| BGA焊点的质量控制 |
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| 引用本文： | 鲜飞.BGA焊点的质量控制[J].半导体技术,2005,30(5):49-52. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,武汉,430074 |
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| 摘 要： | BGA是现代组装技术的新概念,它的出现促进SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择.本文结合实际工作中的一些体会和经验,就BGA焊点的接收标准、缺陷表现及可靠性等问题展开论述,特别对有争议的一种缺陷空洞进行较为详细透彻的分析,并提出一些改善BGA焊点质量的工艺改进的建议.
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| 关 键 词： | 表面贴装技术 球栅阵列封装 焊点 X射线 质量控制 |
| 文章编号： | 1003-353X(2005)05-0049-04 |
| 修稿时间： | 2004年8月31日 |
Quality Control of BGA Solder Joint |
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| XIAN Fei.Quality Control of BGA Solder Joint[J].Semiconductor Technology,2005,30(5):49-52. |
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| Authors: | XIAN Fei |
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| Abstract: | BGA is a new concept of contemporary assembly technology. BGA has developed andinnovated the SMT/SMD since it appeared. It is believed that BGA will be the best choice for the IC withdensity, high performance, multiple function and high I/O. The acceptable criterions, solder defects andreliability of BGA solder joint are discussed. Especially a disputed defect behave, void is analyzed. Somesuggestions of improving BGA solder joint quality are also put forward. |
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| Keywords: | SMT BGA solder joint X-ray quality control |
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