(1) Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100080, China;(2) Department of Mechanical and Materials Engineering, Florida International University, 10555 W Flagler St., Miami, FL 33174, USA
Abstract:
A finite element-based thermoelastic anisotropic stress model for hexagonal silicon carbide polytype is developed for the
calculation of thermal stresses in SiC crystals grown by the physical vapor transport method. The composite structure of the
growing SiC crystal and graphite lid is considered in the model. The thermal expansion match between the crucible lid and
SiC crystal is studied for the first time. The influence of thermal stress on the dislocation density and crystal quality
is discussed.
The project supported by the National Natural Science Foundation of China (10472126) and the Knowledge Innovation Program
of Chinese Academy of Sciences. The English text was polished by Keren Wang