| 碳纤维表面单脉冲电镀铜 |
| |
| 引用本文： | 高嵩,樊明杰,王桂萍.碳纤维表面单脉冲电镀铜[J].过程工程学报,2011,11(4):716-720. |
| |
| 作者姓名： | 高嵩 樊明杰 王桂萍 |
| |
| 作者单位： | 沈阳化工大学应用化学学院 沈阳化工大学应用化学学院 |
| |
| 摘 要： | 采用脉冲电镀法在碳纤维表面镀铜，研究了硫酸铜、硫酸、添加剂、施镀时间、电流密度、占空比等因素的影响，确定了合适的镀液成分和电镀工艺. 采用冷热循环法检测镀层与碳纤维的结合力，采用SEM和XRD考察了铜镀层质量. 结果表明，以130 g/L CuSO4×5H2O, g/L H2SO4 50, 30 g/L KNO3及6 mL/L光亮剂为镀液、室温下电流密度82 mA/mm2、占空比40%、施镀时间6 min为电镀条件，可在碳纤维表面得到表面平整细致、结晶度良好的铜镀层. 镀层结合力由原来的270 kPa提高到450 kPa.
|
| 关 键 词： | 碳纤维 单脉冲电镀 铜镀层 增重率 极化曲线 |
| 收稿时间： | 2011-3-21 |
| 修稿时间： | 2011-5-6 |
Carbon Coating on the Fiber Surface with Single Pulse Copper Plating |
| |
| GAO Song,FAN Ming-jie,WANG Gui-ping.Carbon Coating on the Fiber Surface with Single Pulse Copper Plating[J].Chinese Journal of Process Engineering,2011,11(4):716-720. |
| |
| Authors: | GAO Song FAN Ming-jie WANG Gui-ping |
| |
| Affiliation: | Shenyang Institute of Chemical Technology, Shenyang Institute of Chemical Technology, |
| |
| Abstract: | Pulse copper plating was used to coat a copper film on the carbon fiber surface.The effects of CuSO4,H2SO4,additives,electroplating time,current density,and duty cycle on the weight gain rate were investigated.And the solution composition and technical parameters for pulse copper plating were determined.The bonding force between the coating and the carbon fiber was tested by psychro-thermal cycles.The quality of copper coating was examined with SEM and XRD.The composition of electroplating solution was 130 ... |
| |
| Keywords: | carbon fiber single pulse plating copper coating weight gain rate polarization curve |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《过程工程学报》浏览原始摘要信息 |
|
点击此处可从《过程工程学报》下载全文 |
