Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn-Ag-Ti active solder |
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| Authors: | L.C. TSAO S.Y. CHANG Y.C. YU |
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| Affiliation: | 1. Department of Materials Engineering, National Pingtung University of Science & Technology, Neipu, Pingtung 91201, China;2. Department of Mechanical Engineering, National Yunlin University of Science & Technology, Touliu, Yunlin 64002, China |
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| Abstract: | Al0.3CrFe1.5MnNi0.5 high entropy alloys (HEA) have special properties. The microstructures and shear strengths of HEA/HEA and HEA/6061-Al joints were determined after direct active soldering (DAS) in air with Sn3.5Ag4Ti active filler at 250 °C for 60 s. The results showed that the diffusion of all alloying elements of the HEA alloy was sluggish in the joint area. The joint strengths of HEA/HEA and HEA/6061-Al samples, as analyzed by shear testing, were (14.20±1.63) and (15.70±1.35) MPa, respectively. Observation of the fracture section showed that the HEA/6061-Al soldered joints presented obvious semi-brittle fracture characteristics. |
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| Keywords: | high entropy alloy Sn3.5Ag4Ti active filler direct active soldering |
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