纳米化学复合镀的开发及在PCB制造中的应用研究

化学镀表面处理技术使用范围很广,镀层均匀、装饰性好;在防护性能方面,能提高产品的耐蚀性和使用寿命;在功能性方面,能提高加工件的耐磨性和导电性、润滑性能等特殊功能,因而成为表面处理技术的一个重要部分。钠米化学复合镀是在化学镀液中加入纳米粒子,使其与化学镀层共沉积的工艺技术。文章主要研究在化学镀Ni-P中加入纳米颗粒,在基体表面沉积具有镀厚均匀、耐磨、耐腐蚀、可焊的纳米复合镀层,阐明镀液组成和工艺条件对沉积速率、镀液稳定性、镀层与基体的结合力的影响,获得钠米化学复合镀技术的工艺参数,并对纳米复合镀层的性能进行了研究。

Nanoparticles and Ni-P electroless deposition in PCB manufacture

The electroless plating surface treatment technology application scope is very broad.Its coating is even and the cosmetic is good.From the protection performance aspect,it can enhance the product corrosion resistance and the service life;From the functionality aspect,it can enhance the wear-resisting electrical conductivity,the lubricity and so on,thus becomes the important surface treatment technology.Nanoparticles and metal electroless deposition is joint nanoparticles in the electroless plating solution,becauses it is the processing technology deposits with chemistry coating.This article main researches joint nanoparticles in the Ni-P alloy,the compound coating in the substrate surface deposition whose plating is thick even,wear-resisting,anti-corrosive,with good solderability.This article also explains the electroless plating solution composition and the technological parameters including the depositing rate,plating solution stability,coating and the substrate binding force influence.It obtains a nanoparticles and Ni-P compound depositing technical parameters,and researches the nanoparticles and Ni-P compound coating performance.