| SOD-323型双端器件焊点防开裂技术研究 |
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| 引用本文： | 姜冬怡,张纯亚,黄吉. SOD-323型双端器件焊点防开裂技术研究[J]. 微电子学, 2022, 52(5): 843-847 |
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| 作者姓名： | 姜冬怡 张纯亚 黄吉 |
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| 作者单位： | 中国电子科技集团公司 第二十四研究所, 重庆 400060 |
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| 基金项目： | 模拟集成电路国家级重点实验室基金资助项目(6142802040805)； |
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| 摘 要： | 针对某电源模块产品中的SOD-323型双端器件在环境试验中出现焊点开裂的失效问题，对其焊点开裂机理进行研究。结合三防漆的温度特性，对其进行仿真和多种条件下的应力试验摸底。根据试验结果，提出了针对SOD-323型双端器件焊点开裂的应用解决方案。
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| 关 键 词： | 电源模块 SOD-323 双端器件 焊点开裂 可靠性 |
| 收稿时间： | 2022-09-05 |
Research on Preventing Solder Joint Cracking Technology of SOD-323 Device |
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| JIANG Dongyi,ZHANG Chuny,HUANG Ji. Research on Preventing Solder Joint Cracking Technology of SOD-323 Device[J]. Microelectronics, 2022, 52(5): 843-847 |
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| Authors: | JIANG Dongyi ZHANG Chuny HUANG Ji |
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| Affiliation: | The 24th Research Institute of China Electronics Technology Group Corporation, Chongqing 400060, P. R. China |
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| Abstract: | For the problem of solder joint cracking in the environmental test of the SOD-323 double-end device in a power supply product, the mechanism of solder joint cracking was studied. Combining with the temperature characteristics of Three-proofing Lacquer, simulation and stress tests under various conditions were carried out. According to the test results, the reliability application solution for the SOD-323 double-end device is proposed. |
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| Keywords: | power supply module SOD-323 double-end device solder point cracking reliability |
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