| CALCULATION OF THREE－DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY |
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| 作者姓名： | G.Z. Wang C.Q.Wang and Y.Y Qian |
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| 作者单位： | National Key Laboratory of Advanced Welding Production Technology，Harbin Institute of Technology，Harbin 150001，China |
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| 摘 要： | ＣＡＬＣＵＬＡＴＩＯＮＯＦＴＨＲＥＥ－ＤＩＭＥＮＳＩＯＮＡＬＳＯＬＤＥＲＪＯＩＮＴＦＯＲＭＡＴＩＯＮＩＮＭＩＣＲＯＥＬＥＣＴＲＯＮＩＣＳＵＲＦＡＣＥＭＯＵＮＴＴＥＣＨＮＯＬＯＧＹ￥Ｇ．Ｚ．Ｗａｎｇ，Ｃ．Ｑ．ＷａｎｇａｎｄＹ．ＹＱｉａｎ（Ｎａｔｉｏｎａ...
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| 收稿时间： | 1996-08-25 |
| 修稿时间： | 1996-08-25 |
CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY |
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| G.Z. Wang,C.Q.Wang and Y.Y Qian.CALCULATION OF THREE-DIMENSIONAL SOLDER JOINT FORMATION IN MICROELECTRONIC SURFACE MOUNT TECHNOLOGY[J].Acta Metallurgica Sinica(English Letters),1996,9(4):240-246. |
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| Authors: | GZ Wang CQWang and YY Qian |
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| Abstract: | A finite element analysis for calculating three-dimensional(3-D) solder joint shape between chip component and substrate pad was carried out, and the effects of solder volume and pad extension beyond the edge of component on solder joint shapes were investigated. The resonable design ranges of solder volume and pad extension have been put forward. |
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| Keywords: | surface mount technology chip component solder joint shape |
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