| 静电封接中的热应力研究 |
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| 引用本文： | 齐虹 田雷. 静电封接中的热应力研究[J]. 传感器与微系统, 1998, 17(2): 46-47 |
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| 作者姓名： | 齐虹 田雷 |
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| 作者单位： | 东北传感技术研究所 |
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| 摘 要： | 通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。并分析了改善微压传感器性能的技术途径。
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| 关 键 词： | 静电封接 热应力 压力传感器 |
Research on Thermal Stress in the Anodic Bonding |
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| Qi Hong Tian Lei Wang Shanci. Research on Thermal Stress in the Anodic Bonding[J]. Transducer and Microsystem Technology, 1998, 17(2): 46-47 |
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| Authors: | Qi Hong Tian Lei Wang Shanci |
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| Abstract: | The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built. The technical way that can improve the property of the micro-pressure transducer is found. |
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| Keywords: | Anodic bonding Thermal stress Pressure transducer |
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