| 中国LED封装技术与国外的差异 |
| |
| 引用本文： | 李漫铁.中国LED封装技术与国外的差异[J].现代显示,2009,20(10):59-62. |
| |
| 作者姓名： | 李漫铁 |
| |
| 作者单位： | 深圳雷曼光电科技有限公司,广东,深圳,518055 |
| |
| 摘 要： | 本文从封装设备、LED芯片、辅助封装材料、封装设计、封装工艺、LED器件性能等方面描述了当今中国LED封装技术与国外技术的差异，既肯定了中国LED封装技术长足的进步，也找出了与国外技术之间的差距。
|
| 关 键 词： | 发光二极管 LED封装:封装设备 |
| 收稿时间： | 2009/9/21 |
LED Encapsulation Technology Discrepancy between Abroad and China |
| |
| LI Man-tie.LED Encapsulation Technology Discrepancy between Abroad and China[J].Advanced Display,2009,20(10):59-62. |
| |
| Authors: | LI Man-tie |
| |
| Affiliation: | LI Man-tie (Ledman Optoelectronic Co. Ltd., Shenzhen Guangdong 518055, China) |
| |
| Abstract: | This article describes the technology difference between China and other countries from LED packaging equipment，LED chip，LED packaging material，LED packaging design，LED packaging technics，LED component characteristic． It shows that the LED packaging technology in China has greatly improved and there are also some gaps in some areas com pared w ith overseas advanced technology． |
| |
| Keywords: | LED LED packaging packaging equipment |
| 本文献已被 维普 万方数据 等数据库收录！ |
