BTA系列Cu缓蚀剂的电化学行为

采用交流阻抗法和恒电位阶跃法研究了在硼砂缓冲溶 液（pH9.2）中BTA及其系列衍生物CBTME，CBTBE对Cu电极的缓蚀行为.结果表明：BTA对Cu 的缓蚀作用是由于在Cu表面上生成了Cu/Cu2O/Cu(I)BTA膜，阻滞了Cu的腐蚀，而且缓蚀剂 的浓度越高，生成的Cu/Cu2O/Cu(I)BTA膜越致密，抑制作用越强.含CBTME缓蚀剂的溶液 中，缓蚀效果随缓蚀剂浓度的升高而增强，但同浓度比较时，BTA的缓蚀效果优于CBTME.当 溶液中含有较低浓度CBTBE时，缓蚀剂促进Cu的腐蚀；而当溶液中含有较高浓度CBTBE时，缓 蚀剂才抑制Cu的腐蚀.一定比例的BTA和CBTME复配后对Cu的缓蚀作用有协同效应.以5 mg/L 为缓蚀剂总量，其最佳复配方案为2 mg/L BTA+3 mg/L CBTME.恒电位阶跃法测得的结果与 交流阻抗方法测得的结果相符.

ELECTROCHEMICAL BEHAVIOR OF BTA SERIES INHIBITORS FO R COPPER

The corrosion inhibition of BTA series inhibitors on copper was studied using AC impedance technique and potential step technique. The results indicate that the corrosion of Cu is inhibited due to Cu/Cu 2O/Cu(I)BTA film formed on the surface of Cu. The higher is the inhibitor concentration, the more compact the Cu/Cu 2O/Cu(I)BTA film produces. The corrosion rate of Cu decreases with the increasing concentration of CBTME. However, compared at the same concentration, BTA shows the better inhibiting action than CBTME. The corrosion rate of Cu increased, when Cu electrodes immersed in the solution with low concentration of CBTBE and the corrosion rate of Cu decreased when Cu electrodes immersed in the solution with high concentration of CBTBE. A combination of BTA and CBTME exhibits a synergistic effect, and the optimum ratio with 5 mg/L inhibitor is 2 mg/L BTA+3 mg/L CBTME. The results from potential step technique are in agreement with those from AC impedance technique.