富勒烯薄膜上二维金属渗流系统的电击穿现象

富勒烯（Ｃ_６０和Ｃ_7０）薄膜可外延生长在新鲜解理的云母（００１）平面．以这富勒烯层为衬底，将金属薄膜蒸镀在其上，便构成典型的二维渗流系统．蒸镀过程在超高真空系统中完成，并同时对样品的电阻特性进行原位测量．随着外加电压的增加，观测到样品电阻可逆的变化现象与不可逆的电击穿现象．在渗流阈值附近，击穿电流Ｉ_b与样品电阻Ｒ之间表现出幂指数关系：Ｉ_b～Ｒ^－α．指数α比前人实验给出的数值和Ｎｏｄｅｓ-Ｌｉｎｋｓ-Ｂｌｏｂｓ模型的预期值小得多，而且随着衬底材料的不同而不同．基于金属和富勒烯界面相互作用的理论，对这些现象作了解释 关键词：

ELECTRIC BREAKDOWN OF PERCOLATION SYSTEM OF 2D METAL FILM ON FULLERENE UNDERLAYER

Fullerene （Ｃ_６０ and Ｃ_7０）films were epitaxially grown on fresh (001) mica fcc closely-packed plane parallel to the substrate surface. Metal-overlayers were deposited onto these fullerene films in an ultra-hight-vacuum(UHV) chamber and in situ resistance measurements were performed. With increasing current, we observed reversible resistance variation and irreversible breakdown. Nera the percolation threshold we find power law scaling behavior Ｉ_b～Ｒ^－α,where Ｉ_b is breakdown current and R the sample resistance. The exponent α is much smaller than the values given by previous experiments and prediction of conventional Ｎｏｄｅｓ-Ｌｉｎｋｓ-Ｂｌｏｂｓ(NLB) model. Possible explanation of these phenomena based on metal-fullerene interfacial interactions is discussed.