Analytical solution for the bond strength of externally bonded reinforcement |
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Authors: | Yu-Fei Wu Xin-Sheng Xu Jia-Bin Sun Cheng Jiang |
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Affiliation: | 1. Department of Civil and Architectural Engineering, City University of Hong Kong, Hong Kong;2. State Key Laboratory of Structure Analysis of Industrial Equipment and Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, PR China |
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Abstract: | Interfacial behavior is critical to composite structures and materials reinforced by externally bonded reinforcement. Numerous empirical and semi-empirical models have been developed for evaluating interfacial bond strength. Analytical solutions have been derived for interfaces with infinite bond lengths, but no closed-form solutions have been derived for the bond strength of an interface with an arbitrary bond length. An analytical solution is derived in this work for the strength of a general externally bonded interface. With the analytical method, the interesting snapback phenomenon in simple pull-off tests is theoretically studied, and an invariant is identified as the condition for it to occur. Furthermore, a methodology is provided to evaluate the interfacial material properties based on a given empirical bond model. |
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Keywords: | Adhesion Debonding Interface Analytical modeling |
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