| PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法研究 |
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| 引用本文： | 白亚旭,袁正希,何为,朱驭敏,莫芸绮,何波. PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法研究[J]. 印制电路信息, 2011, 0(1): 57-60 |
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| 作者姓名： | 白亚旭 袁正希 何为 朱驭敏 莫芸绮 何波 |
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| 作者单位： | 1. 电子科技大学,四川,成都,610054
2. 元盛电子科技股份有限公司,广东,珠海,519060 |
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| 摘 要： | 文章研究了在PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法。基于埋入电阻在挠性及刚性PCB板中的应用,分别研究了Ni-P合金在无卤的FR-4、无卤的PI两种PCB基材上镀层厚度与试验时间之间的关系,初步得出了在两种不同基材上化学沉积Ni-P合金的规律,该规律对后期的试验具有重要的指导作用。
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| 关 键 词： | 化学镀 Ni-P合金层 PCB 埋嵌电阻 |
The study of process method of directly electroless plating Ni-P on PCB substrate |
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| BAI Ya-xu,YUAN Zheng-xi,HE Wei,ZHU Quan-min,MO Yun-qi,HE Bo. The study of process method of directly electroless plating Ni-P on PCB substrate[J]. Printed Circuit Information, 2011, 0(1): 57-60 |
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| Authors: | BAI Ya-xu YUAN Zheng-xi HE Wei ZHU Quan-min MO Yun-qi HE Bo |
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| Affiliation: | BAI Ya-xu YUAN Zheng-xi HE Wei ZHU Quan-min MO Yun-qi HE Bo |
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| Abstract: | The process method of electroless plating Ni-P alloy layer used to embedded resistor on PCB substrate was studied.The relation of thickness with time for electroless plating Ni-P alloy layer on two different substrates of halogen-free FR-4 and halogen-free PI was also discussed.Some experimental rules about electroless plating Ni-P alloy on two different substrates have been obtained,which have certain guiding role to the following experiments. |
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| Keywords: | PCB |
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