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Formation of Interfacial Layers in LaAlO3/Silicon during Film Deposition
作者姓名:相文峰  吕惠宾  颜雷  何萌  周岳亮  陈正豪
作者单位:Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100080
基金项目:Supported by the National Key Basic Research and Development Programme of China under Grant No 2004CB619004. Many thanks are given to the Digital DNA Laboratories, Semiconductor Production Sector, Motorola Inc, for financial support and to the Institute of Physics, Chinese Academy of Sciences for the help in this project and also partial financial support.
摘    要:

关 键 词:界面层  LaAlO3薄膜  薄膜沉积  薄膜物理学  光电子光谱学  传输电子
收稿时间:2005-09-22
修稿时间:2005-09-22

Formation of Interfacial Layers in LaAlO3/Silicon during Film Deposition
XIANG Wen-Feng, LU Hui-Bin, YAN Lei, HE Meng, ZHOU Yue-Liang, CHEN Zheng-Hao.Formation of Interfacial Layers in LaAlO3/Silicon during Film Deposition[J].Chinese Physics Letters,2006,23(2):467-469.
Authors:XIANG Wen-Feng  LU Hui-Bin  YAN Lei  HE Meng  ZHOU Yue-Liang  CHEN Zheng-Hao
Abstract:We have studied the interracial reactions between amorphous LaAlO3 thin films and Si substrates, using high- resolution transmission electron microscopy and x-ray photoelectron spectroscopy. It has been shown that the interracial layer between LaAlO3 film and Si substrate chemical states show that the ratio of La 4d3/2 to Al 2p is SiLaxAlyOz. The depth distributions of La, Si and Al of the interfacial layer remains unchanged with the depth compared to that of the LaAlO3 film. Moreover, the Si content, in the interracial layer gradually decreases with increasing thickness of the interracial layer. These results strongly suggest that the Al element is not deficient in the interracial layer, as previously believed, and the formation of a SiLaxAlyOz interracial layer is mainly due to the diffusion of Si from the substrate during the LaAlO3 film deposition. With the understanding of the interracial layer formation, ones can control the interface characteristics to ensure the desired performances of devices using high-k oxides as gate dielectrics.
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