| 银及金合金基体镀金和镀铑的工艺探讨 |
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| 引用本文： | 肖耀坤,许耀生.银及金合金基体镀金和镀铑的工艺探讨[J].电镀与涂饰,1997,16(3):12-15. |
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| 作者姓名： | 肖耀坤 许耀生 |
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| 作者单位： | 电子工业部第七研究所电化厂!510310 |
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| 摘 要： | 提出银件镀金，镀铑工艺流程和配方，介绍了金合金镀金工艺，镀前处理，操作要点、强调中间镀层能有效防止银基体的腐蚀和镀件变色。
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| 关 键 词： | 镀金 镀铑 镀层 镀合金 金银合金 电镀 |
Precious Metal Electroplating on Ag and An Alloy Substrate |
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| XlAO Yaokun, XU Yaosheng, WENG Huiyan.Precious Metal Electroplating on Ag and An Alloy Substrate[J].Electroplating & Finishing,1997,16(3):12-15. |
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| Authors: | XlAO Yaokun XU Yaosheng WENG Huiyan |
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| Affiliation: | XlAO Yaokun; XU Yaosheng; WENG Huiyan |
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| Abstract: | Au, Rh electroplating processes for silver substrate were presented. Au electroplating on gold alloy parts was described as well as pretreatment and operation hints. Intermediate deposits which could prevent precious metal deposit from discoloring and silver substrate from etching were emphasized. |
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| Keywords: | Au electroplating Rh electroplating intermediate deposit |
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