The heat transfer characteristics of liquid cooling heat sink with micro pin fins |
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| Affiliation: | 1. Department of Mechanical Engineering, Taipei City University of Science and Technology, Peitou, Taipei 112, Taiwan;2. Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang 110016, Liaoning, China;3. Department of Mechanical Engineering/Battery Research Center of Green Energy, Ming Chi University of Technology, Taishan, New Taipei City 243, Taiwan;4. Department of Mechanical Engineering, Chang Gung University, Gueshan, Taoyuan 333, Taiwan;1. Department of Industrial Design, Xi''an Jiaotong-Liverpool University, Suzhou, China;2. Department of Civil Engineering, Xi''an Jiaotong-Liverpool University, Suzhou, China;3. Shunqi Zhang, School of Mechatronic Engineering and Automation, Shanghai University, Shanghai, China |
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| Abstract: | This paper numerically and experimentally investigated the liquid cooling efficiency of heat sinks containing micro pin fins. Aluminum prototypes of heat sink with micro pin fin were fabricated to explore the flow and thermal performance. The main geometry parameters included the diameter of micro pin fin and porosity of fin array. The effects of the geometrical parameters and pressure drop on the heat transfer performance of the heat sink were studied. In the experiments, the heat flux from base of heat sink was set as 300 kW/m2. The pressure drop between the inlet and the outlet of heat sink was set < 3000 Pa. Numerical simulations with similar flow and thermal conditions were conducted to estimate the flow patterns, the effective thermal resistance. It was found that the effective thermal resistance would reach an optimum value for various pressure drops. It was also noted that the effective thermal resistance was not sensitive to porosity for sparsely packed pin fins. |
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