| 热量敏感的众核芯片多播并行测试方法 |
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| 引用本文： | 方芳,韩银和,李晓维. 热量敏感的众核芯片多播并行测试方法[J]. 计算机辅助设计与图形学学报, 2010, 22(5) |
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| 作者姓名： | 方芳 韩银和 李晓维 |
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| 作者单位： | 1. 合肥工业大学管理学院,合肥,230009;合肥工业大学计算机与信息学院,合肥,230009;中国科学院计算机系统结构重点实验室,北京,100190
2. 中国科学院计算机系统结构重点实验室,北京,100190 |
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| 基金项目： | 国家自然科学基金重大研究计划(90718037);;国家“八六三”高技术研究发展计划(2007AA01Z113);;博士点基金新教师项目(200803591033);;中国科学院计算机系统结构重点实验室开放课题(ICT-ARCH200704) |
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| 摘 要： | 为了解决芯片测试过程中功耗密度大造成的局部过热(简称"热斑")问题,提出一种热量敏感的多播并行测试方法.对众核芯片采用多播并行测试时面临的"热斑"问题进行分析,提出一种无"热斑"的多播测试路径生成算法;在温度容限内对生成的多条单类同构芯核多播测试路径进行并行优化,形成无"热斑"的快速并行测试方案,同时缩短了测试时间.实验结果表明,采用文中方法能够有效地避免多播并行测试时的"热斑",并使测试时间缩短近45%.
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| 关 键 词： | 众核芯片 并行测试 多播技术 热斑 |
A Thermal-Aware Parallel Multicast Testing Method Based on Many-Core Chips |
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| Fang Fang,Han Yinhe,Li Xiaowei. A Thermal-Aware Parallel Multicast Testing Method Based on Many-Core Chips[J]. Journal of Computer-Aided Design & Computer Graphics, 2010, 22(5) |
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| Authors: | Fang Fang Han Yinhe Li Xiaowei |
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| Affiliation: | Management School of Hefei University of Technology/a>;Hefei 230009;School of Computer and Information of Hefei University of Technology/a>;Hefei 230009;Key Laboratory of Computer System and Architecture/a>;Institute of Computing Technology/a>;Chinese Academy of Sciences/a>;Beijing 100190 |
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| Abstract: | The local overheating problem,which is referred to as hotspot,has become an important problem for parallel testing of many-core chips.This paper proposes a thermal-aware parallel multicast testing method to avoid hotspots.Firstly,we analyze the hotspots caused by parallel multicast test of many-core chips.Based on the above analysis,a heuristic algorithm is proposed to avoid hotspots during the generation of one multicast test access path.Finally,for further reducing the test time,we give an optimal solutio... |
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| Keywords: | many-core chip parallel testing multicast hotspot |
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