better than that of (Ni/Ge/Au)InGaAs ohmic contact.     

Au/Pt/Ti/Ni ohmic contacts to p-ZnTe

Ohmic contacts of Au/Pd/Ti/Ni to p-ZnTe show a minimum specific contact resistance of 10^-6 Ωcm² for a p-type doping level of 3×10¹⁹ cm^-3 and at an annealing temperature of 300°C. The Ni and Ti layers are very effective in improving the electrical properties of these contact     

p-InP与Au-Zn、Ti/Au、Pd/Au和Ti/Pd/Au接触时的界面性质和电学特性

本文用俄歇电子能谱和扫描电子显微镜等方法研究了p-InP与Au-Zn,Ti/Au,Pd/Au和Ti/Pd/Au接触在热处理过程中的互扩散现象.结果表明:Au较Ti、Pd易向p-InP内扩散。研究了 p-InP/Au-Zn体系的合金化条件对比接触电阻(c)的影响。在 450℃热处理12 min或在 350℃热处理30 min,均可得到较低的比接触电阻,这表明界面处的互扩散程度是决定比接触电阻的重要因素。Au-Zn合金在蒸发和热处理的过程中,Zn趋向于凝集在最表面层,而不能充分发挥它在InP中的受主作用,这是该体系的c值偏高的原因之一。     

Au and non-Au based rare earth metal-silicide ohmic contacts to p-InGaAs

The aim of this study is to improve the electrical properties of ohmic contacts that plays crucial role on the performance of optoelectronic devices such as laser diodes (LDs), light emitting diodes (LEDs) and photodetectors (PDs). The conventional (Pd/Ir/Au, Ti/Pt/Au and Pt/Ti/Pt/Au), Au and non-Au based rare earth metal-silicide ohmic contacts (Gd/Si/Ti/Au, Gd/Si/Pt/Au and Gd/Si/Pt) to p-InGaAs were investigated and compared each other. To calculate the specific contact resistivities the Transmission Line Model (TLM) was used. Minimum specific contact resistivity of the conventional contacts was found as 0.111 × 10⁻⁶ Ω cm² for Pt/Ti/Pt/Au contact at 400 °C annealing temperature. For the rare earth metal-silicide ohmic contacts, the non-Au based Gd/Si/Pt has the minimum value of 4.410 × 10⁻⁶ Ω cm² at 300 °C annealing temperature. As a result, non-Au based Gd/Si/Pt contact shows the best ohmic contact behavior at a relatively low annealing temperature among the rare earth metal-silicide ohmic contacts. Although the Au based conventional ohmic contacts are thermally stable and have lower noise in electronic circuits, by using the non-Au based rare earth metal-silicide ohmic contacts may overcome the problems of Au-based ohmic contacts such as higher cost, poorer reliability, weaker thermal stability, and the device degradation due to relatively higher alloying temperatures. To the best of our knowledge, the Au and non-Au based rare earth metal-silicide (GdSi_x) ohmic contacts to p-InGaAs have been proposed for the first time.     

Metallurgical and electrical properties of alloyed Ni/AuGe films on n-type GaAs

An experimental study of the alloying characteristics of a composite thin-film structure which is often used as an ohmic contact to GaAs is presented. A AuGe layer of eutectic composition covered by a thin-film of Ni and deposited on n-type epitaxial GaAs is investigated in order to better understand the relationship between the alloying behavior and the electrical properties of the contact. The barrier energy ?_Bn and the specific contact resistance of the Ni/AuGe/GaAs system is measured for a wide range of alloy temperatures and times. The metallurgical properties of the Ni/AuGe/GaAs system are obtained with Auger electron spectroscopy and scanning electron microscopy. Auger spectroscopy combined with in situ sputter etching is used to determine depth-composition profiles for all constituents of both as-deposited and alloyed Ni/AuGe/GaAs contacts. In samples heat-treated below the AuGe eutectic temperature, Ni is found to move rapidly through the intervening AuGe layer to collect at the GaAs interface, and the effective value of ?_Bn rises to the value characteristic of Ni/GaAs Schottky diodes. For heat-treatment above the AuGe eutectic temperature, ohmic contact behavior is observed, and uniform alloyed contact surfaces are found to result from the presence of Ni at the GaAs interface. Ga outdiffusion and surface accumulation resulting from GaAs dissociation occurs for all alloy temperatures and times. The Ga outdiffusion appears to be characterized by a very low activation energy.     

垂直结构GaN基LED用Ni/Ag反射镜电极

Ni/Ag/Ti/Au金属系反射镜电极广泛用于GaN基垂直结构发光二极管(LED)的传统制造工艺.这种电极需要进行高温长时间整体退火才能获得高质量的欧姆接触,但对电极的反射率和器件性能影响较大.介绍了一种新工艺方法,该方法将电极分解为接触层和反射层,降低反射层经历的退火温度和时间,获得了拥有良好的欧姆接触特性和高反射率的反射镜电极,解决了传统电极光学性能和电学性能相互制约的问题.首先生长极薄的Ni/Ag作为接触层,对接触层进行高温长时间退火后再生长厚层Ag作为反射层,之后再进行一次低温退火.使得对反射起主要作用的反射层免于高温长时间退火,相较于传统Ni/Ag/Ti/Au电极,该方法在获得更优良的欧姆接触的同时,提升了电极的反射率.在氧气氛围下进行500℃接触层退火3 min,400℃整体退火1 min后,电极的比接触电阻率为1.7×l0-3Ω·cm2,同时在450 nm处反射率为93％.