一种毫米波封装的设计与优化方法

随着5G时代的到来,毫米波封装市场正在持续增长,毫米波模块的工作频率越来越高,封装也面临着越来越严格的要求。性能良好的毫米波封装应该在广阔的频段上都要有良好的射频性能。而现有封装设计中的策略是基于已有的设计经验和2D/2.5D建模的工具,其精确度已经没法适应毫米波频段的要求。在毫米波产品的研发中,需要在设计阶段就对已有设计在3D建模软件HFSS中进行仿真验证和精密优化,实现仿真与设计的并行。描述了一种FC-LGA(倒装栅格阵列)封装的设计与优化方法,通过对通道模型的仔细优化,在0~30 GHz的宽频带上都实现了良好的反射、插损特性,并在工艺允许的范围内尽量优化了串扰。

A Design and Optimization Method of Millimeter Wave Package

As the 5G era comes,the millimeter-wave package market is growing continuously.The product working frequency becomes higher,and it's also more strict for designing and packaging.The high performance millimeter-wave package should have good RF performance in a wide frequency band.The existing packaging design strategies are based on the old design rules and 2D/2.5D modeling tools,and its accuracy can't meet the requirements of millimeter-wave product development.In the development of millimeter wave products,it is necessary to carry out simulations and optimizations in 3D software HFSS at the design stage,as to realize the synchronization of simulation and design.This paper described a design and optimization method of FC-LGA(flip chip-land grid array)package.By carefully optimizing the channel model,it achieved good reflection and insertion loss characteristics in the 0-30 GHz frequency range,and optimized the crosstalk as far as possible in the process.