| 多层印制电路板网印内埋电阻技术研究 |
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| 引用本文： | 金轶,何为,苏新虹,黄云钟,朱兴华. 多层印制电路板网印内埋电阻技术研究[J]. 电子元件与材料, 2011, 30(12): 38-41 |
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| 作者姓名： | 金轶 何为 苏新虹 黄云钟 朱兴华 |
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| 作者单位： | 1. 电子科技大学微电子与固体电子学院,四川成都,610054
2. 珠海方正印刷电路板发展有限公司,广东珠海,519175 |
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| 基金项目： | 2010广东省重大专项资助项目 |
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| 摘 要： | 利用网印导电碳浆的方法制作电阻,通过层压工艺实现电阻在多层印制电路板中的内埋.研究了导电碳浆的固化温度及固化时间与电阻值的关系,分析了导电碳浆固化程度及棕化后烘板对层压工艺可靠性的影响,测试了高温高湿与冷热冲击对内埋电阻阻值稳定性的影响.结果表明:导电碳浆固化条件选择固化温度170℃,固化时间4h,以及棕化后105℃烘...
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| 关 键 词： | 网印内埋电阻 固化温度 固化时间 |
Study on embedded resistor in multilayer PCB with screen printing process |
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| JIN Yi,HE Wei,SU Xinhong,HUANG Yunzhong,ZHU Xinghua. Study on embedded resistor in multilayer PCB with screen printing process[J]. Electronic Components & Materials, 2011, 30(12): 38-41 |
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| Authors: | JIN Yi HE Wei SU Xinhong HUANG Yunzhong ZHU Xinghua |
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| Affiliation: | 1.School of Microelectronics and Solid-State Electronics,University of Electronic Science and Technology of China,Chengdu 610054,China;2.Zhuhai Founder PCB Development Co.,Ltd,Zhuhai 519175,Guangdong Province,China) |
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| Abstract: | Resistors were produced by screen printing conductive carbon paste,and embedded in multilayer PCB by lamination technique.The relations between curing temperature and curing time of conductive carbon paste and resistance were studied.Effects of conductive carbon paste curing degree and roasting after brown oxide on the reliability of lamination process were analyzed.The stability of embedded resistor was tested by the humidity test and the thermal shock test.The results show that conductive carbon paste curing at 170 ℃ for 4 h and baking at 105 ℃ for 1 h after brown oxide process is necessary condition to avoid delamination between the embedded resistor and the bond ply.The embedded resistors exhibit nice humidity resistance and thermal-shock resistance. |
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| Keywords: | embedded screen printing resistor curing temperature curing time |
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