| PCB制造厂如何应对无铅化 |
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| 引用本文： | 谢若彬.PCB制造厂如何应对无铅化[J].印制电路信息,2006(11):23-27. |
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| 作者姓名： | 谢若彬 |
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| 作者单位： | 汕头超声印制板公司,515065 |
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| 摘 要： | 概述了面对无铅化,PCB制造厂应该采取什么措施来应对,无铅化PCB实质就是提高与解决PCB耐热可靠性问题。PCB厂家主要从以下几个方面加于控制解决:板材的选择、制程控制、表面工艺选用、过程质量存在问题分析。
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| 关 键 词： | 无铅化 高分解温度 |
How Should PCB Manufacturers Reply to Lead-free |
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| Xie Ruobin.How Should PCB Manufacturers Reply to Lead-free[J].Printed Circuit Information,2006(11):23-27. |
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| Authors: | Xie Ruobin |
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| Abstract: | his article summarize what actions PCB manufacturers should take for lead-free. The essential of lead- free PCB is to improve and solve reliability problem of the thermal resistance. The methods that PCB manufacturers should use are as follows: selection of copper clad laminates,process control, selection of surface finish, analysis of quality problems. |
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| Keywords: | ICT |
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