Ultrasonic cavitation test applied to thin metallic films for assessing their adhesion with mercaptosilanes and surface roughness

Evaluating the adhesion of micrometer or nanometer thick coatings is a challenging question which concerns many application fields. This is especially true for thin films deposited on a substrate of elastic modulus higher than that of the film, or for granular coatings, that do not allow the use of common adhesion tests. Usually, applied to characterize the wear resistance of bulk materials or thick coatings, the ultrasonic cavitation test is applied here to evaluate the adhesion strength of gold and copper thin films (~200 nm) that are evaporated on a silicon substrate. The test is shown to be sensitive enough to discriminate the influence of the surface chemistry on the adhesion strength of gold and copper films. Particularly, the role of (3-mercaptopropyl)triethoxysilane as an effective adhesion promotor is demonstrated. Furthermore, the role of surface roughness of the substrate is characterized and discussed in order to get further insights on the way this parameter interferes with the ultrasonic test and determines the adhesive strength of the coating. An estimate of the adhesive strength is given on the basis of the coating delamination kinetics.