| 集成电路塑封模具错位、偏心问题探讨 |
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| 引用本文： | 魏存晶. 集成电路塑封模具错位、偏心问题探讨[J]. 电子工业专用设备, 2011, 40(1): 24-26,41 |
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| 作者姓名： | 魏存晶 |
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| 作者单位： | 天水华天科技股份有限公司; |
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| 摘 要： | 就集成电路封装过程中塑封模具的错位和偏心问题做探讨,分析导致错位和偏心的各种原因,并就如何使塑封模具的错位、偏心问题对产品的质量影响降到最低提出了具体的改善措施.
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| 关 键 词： | 错位 偏心 精度 塑封模具 公差 模具温度 |
Discussion the problem of IC Plastic Mold's Dislocation and Eccentric |
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| WEI Cunjing. Discussion the problem of IC Plastic Mold's Dislocation and Eccentric[J]. Equipment for Electronic Products Marufacturing, 2011, 40(1): 24-26,41 |
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| Authors: | WEI Cunjing |
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| Affiliation: | WEI Cunjing (Tianshui Hui Tian Technology Co.,Ltd,Tianshui 741000) |
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| Abstract: | Discussion the problem of mold's dislocation and Eccentric in the process of IC package,and eccentricity of the dislocation caused by a variety of reasons,Analysis all kinds of reasions what lead plastic molds of the dislocation and Eccentric,and Measures specific improvements to reduce the problem. |
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| Keywords: | Dislocation Eccentric Accuracy Plastic mold Tolerance Mold temperature |
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