| LED芯片封装缺陷检测方法研究 |
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| 引用本文： | 蔡有海,文玉梅,李平,余大海,伍会娟.LED芯片封装缺陷检测方法研究[J].传感技术学报,2009,22(7). |
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| 作者姓名： | 蔡有海 文玉梅 李平 余大海 伍会娟 |
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| 作者单位： | 重庆大学光电工程学院光电技术及系统教育部重点实验室,重庆,400044 |
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| 基金项目： | 国家自然科学基金，重庆市科技攻关重大项目 |
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| 摘 要： | 引脚式LED芯片封装工艺中封装缺陷不可避免.基于p-n结的光生伏特效应和电子隧穿效应,分析了一种封装缺陷对LED支架回路光电流的影响.利用电磁感应定律对LED支架回路光电流进行非接触检测,得到LED芯片功能状态及芯片电极与引线支架问的电气连接情况,并对检测精度的影响因素进行分析.实验表明,该方法具有高检测信噪比,能够实现对封装过程LED芯片功能状态及封装缺陷的检测.计算结果与实验结果较好吻合.
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| 关 键 词： | LED芯片 封装缺陷检测 p-n结光生伏特效应 电子隧穿效应 非金属膜层 |
Research on Packaging Fault Detection for LED Chips |
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| CAI Youhai,WEN Yumei,LI Ping,YU Dahai,WU Huijuan.Research on Packaging Fault Detection for LED Chips[J].Journal of Transduction Technology,2009,22(7). |
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| Authors: | CAI Youhai WEN Yumei LI Ping YU Dahai WU Huijuan |
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| Affiliation: | CAI Youhai,WEN Yumei,LI Ping,YU Dahai,WU Huijuan College of Opto-Electronic Engineering,The Key Laboratory for Opto-Electronic Technology & Systems of Ministry of Education,Chongqing University,Chongqing 400044,China |
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| Abstract: | During the packaging process of lead frame light-emitting diode(LED),packaging fault can not be avoided.Theoretical analysis shows that the packaging fault influences the loop photocurrent in LED lead frame,and the analysis is based on the photovoltaic effect of p-n junction and electron tunneling effect.The loop photocurrent is non-contact measured by law of electromagnetic induction,and the states of LED chip and its electric connection with the frame are detected.The influencing factors of the detection ... |
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| Keywords: | LED chips packaging fault detection photovoltaic effect of p-n junction electron tunneling effect nonmetal films |
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