抛光垫磨损非均匀性研究

抛光垫是化学机械抛光的重要组成部分,其磨损的非均匀性对被加工工件面型精度和抛光垫修整有重要影响。基于直线摆动式抛光方式,研究了抛光过程中抛光垫与工件的相对运动,建立了抛光垫磨损模型,分析了抛光工艺参数对抛光垫磨损及均匀性的影响。研究结果表明,工件与抛光垫的转速比为1.11,正弦偏心直线摆动形式,摆动幅度系数为2,摆动频率系数在0.1~0.2之间,抛光垫表面磨损更均匀,并根据抛光垫表面磨损特性优化了抛光垫形状。优化的抛光垫具有更好的面型保持性,延长了修整间隔,为抛光工艺设计提供理论指导。

Research on wear nonuniformity of polishing pad

The polishing pad plays an essential role in chemical mechanical polishing (CMP), and its wear nonuniformity has an important influence on contour accuracy of polished workpiece and pad conditioning.Based on a straight-line swing plane polishing, the relative movement between the pad and the workpiece is investigated, and the model of pad wear is established.The effect of polishing parameters on pad wear and nonuniformity is studied.As the results indicated, when the rotate speed ratio between the workpiece and the pad is 1.11, the form of straight-line swing is sine, the swing scope coefficient is 2, and the swing frequency coefficient is 0.1~0.2, the uniformity of pad wear is better.According to the pad wear properties, the shape of polishing pad is optimized.A better hold of surface contour is obtained, which prolongs the time interval of conditioning and provides theoretical guidance for the design of polishing process.