电子器件γ辐射屏蔽材料设计及性能研究

为获得具有良好伽马射线屏蔽性能的封装材料，采用蒙特卡罗软件（MCNP4C）进行核电机器人电子器件屏蔽材料设计和屏蔽性能模拟，并分别结合小剂量率单向γ射线和大剂量率各向同性Co-60源对所制备的钨/氧化铝复合封装材料的屏蔽性能进行实测。结果表明：试验值与模拟值相近，MCNP4C软件可较好地进行材料设计和屏蔽性能评估。另外，随着钨含量的增大，材料的线性衰减系数和屏蔽率都逐渐增大，半衰减厚度值降低。钨添加量为70%时，材料的综合性能最佳。与商业环氧塑料和氧化铝陶瓷封装材料相比，该复合材料的屏蔽率分别提高了3.79倍和1.13倍，半衰减厚度减小7.04 cm和2.06 cm，可为机器人电子器件提供较好的防护作用。

Design and Characterization of Shielding Materials for Electronics of Nuclear Robot

MCNP4C software was used to design shielding packaging materials and simulate its shielding performance, which is also measured under Co-60 irradiation with both low and high dose rate. It shows that the simulation value is very close to the test results. The linear attenuation coefficient and shielding percent of the composites increase with the increment of tungsten filler loading, while their half value layer drops. The tungsten/alumina composite with 70% tungsten fillers (W/Al-70) shows best overall performance. Compared with that of epoxy resin and alumina packaging materials, the linear attenuation coefficient of W/Al-70 increased 3.79 and 1.13 times, and its half value layer decreased by 7.04 cm and 2.06 cm, respectively.